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Patent applications and USPTO patent grants for Loh; Hai Guan.The latest application filed is for "semiconductor package".
Patent | Date |
---|---|
Semiconductor package and method of assembling the same Grant 7,851,261 - Chai , et al. December 14, 2 | 2010-12-14 |
Semiconductor Package App 20090310322 - Koh; Liang Kng Ian ;   et al. | 2009-12-17 |
Apparatus and method for producing an article by means of a molding technique Grant 7,481,641 - Fuergut , et al. January 27, 2 | 2009-01-27 |
Semiconductor Package and Method of Assembling the Same App 20070287228 - Chai; Fui Jin ;   et al. | 2007-12-13 |
Apparatus And Method For Producing An Article By Means Of A Molding Technique App 20070178185 - Fuergut; Edward ;   et al. | 2007-08-02 |
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