Lobsinger; Joshua David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lobsinger; Joshua David.The latest application filed is for "semiconductor package having filler metal of gold/silver/copper alloy".
- Lobsinger; Joshua David - San Diego CA
| Patent | Date |
|---|---|
| Semiconductor package having filler metal of gold/silver/copper alloy Grant 6,900,525 - Lobsinger , et al. May 31, 2 | 2005-05-31 |
| Semiconductor package having filler metal of gold/silver/copper alloy App 20040232529 - Lobsinger, Joshua David ; et al. | 2004-11-25 |
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