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Patent applications and USPTO patent grants for Lo; Wen-Lun.The latest application filed is for "packaging substrate, method for manufacturing same, and chip packaging structure having same".
Patent | Date |
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Coreless package structure and method for manufacturing same Grant 9,362,248 - Ha Woo , et al. June 7, 2 | 2016-06-07 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same App 20150380391 - HA WOO; Yong ;   et al. | 2015-12-31 |
Packaging substrate, method for manufacturing same, and chip packaging structure having same Grant 9,173,298 - Ha Woo , et al. October 27, 2 | 2015-10-27 |
Packaging substrate, method for manufacturing same, and chip packaging body having same Grant 9,165,790 - Ha Woo , et al. October 20, 2 | 2015-10-20 |
Coreless Package Structure And Method For Manufacturing Same App 20150014849 - HA WOO; YONG ;   et al. | 2015-01-15 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same App 20140185259 - HA WOO; YONG ;   et al. | 2014-07-03 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same App 20140117553 - HA WOO; YONG ;   et al. | 2014-05-01 |
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