Lo; Ting-Ya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lo; Ting-Ya.The latest application filed is for "capping layer overlying dielectric structure to increase reliability".

Company Profile

1.3.10

Lo; Ting-Ya - Hsin-Chu TW
LO; Ting-Ya - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capping Layer Overlying Dielectric Structure To Increase Reliability App 20220293512 - Lo; Ting-Ya ; et al.	2022-09-15
Semiconductor Interconnection Structure And Methods Of Forming The Same App 20220285268 - LEE; Shao-Kuan ; et al.	2022-09-08
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability App 20220254678 - Huang; Hsin-Yen ; et al.	2022-08-11
Semiconductor Devices With Air Gate Spacer And Air Gate Cap App 20220238693 - Chuang; Cheng-Chi ; et al.	2022-07-28
Semiconductor Device Structure And Methods Of Forming The Same App 20220223465 - HUANG; Hsin-Yen ; et al.	2022-07-14
Capping layer overlying dielectric structure to increase reliability Grant 11,355,430 - Lo , et al. June 7, 2	2022-06-07
Thermal Interconnect Structure For Thermal Management Of Electrical Interconnect Structure App 20220157690 - Lee; Shao-Kuan ; et al.	2022-05-19
Interconnect Structure App 20220157711 - Lee; Shao-Kuan ; et al.	2022-05-19
Dielectric capping structure overlying a conductive structure to increase stability Grant 11,322,395 - Huang , et al. May 3, 2	2022-05-03
Semiconductor devices with air gate spacer and air gate cap Grant 11,302,798 - Chuang , et al. April 12, 2	2022-04-12
Semiconductor Devices with Air Gate Spacer and Air Gate Cap App 20210376111 - Chuang; Cheng-Chi ; et al.	2021-12-02
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability App 20210193505 - Huang; Hsin-Yen ; et al.	2021-06-24
Capping Layer Overlying Dielectric Structure To Increase Reliability App 20210193566 - Lo; Ting-Ya ; et al.	2021-06-24

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