Lo; Randy H. Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lo; Randy H. Y..The latest application filed is for "method of fabricating a thin and fine ball-grid array package with embedded heat spreader".

Company Profile

0.20.13

Lo; Randy H. Y. - Taipei TW
Lo; Randy H. Y. - Tan-Tzu Hsiang TW
Lo; Randy H. Y. - Taichung Hsien TW
Lo; Randy H. Y. - Campbell CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 7,045,395 - Lo , et al. May 16, 2	2006-05-16
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,951,776 - Lo , et al. October 4, 2	2005-10-04
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,949,413 - Lo , et al. September 27, 2	2005-09-27
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,949,414 - Lo , et al. September 27, 2	2005-09-27
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,933,175 - Lo , et al. August 23, 2	2005-08-23
Flash-preventing semiconductor package Grant 6,864,564 - Ke , et al. March 8, 2	2005-03-08
Method of packaging multi chip module Grant 6,798,054 - Lo , et al. September 28, 2	2004-09-28
Circuit probing contact pad formed on a bond pad in a flip chip package Grant 6,753,609 - Chien , et al. June 22, 2	2004-06-22
Structure of a multi chip module having stacked chips Grant 6,650,009 - Her , et al. November 18, 2	2003-11-18
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030178721 - Lo, Randy H.Y. ; et al.	2003-09-25
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030162405 - Lo, Randy H.Y. ; et al.	2003-08-28
Stacked multi-chip package structure with on-chip integration of passive component Grant 6,611,434 - Lo , et al. August 26, 2	2003-08-26
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030155648 - Lo, Randy H.Y. ; et al.	2003-08-21
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030155647 - Lo, Randy H. Y. ; et al.	2003-08-21
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030134437 - Lo, Randy H. Y. ; et al.	2003-07-17
Stacked-die package structure Grant 6,593,662 - Pu , et al. July 15, 2	2003-07-15
Multiple stacked-chip packaging structure Grant 6,555,902 - Lo , et al. April 29, 2	2003-04-29
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,541,310 - Lo , et al. April 1, 2	2003-04-01
Ball grid array semiconductor package with exposed base layer Grant 6,528,722 - Huang , et al. March 4, 2	2003-03-04
Flip chip type quad flat non-leaded package Grant 6,507,120 - Lo , et al. January 14, 2	2003-01-14
Multi-chip packaging structure Grant 6,507,098 - Lo , et al. January 14, 2	2003-01-14
Structure of a multi chip module having stacked chips App 20020180023 - Her, Tzong-Dar ; et al.	2002-12-05
Semiconductor package and method for fabricating the same App 20020163066 - Ke, Chun-Chi ; et al.	2002-11-07
Package structure stacking chips on front surface and back surface of substrate Grant 6,414,384 - Lo , et al. July 2, 2	2002-07-02
Package Structure Stacking Chips On Front Surface And Back Surface Of Substrate App 20020079567 - Lo, Randy H.Y. ; et al.	2002-06-27
Flip chip type quad flat non-leaded package App 20020079592 - Lo, Randy H.Y. ; et al.	2002-06-27
Ball Grid Array Semiconductor Package With Exposed Base Layer App 20020046854 - HUANG, CHIEN PING ; et al.	2002-04-25
Circuit Probing Contact Pad Formed On A Bond Pad In A Flip Chip Package App 20020031880 - Chien, Feng-Lung ; et al.	2002-03-14
Multiple stacked-chip packaging structure App 20020014689 - Lo, Randy H.Y. ; et al.	2002-02-07
Method of wire bonding for small clearance App 20010042776 - Lo, Randy H. Y. ; et al.	2001-11-22
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same Grant 6,282,094 - Lo , et al. August 28, 2	2001-08-28
Wafer level packaging process of semiconductor Grant 6,242,283 - Lo , et al. June 5, 2	2001-06-05
Structure for attaching a lead frame to a heat spreader/heat slug structure Grant 5,691,567 - Lo , et al. November 25, 1	1997-11-25

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