Lo; Kuang-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lo; Kuang-Lin.The latest application filed is for "substrate structure having a solder mask and a process for making the same".

Company Profile

0.9.13

Lo; Kuang-Lin - Kaoshiung TW
Lo; Kuang-Lin - Kaohsiung TW
Lo; Kuang-Lin - Kaohsiung County TW
Lo; Kuang-Lin - Kaoshiung Hsien TW
Lo; Kuang-Lin - Kaohsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-row substrate strip and method for manufacturing the same Grant 7,511,366 - Huang , et al. March 31, 2	2009-03-31
Substrate structure having a solder mask and a process for making the same Grant 7,473,629 - Tai , et al. January 6, 2	2009-01-06
Fabrication method for printed circuit board Grant 7,384,566 - Chen , et al. June 10, 2	2008-06-10
Substrate structure having a solder mask and a process for making the same App 20070243704 - Tai; Wei-Chang ; et al.	2007-10-18
Method For Fabricating Identification Code App 20070220742 - Lo; Kuang-Lin ; et al.	2007-09-27
Chip Package Method App 20070087480 - TAO; Su ; et al.	2007-04-19
Molding apparatus with a molding flowability sensor for packaging semiconductor device Grant 7,144,239 - Wang , et al. December 5, 2	2006-12-05
Multi-row substrate strip and method for manufacturing the same App 20060091533 - Huang; Yao-Ting ; et al.	2006-05-04
Substrate testing apparatus with full contact configuration App 20060091384 - Ho; Chung-Hsiung ; et al.	2006-05-04
Printed circuit boards and methods for fabricating the same App 20050282314 - Lo, Kuang-Lin ; et al.	2005-12-22
Fabrication method for printed circuit board App 20050246892 - Chen, Hung-Nan ; et al.	2005-11-10
Packaging mold with electrostatic discharge protection Grant 6,942,478 - Lee , et al. September 13, 2	2005-09-13
Molding appartus with a molding flowability sensor for packaging semiconductor device App 20050089594 - Wang, Wei-Chih ; et al.	2005-04-28
Molding apparatus with a pressure sensor for packaging semiconductor device App 20050089593 - Wang, Wei-Chih ; et al.	2005-04-28
Packaging substrate with electrostatic discharge protection Grant 6,777,793 - Lee , et al. August 17, 2	2004-08-17
[chip Package Structure And Method For Manufacturing The Same] App 20040124515 - TAO, SU ; et al.	2004-07-01
Method of manufacturing a semiconductor package with a lead frame having a support structure Grant 6,627,481 - Lee , et al. September 30, 2	2003-09-30
Packaging substrate with electrostatic discharge protection App 20030090861 - Lee, Meng-Tsang ; et al.	2003-05-15
Method Of Manufacturing A Semiconductor Package With A Lead Frame Having A Support Structure App 20030092216 - Lee, Meng-Tsang ; et al.	2003-05-15
Packaging mold with electrostatic discharge protection App 20030072832 - Lee, Meng-Tsang ; et al.	2003-04-17
Stacked chip assembly utilizing a lead frame Grant 6,118,176 - Tao , et al. September 12, 2	2000-09-12
Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance Grant 6,093,960 - Tao , et al. July 25, 2	2000-07-25

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