Lo; Hsing-Lun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lo; Hsing-Lun.The latest application filed is for "packaging substrate with embedded chip and buried heatsink".
- Lo; Hsing-Lun - Taipei TW
- Lo; Hsing-Lun - Taipei City TW
| Patent | Date |
|---|---|
| Lot traceable printed circuit board Grant 7,576,287 - Lo , et al. August 18, 2 | 2009-08-18 |
| Packaging Substrate With Embedded Chip And Buried Heatsink App 20080315398 - Lo; Hsing-Lun ; et al. | 2008-12-25 |
| Lot Traceable Printed Circuit Board App 20080149732 - Lo; Hsing-Lun ; et al. | 2008-06-26 |
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