LO; HSING-FEN
Patent Applications and Registrations
Patent applications and USPTO patent grants for LO; HSING-FEN.The latest application filed is for "light emitting diode device, backlight module, and liquid crystal display device having same".
- LO; HSING-FEN - Hukou TW
- Lo; Hsing-Fen - Hsinchu TW
- Lo; Hsing-Fen - Taipei Hsien TW
- LO; HSING-FEN - Tu-Cheng TW
| Patent | Date |
|---|---|
| Light Emitting Diode Device, Backlight Module, And Liquid Crystal Display Device Having Same App 20220252938 - LO; HSING-FEN | 2022-08-11 |
| Lead frame and light emitting diode package having the same Grant 9,899,587 - Jang , et al. February 20, 2 | 2018-02-20 |
| Lead Frame And Light Emitting Diode Package Having The Same App 20170162477 - JANG; YAU-TZU ; et al. | 2017-06-08 |
| Lead frame and light emitting diode package having the same Grant 9,620,692 - Jang , et al. April 11, 2 | 2017-04-11 |
| Light emitting diode device and method for manufacturing same Grant 9,318,666 - Lo , et al. April 19, 2 | 2016-04-19 |
| Lead Frame And Light Emitting Diode Package Having The Same App 20160027983 - JANG; YAU-TZU ; et al. | 2016-01-28 |
| Lead frame and light emitting diode package having the same Grant 9,184,358 - Jang , et al. November 10, 2 | 2015-11-10 |
| Method for packaging light emitting diodes and light emitting module having LED packages formed by the method Grant 8,946,734 - Lo February 3, 2 | 2015-02-03 |
| Method for manufacturing LED package Grant 8,921,132 - Lo December 30, 2 | 2014-12-30 |
| Method for manufacturing LED Grant 8,871,535 - Lo , et al. October 28, 2 | 2014-10-28 |
| Light Emitting Diode Device And Method For Manufacturing Same App 20140291720 - LO; HSING-FEN ; et al. | 2014-10-02 |
| Method for manufacturing LED Grant 8,828,754 - Chang , et al. September 9, 2 | 2014-09-09 |
| Light Emitting Diode Package With Light Reflecting Cup Internally Slanted App 20140175482 - JANG; YAU-TZU ; et al. | 2014-06-26 |
| Lead Frame And Light Emitting Diode Package Having The Same App 20140167078 - JANG; YAU-TZU ; et al. | 2014-06-19 |
| Light Emitting Diode Package Structure Having A Substrate Including Ceramic Fibers App 20130285093 - LO; HSING-FEN | 2013-10-31 |
| Side-view Light Emitting Diode Package And Method For Manufacturing The Same App 20130285097 - CHEN; LUNG-HSIN ; et al. | 2013-10-31 |
| Method For Manufacturing Led App 20130288408 - CHANG; CHIEH-LING ; et al. | 2013-10-31 |
| Method For Manufacturing Led Package App 20130288407 - LO; HSING-FEN | 2013-10-31 |
| Method For Manufacturing Led App 20130280834 - LO; HSING-FEN ; et al. | 2013-10-24 |
| LED device having two LED dies separated by a dam Grant 8,536,593 - Lo September 17, 2 | 2013-09-17 |
| LED unit Grant 8,507,932 - Ke , et al. August 13, 2 | 2013-08-13 |
| LED module Grant 8,449,153 - Lo , et al. May 28, 2 | 2013-05-28 |
| Method for manufacturing LED Grant 8,440,477 - Lo May 14, 2 | 2013-05-14 |
| Method For Manufacturing Led And Led Obtained Thereby App 20130069101 - LIN; HSIN-CHIANG ; et al. | 2013-03-21 |
| Led Device Having Two Led Dies Separated By A Dam App 20130062636 - LO; HSING-FEN | 2013-03-14 |
| Method For Packaging Light Emitting Diodes And Light Emitting Module Having Led Packages Formed By The Method App 20130015472 - LO; HSING-FEN | 2013-01-17 |
| Led Module App 20120127742 - LO; HSING-FEN ; et al. | 2012-05-24 |
| Led Unit App 20120049221 - KE; CHIH-HSUN ; et al. | 2012-03-01 |
| Light Emitting Diode Package And Light Emitting Diode Module App 20120025258 - CHAN; SHIUN-WEI ; et al. | 2012-02-02 |
| Side-emitting LED package and manufacturing method of the same Grant 8,089,089 - Kuo , et al. January 3, 2 | 2012-01-03 |
| Housing for light emitting diode Grant D645,830 - Lo , et al. September 27, 2 | 2011-09-27 |
| Housing for light emitting diode Grant D645,422 - Lo , et al. September 20, 2 | 2011-09-20 |
| Housing for light emitting diode Grant D645,423 - Lo , et al. September 20, 2 | 2011-09-20 |
| Side-emitting Led Package And Manufacturing Method Of The Same App 20100213487 - KUO; CHESTER ; et al. | 2010-08-26 |
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