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Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
Grant 11,399,228 - Liang , et al. July 26, 2 | 2022-07-26 |
Acoustic testing method and acoustic testing system thereof
Grant 11,395,081 - Lo , et al. July 19, 2 | 2022-07-19 |
Sound producing package structure and method for packaging sound producing package structure
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Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
Grant 11,323,797 - Liang , et al. May 3, 2 | 2022-05-03 |
Crossover circuit
Grant 11,304,005 - Liang , et al. April 12, 2 | 2022-04-12 |
Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
Grant 11,252,511 - Lo , et al. February 15, 2 | 2022-02-15 |
Crossover Circuit
App 20220014851 - Liang; Jemm Yue ; et al. | 2022-01-13 |
Acoustic Transducer, Wearable Sound Device And Manufacturing Method Of Acoustic Transducer
App 20220014836 - Liang; Jemm Yue ; et al. | 2022-01-13 |
Sound Producing Package Structure And Manufacturing Method Thereof
App 20220009768 - Lo; Chiung C. ; et al. | 2022-01-13 |
Acoustic Testing Method and Acoustic Testing System Thereof
App 20210377679 - Lo; Chiung C. ; et al. | 2021-12-02 |
Sound producing device
Grant 11,172,300 - Liang , et al. November 9, 2 | 2021-11-09 |
Sound Producing Package Structure And Method For Packaging Sound Producing Package Structure
App 20210329386 - Wen; Hai-Hung ; et al. | 2021-10-21 |
Sound Producing Package Structure And Manufacturing Method Thereof
App 20210314688 - Lo; Chiung C. ; et al. | 2021-10-07 |
Package Structure And Methods Of Manufacturing Sound Producing Chip, Forming Package Structure And Forming Sound Producing Apparatus
App 20210297787 - Lo; Chiung C. ; et al. | 2021-09-23 |
Sound Producing Device
App 20210250689 - Liang; Jemm Yue ; et al. | 2021-08-12 |
Sound producing device
Grant 11,057,716 - Lo , et al. July 6, 2 | 2021-07-06 |
Sound Producing Device
App 20210204067 - Lo; Chiung C. ; et al. | 2021-07-01 |
Sound producing device
Grant 10,979,808 - Liang , et al. April 13, 2 | 2021-04-13 |
Package Structure Of Sound Producing Device And Manufacturing Method Thereof
App 20210092500 - Lo; Chiung C. ; et al. | 2021-03-25 |
Method for manufacturing air pulse generating element
Grant 10,771,891 - Hong , et al. Sep | 2020-09-08 |
Air pulse generating element and manufacturing method thereof
Grant 10,609,474 - Liang , et al. | 2020-03-31 |
Method For Manufacturing Air Pulse Generating Element
App 20200059721 - Hong; David ; et al. | 2020-02-20 |
Air pulse generating element and sound producing device
Grant 10,477,300 - Hong , et al. Nov | 2019-11-12 |
Sound Producing Device
App 20190313189 - Liang; Jemm Yue ; et al. | 2019-10-10 |
Sound Producing Device
App 20190313190 - Liang; Jemm Yue ; et al. | 2019-10-10 |
Sound producing device
Grant 10,425,732 - Liang , et al. Sept | 2019-09-24 |
Air Pulse Generating Element and Sound Producing Device
App 20190238974 - Hong; David ; et al. | 2019-08-01 |
Air pulse generating element and sound producing device
Grant 10,327,060 - Lo , et al. | 2019-06-18 |
Air Pulse Generating Element and Sound Producing Device
App 20190141435 - Lo; Chiung C. ; et al. | 2019-05-09 |
Air Pulse Generating Element And Manufacturing Method Thereof
App 20190116417 - Liang; Jemm Yue ; et al. | 2019-04-18 |
Micro-electro-mechanical System Device With Electrical Compensation And Readout Circuit Thereof
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Rotation Velocity Sensor And Method For Sensing Rotation Velocity
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Micro-electro-mechanical system (MEMS) chip
Grant 9,206,032 - Kang , et al. December 8, 2 | 2015-12-08 |
Wafer-level packaged device having self-assembled resilient leads
Grant 9,159,684 - Lo , et al. October 13, 2 | 2015-10-13 |
Micromachined resonant magnetic field sensors
Grant 8,947,081 - Seeger , et al. February 3, 2 | 2015-02-03 |
Micromachined resonant magnetic field sensors
Grant 8,860,409 - Seeger , et al. October 14, 2 | 2014-10-14 |
Wafer-level packaged device having self-assembled resilient leads
Grant 8,692,367 - Lo , et al. April 8, 2 | 2014-04-08 |
Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
Grant 8,686,560 - Parvarandeh , et al. April 1, 2 | 2014-04-01 |
Integrated MEMS device and method of use
Grant 8,567,246 - Shaeffer , et al. October 29, 2 | 2013-10-29 |
Light sensor using wafer-level packaging
Grant 8,405,115 - Samoilov , et al. March 26, 2 | 2013-03-26 |
Micromachined magnetic field sensors
Grant 8,395,381 - Lo , et al. March 12, 2 | 2013-03-12 |
Wafer-level packaged device having self-assembled resilient leads
Grant 8,278,748 - Lo , et al. October 2, 2 | 2012-10-02 |
Drive System For Micromachined Magnetic Field Sensors
App 20120235670 - Cagdaser; Baris ; et al. | 2012-09-20 |
Micromachined Resonant Magnetic Field Sensors
App 20120176129 - SEEGER; Joseph ; et al. | 2012-07-12 |
Micromachined Resonant Magnetic Field Sensors
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Integrated Mems Device And Method Of Use
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Micromachined Offset Reduction Structures For Magnetic Field Sensing
App 20120007597 - Seeger; Joseph ; et al. | 2012-01-12 |
Micromachined Magnetic Field Sensors
App 20120007598 - Lo; Chiung C. ; et al. | 2012-01-12 |
Wafer-level Chip-scale Package Device Having Bump Assemblies Configured To Mitigate Failures Due To Stress
App 20110248398 - PARVARANDEH; PIROOZ ; et al. | 2011-10-13 |
Wafer-level Packaged Device Having Self-assembled Resilient Leads
App 20110198745 - Lo; Chiung C. ; et al. | 2011-08-18 |
Light Sensor Using Wafer-Level Packaging
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