loadpatents
name:-0.028592824935913
name:-0.022390842437744
name:-0.0018370151519775
Llapitan; David J. Patent Filings

Llapitan; David J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Llapitan; David J..The latest application filed is for "cpu package substrates with removable memory mechanical interfaces".

Company Profile
1.18.26
  • Llapitan; David J. - Tacoma WA
  • Llapitan; David J. - Puyallup WA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Rework grid array interposer with direct power
Grant 10,211,120 - Aoki , et al. Feb
2019-02-19
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20180007791 - Prakash; Mani ;   et al.
2018-01-04
Socket loading element and associated techniques and configurations
Grant 9,848,510 - Krithivasan , et al. December 19, 2
2017-12-19
CPU package substrates with removable memory mechanical interfaces
Grant 9,832,876 - Prakash , et al. November 28, 2
2017-11-28
Rework grid array interposer with direct power
App 20170186661 - Aoki; Russell S. ;   et al.
2017-06-29
Contact protection for integrated circuit device loading
Grant 9,681,556 - Llapitan , et al. June 13, 2
2017-06-13
Electronic assembly that includes a plurality of electronic packages
Grant 9,603,276 - Llapitan , et al. March 21, 2
2017-03-21
Multi-array bottom-side connector using spring bias
Grant 9,490,560 - Chawla , et al. November 8, 2
2016-11-08
Connector assembly and method
Grant 9,385,457 - Chawla , et al. July 5, 2
2016-07-05
Electronic Assembly That Includes A Plurality Of Electronic Packages
App 20160190717 - Llapitan; David J. ;   et al.
2016-06-30
Socket That Engages A Plurality Of Electronic Packages
App 20160190716 - Liu; Kuang ;   et al.
2016-06-30
Socket Loading Element And Associated Techniques And Configurations
App 20160183375 - Krithivasan; Vijaykumar ;   et al.
2016-06-23
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20160183374 - Prakash; Mani ;   et al.
2016-06-23
Multi-array Bottom-side Connector Using Spring Bias
App 20160181714 - CHAWLA; GAURAV ;   et al.
2016-06-23
Integrated circuit connectors
Grant 9,265,170 - Swaminathan , et al. February 16, 2
2016-02-16
Connector Assembly And Method
App 20150249298 - Chawla; Gaurav ;   et al.
2015-09-03
Integrated Circuit Connectors
App 20150118870 - Swaminathan; Rajasekaran ;   et al.
2015-04-30
Connector assembly and method
Grant 8,905,794 - Chawla , et al. December 9, 2
2014-12-09
Connector Assembly And Method
App 20140162475 - Chawla; Gaurav ;   et al.
2014-06-12
Contact Protection For Integrated Circuit Device Loading
App 20140092573 - LLAPITAN; David J. ;   et al.
2014-04-03
Two piece wire bale independent load mechanism
Grant 8,081,489 - Llapitan , et al. December 20, 2
2011-12-20
Wire bale independent load mechanism
Grant 7,867,003 - Llapitan , et al. January 11, 2
2011-01-11
Two Piece Wire Bale Independent Load Mechanism
App 20100157563 - LLAPITAN; David J. ;   et al.
2010-06-24
Wire Bale Independent Load Mechanism
App 20100159730 - LLAPITAN; David J. ;   et al.
2010-06-24
Electronic assemblies with high capacity heat sinks and methods of manufacture
Grant 7,200,934 - Carter , et al. April 10, 2
2007-04-10
Captive socket actuator
Grant 7,050,302 - Llapitan , et al. May 23, 2
2006-05-23
Liquid cooling system
App 20060067052 - Llapitan; David J. ;   et al.
2006-03-30
Captive socket actuator
App 20050243525 - Llapitan, David J. ;   et al.
2005-11-03
Electronic assemblies with high capacity heat sinks
App 20040080914 - Carter, Daniel P. ;   et al.
2004-04-29
Retention mechanism for an electrical assembly
Grant 6,722,908 - Llapitan , et al. April 20, 2
2004-04-20
Electronic assemblies with high capacity heat sinks and methods of manufacture
App 20040045163 - Carter, Daniel P. ;   et al.
2004-03-11
Electronic assemblies with high capacity curved fin heat sinks
Grant 6,671,172 - Carter , et al. December 30, 2
2003-12-30
Retention mechanism for an electrical assembly
Grant 6,585,534 - Llapitan , et al. July 1, 2
2003-07-01
Retention mechanism for an electrical assembly
App 20030096524 - Llapitan, David J. ;   et al.
2003-05-22
Electronic Assemblies With High Capacity Curved Fin Heat Sinks
App 20030048612 - Carter, Daniel P. ;   et al.
2003-03-13
Retention Mechanism For An Electrical Assembly
App 20010019913 - LLAPITAN, DAVID J. ;   et al.
2001-09-06
Retention mechanism that can be used with different electronic assemblies
Grant 6,159,031 - Llapitan , et al. December 12, 2
2000-12-12

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed