Patent | Date |
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Chip front surface touchless pick and place tool or flip chip bonder Grant 11,282,722 - Tang , et al. March 22, 2 | 2022-03-22 |
Chip Front Surface Touchless Pick and Place Tool or Flip Chip Bonder App 20210057242 - Tang; Yunjun ;   et al. | 2021-02-25 |
Chip Front Surface Touchless Flip Chip Bonders App 20210005572 - Li; Dong ;   et al. | 2021-01-07 |
Methods Of Making Acoustic Wave Devices App 20200382092 - Li; Dong ;   et al. | 2020-12-03 |
Free space grating coupler Grant 10,641,966 - Miao , et al. | 2020-05-05 |
Gapless optical mode converter Grant 10,539,744 - Miao , et al. Ja | 2020-01-21 |
Edge coupling device fabrication Grant 10,197,733 - Pan , et al. Fe | 2019-02-05 |
Integration of V-grooves on silicon-on-insulator (SOI) platform for direct fiber coupling Grant 9,933,570 - Liu , et al. April 3, 2 | 2018-04-03 |
Integration of V-grooves on Silicon-On-Insulator (SOI) Platform for Direct Fiber Coupling App 20170254954 - Liu; Zongrong ;   et al. | 2017-09-07 |
Edge Coupling Device Fabrication App 20170219777 - Pan; Huapu ;   et al. | 2017-08-03 |
Gapless Optical Mode Converter App 20170205582 - Miao; Rongsheng ;   et al. | 2017-07-20 |
Edge coupling device fabrication Grant 9,703,039 - Pan , et al. July 11, 2 | 2017-07-11 |
Free Space Grating Coupler App 20170192175 - Miao; Rongsheng ;   et al. | 2017-07-06 |
Micrometer scale components Grant 9,672,847 - Liu , et al. June 6, 2 | 2017-06-06 |
Free space grating coupler Grant 9,632,281 - Miao , et al. April 25, 2 | 2017-04-25 |
Tunable laser with high thermal wavelength tuning efficiency Grant 9,577,408 - Chen , et al. February 21, 2 | 2017-02-21 |
Tunable Laser With High Thermal Wavelength Tuning Efficiency App 20160118772 - CHEN; Hongmin ;   et al. | 2016-04-28 |
Magnetoresistive random access memory cell with independently operating read and write components Grant 9,293,694 - Yi , et al. March 22, 2 | 2016-03-22 |
Micrometer Scale Components App 20160005427 - LIU; ZONGRONG ;   et al. | 2016-01-07 |
Tunable laser with high thermal wavelength tuning efficiency Grant 9,231,361 - Chen , et al. January 5, 2 | 2016-01-05 |
Edge Coupling Device Fabrication App 20150293303 - Pan; Huapu ;   et al. | 2015-10-15 |
Micrometer scale components Grant 9,159,345 - Liu , et al. October 13, 2 | 2015-10-13 |
Free Space Grating Coupler App 20150260931 - Miao; Rongsheng ;   et al. | 2015-09-17 |
Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging Grant 9,012,265 - Yi , et al. April 21, 2 | 2015-04-21 |
Method of fabricating micrometer scale components Grant 8,997,832 - Liu , et al. April 7, 2 | 2015-04-07 |
Tunable Laser With High Thermal Wavelength Tuning Efficiency App 20140321488 - Chen; Hongmin ;   et al. | 2014-10-30 |
Method and system for providing a laser submount for an energy assisted magnetic recording head Grant 8,860,216 - Wang , et al. October 14, 2 | 2014-10-14 |
Magnetoresistive random access memory cell design App 20130307097 - Yi; Ge ;   et al. | 2013-11-21 |
Magnetoresistive random access memory cell design App 20130270661 - Yi; Ge ;   et al. | 2013-10-17 |
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level Chip Scale Packaging App 20130252375 - Yi; Ge ;   et al. | 2013-09-26 |
Method and system for providing a laser submount for an energy assisted magnetic recording head Grant 8,518,748 - Wang , et al. August 27, 2 | 2013-08-27 |
Magnetoresistive random access memory cell with independently operating read and write components App 20130114334 - Yi; Ge ;   et al. | 2013-05-09 |
Wafer level surface passivation of stackable integrated circuit chips Grant 8,324,081 - McElrea , et al. December 4, 2 | 2012-12-04 |
Methods for fabricating components with precise dimension control Grant 8,288,204 - Wang , et al. October 16, 2 | 2012-10-16 |
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ;   et al. | 2011-06-23 |
Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2 | 2011-04-12 |
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ;   et al. | 2008-12-25 |