LIU; Zi-Jheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIU; Zi-Jheng.The latest application filed is for "machine learning on overlay management".

Company Profile

19.18.22

LIU; Zi-Jheng - Hsinchu TW
Liu; Zi-Jheng - Taoyuan TW
LIU; Zi-Jheng - Taoyuan City TW
Liu; Zi-Jheng - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Machine Learning On Overlay Management App 20220269184 - LIN; Tzu-Cheng ; et al.	2022-08-25
Semiconductor packages and manufacturing methods thereof Grant 11,322,479 - Liu , et al. May 3, 2	2022-05-03
Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide Grant 11,177,165 - Liu , et al. November 16, 2	2021-11-16
Semiconductor Device App 20210296262 - LIU; Zi-Jheng ; et al.	2021-09-23
Semiconductor package and manufacturing method thereof Grant 11,127,688 - Liu , et al. September 21, 2	2021-09-21
Semiconductor Packages App 20210288026 - Liu; Zi-Jheng ; et al.	2021-09-16
Semiconductor Package And Method Of Fabricating Semiconductor Package App 20210183694 - Liu; Zi-Jheng ; et al.	2021-06-17
Package structure and method of manufacturing the same Grant 11,037,877 - Liu , et al. June 15, 2	2021-06-15
Method of manufacturing a semiconductor device Grant 11,031,351 - Liu , et al. June 8, 2	2021-06-08
Semiconductor Device App 20210134611 - Liu; Zi-Jheng ; et al.	2021-05-06
Semiconductor package and method of fabricating semiconductor package Grant 10,937,688 - Liu , et al. March 2, 2	2021-03-02
Semiconductor Package And Manufacturing Method Thereof App 20210057347 - Liu; Zi-Jheng ; et al.	2021-02-25
Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof Grant 10,879,166 - Liu , et al. December 29, 2	2020-12-29
Semiconductor device Grant 10,867,811 - Liu , et al. December 15, 2	2020-12-15
Semiconductor package and method of fabricating the same Grant 10,867,793 - Liu , et al. December 15, 2	2020-12-15
Semiconductor Packages And Manufacturing Methods Thereof App 20200321314 - Liu; Zi-Jheng ; et al.	2020-10-08
Package Structure And Method Of Manufacturing The Same App 20200294921 - Liu; Zi-Jheng ; et al.	2020-09-17
Semiconductor packages Grant 10,692,838 - Liu , et al.	2020-06-23
Integrated circuit package and method of fabricating the same Grant 10,685,896 - Liu , et al.	2020-06-16
Semiconductor Package And Method Of Fabricating The Same App 20200135453 - Liu; Zi-Jheng ; et al.	2020-04-30
Semiconductor Package And Method Of Fabricating The Same App 20190393150 - Liu; Zi-Jheng ; et al.	2019-12-26
Semiconductor Package And Method Of Fabricating Semiconductor Package App 20190295884 - Liu; Zi-Jheng ; et al.	2019-09-26
Method Of Manufacturing A Semiconductor Device App 20190172796 - LIU; Zi-Jheng ; et al.	2019-06-06
Semiconductor device and method Grant 10,304,700 - Liu , et al.	2019-05-28
Semicondcutor Packages App 20190148341 - Liu; Zi-Jheng ; et al.	2019-05-16
Semiconductor package and method of fabricating semiconductor package Grant 10,276,428 - Liu , et al.	2019-04-30
Semiconductor Package And Method Of Fabricating Semiconductor Package App 20190067086 - Liu; Zi-Jheng ; et al.	2019-02-28
Semiconductor device and method of manufacturing the same Grant 10,204,870 - Liu , et al. Feb	2019-02-12
Semiconductor Device and Method App 20190035680 - Liu; Zi-Jheng ; et al.	2019-01-31
Semiconductor packages and manufacturing methods thereof Grant 10,163,858 - Liu , et al. Dec	2018-12-25
Semiconductor Device and Method App 20180350629 - Liu; Zi-Jheng ; et al.	2018-12-06
Integrated Circuit Package And Method Of Fabricating The Same App 20180301389 - Liu; Zi-Jheng ; et al.	2018-10-18
Semiconductor device and method Grant 10,090,194 - Liu , et al. October 2, 2	2018-10-02
Package structures and methods of making the same Grant 10,049,986 - Liu , et al. August 14, 2	2018-08-14
Semiconductor Device And Method Of Manufacturing The Same App 20170317034 - LIU; Zi-Jheng ; et al.	2017-11-02
Chip packages and methods of manufacture thereof Grant 9,786,617 - Liu , et al. October 10, 2	2017-10-10
Semiconductor Device and Method App 20170271203 - Liu; Zi-Jheng ; et al.	2017-09-21
Chip Packages and Methods of Manufacture Thereof App 20170141055 - Liu; Zi-Jheng ; et al.	2017-05-18
Package Structures and Methods of Making the Same App 20170125346 - Liu; Zi-Jheng ; et al.	2017-05-04
Semiconductor Device and Method App 20170110421 - Liu; Zi-Jheng ; et al.	2017-04-20

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