LIU; Yueli

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIU; Yueli.The latest application filed is for "bridge interconnection with layered interconnect structures".

Company Profile

4.14.22

LIU; Yueli - Gilbert AZ
LIU; Yueli - Wuhan CN
Liu; Yueli - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bridge Interconnection With Layered Interconnect Structures App 20210384129 - LIU; Yueli ; et al.	2021-12-09
Bridge interconnection with layered interconnect structures Grant 11,133,257 - Liu , et al. September 28, 2	2021-09-28
Preparation Method Of Cof-5 Crystal App 20210178363 - LIU; Yueli ; et al.	2021-06-17
Indium solder metallurgy to control electro-migration Grant 10,957,667 - Lee , et al. March 23, 2	2021-03-23
Bridge Interconnection With Layered Interconnect Structures App 20200043852 - Liu; Yueli ; et al.	2020-02-06
Bridge interconnection with layered interconnect structures Grant 10,475,745 - Liu , et al. Nov	2019-11-12
Indium Solder Metallurgy To Control Electro-migration App 20190189582 - LEE; Kyu Oh ; et al.	2019-06-20
Bridge Interconnection With Layered Interconnect Structures App 20190013271 - Liu; Yueli ; et al.	2019-01-10
Bridge interconnection with layered interconnect structures Grant 10,103,103 - Liu , et al. October 16, 2	2018-10-16
Bridge Interconnection With Layered Interconnect Structures App 20170207168 - Liu; Yueli ; et al.	2017-07-20
Bridge interconnection with layered interconnect structures Grant 9,640,485 - Liu , et al. May 2, 2	2017-05-02
Coreless substrate with passive device pads Grant 9,502,336 - Zhang , et al. November 22, 2	2016-11-22
Molded Insulator In Package Assembly App 20160336258 - Liu; Yueli	2016-11-17
Molded insulator in package assembly Grant 9,412,625 - Liu August 9, 2	2016-08-09
Device packaging with substrates having embedded lines and metal defined pads Grant 9,355,952 - Hlad , et al. May 31, 2	2016-05-31
Bridge Interconnection With Layered Interconnect Structures App 20150364423 - Liu; Yueli ; et al.	2015-12-17
Molded Insulator In Package Assembly App 20150318191 - Liu; Yueli	2015-11-05
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20150318238 - HLAD; Mark S. ; et al.	2015-11-05
Interconnect structures for embedded bridge Grant 9,147,638 - Liu , et al. September 29, 2	2015-09-29
Bridge interconnection with layered interconnect structures Grant 9,147,663 - Liu , et al. September 29, 2	2015-09-29
Molded insulator in package assembly Grant 9,113,573 - Liu August 18, 2	2015-08-18
Device packaging with substrates having embedded lines and metal defined pads Grant 9,093,313 - Hlad , et al. July 28, 2	2015-07-28
Interconnect Structures For Embedded Bridge App 20150028486 - Liu; Yueli ; et al.	2015-01-29
Package Assembly Configurations For Multiple Dies And Associated Techniques App 20150014852 - Liu; Yueli ; et al.	2015-01-15
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20150008578 - Hlad; Mark S. ; et al.	2015-01-08
Bridge Interconnection With Layered Interconnect Structures App 20140353827 - Liu; Yueli ; et al.	2014-12-04
Coreless Substrate With Passive Device Pads App 20140268612 - Zhang; Qinglei ; et al.	2014-09-18
Device packaging with substrates having embedded lines and metal defined pads Grant 8,835,217 - Hlad , et al. September 16, 2	2014-09-16
Molded Insulator In Package Assembly App 20140138825 - Liu; Yueli	2014-05-22
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20120161330 - Hlad; Mark S. ; et al.	2012-06-28

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