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Bridge Interconnection With Layered Interconnect Structures App 20210384129 - LIU; Yueli ;   et al. | 2021-12-09 |
Bridge interconnection with layered interconnect structures Grant 11,133,257 - Liu , et al. September 28, 2 | 2021-09-28 |
Preparation Method Of Cof-5 Crystal App 20210178363 - LIU; Yueli ;   et al. | 2021-06-17 |
Indium solder metallurgy to control electro-migration Grant 10,957,667 - Lee , et al. March 23, 2 | 2021-03-23 |
Bridge Interconnection With Layered Interconnect Structures App 20200043852 - Liu; Yueli ;   et al. | 2020-02-06 |
Bridge interconnection with layered interconnect structures Grant 10,475,745 - Liu , et al. Nov | 2019-11-12 |
Indium Solder Metallurgy To Control Electro-migration App 20190189582 - LEE; Kyu Oh ;   et al. | 2019-06-20 |
Bridge Interconnection With Layered Interconnect Structures App 20190013271 - Liu; Yueli ;   et al. | 2019-01-10 |
Bridge interconnection with layered interconnect structures Grant 10,103,103 - Liu , et al. October 16, 2 | 2018-10-16 |
Bridge Interconnection With Layered Interconnect Structures App 20170207168 - Liu; Yueli ;   et al. | 2017-07-20 |
Bridge interconnection with layered interconnect structures Grant 9,640,485 - Liu , et al. May 2, 2 | 2017-05-02 |
Coreless substrate with passive device pads Grant 9,502,336 - Zhang , et al. November 22, 2 | 2016-11-22 |
Molded Insulator In Package Assembly App 20160336258 - Liu; Yueli | 2016-11-17 |
Molded insulator in package assembly Grant 9,412,625 - Liu August 9, 2 | 2016-08-09 |
Device packaging with substrates having embedded lines and metal defined pads Grant 9,355,952 - Hlad , et al. May 31, 2 | 2016-05-31 |
Bridge Interconnection With Layered Interconnect Structures App 20150364423 - Liu; Yueli ;   et al. | 2015-12-17 |
Molded Insulator In Package Assembly App 20150318191 - Liu; Yueli | 2015-11-05 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20150318238 - HLAD; Mark S. ;   et al. | 2015-11-05 |
Interconnect structures for embedded bridge Grant 9,147,638 - Liu , et al. September 29, 2 | 2015-09-29 |
Bridge interconnection with layered interconnect structures Grant 9,147,663 - Liu , et al. September 29, 2 | 2015-09-29 |
Molded insulator in package assembly Grant 9,113,573 - Liu August 18, 2 | 2015-08-18 |
Device packaging with substrates having embedded lines and metal defined pads Grant 9,093,313 - Hlad , et al. July 28, 2 | 2015-07-28 |
Interconnect Structures For Embedded Bridge App 20150028486 - Liu; Yueli ;   et al. | 2015-01-29 |
Package Assembly Configurations For Multiple Dies And Associated Techniques App 20150014852 - Liu; Yueli ;   et al. | 2015-01-15 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20150008578 - Hlad; Mark S. ;   et al. | 2015-01-08 |
Bridge Interconnection With Layered Interconnect Structures App 20140353827 - Liu; Yueli ;   et al. | 2014-12-04 |
Coreless Substrate With Passive Device Pads App 20140268612 - Zhang; Qinglei ;   et al. | 2014-09-18 |
Device packaging with substrates having embedded lines and metal defined pads Grant 8,835,217 - Hlad , et al. September 16, 2 | 2014-09-16 |
Molded Insulator In Package Assembly App 20140138825 - Liu; Yueli | 2014-05-22 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads App 20120161330 - Hlad; Mark S. ;   et al. | 2012-06-28 |