Liu; Yu-Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Yu-Chin.The latest application filed is for "circuit board heat dissipation system".
- Liu; Yu-Chin - Taipei TW
- Liu; Yu-Chin - New Taipei TW
- Liu; Yu-Chin - New Taipei City TW
- Liu; Yu Chin - Taichung TW
- Liu; Yu Chin - Da-Li City TW
- Liu, Yu-Chin - US
| Patent | Date |
|---|---|
| Circuit board heat dissipation system Grant 11,240,906 - Liu , et al. February 1, 2 | 2022-02-01 |
| Heat dissipation device Grant 11,215,408 - Kao , et al. January 4, 2 | 2022-01-04 |
| Circuit Board Heat Dissipation System App 20210352799 - LIU; Yu-Chin ; et al. | 2021-11-11 |
| Heat Dissipation Device App 20200208926 - Kao; Jui-Hung ; et al. | 2020-07-02 |
| Heat Dissipating Device And Method Of Manufacturing The Same App 20140238644 - Hsieh; Tsung-Hsien ; et al. | 2014-08-28 |
| Parallelepiped tape cutter App 20110114689 - Liu; Yu Chin | 2011-05-19 |
| Tape cutter blade with truncated trapezoidal sharpened teeh App 20110048647 - LIU; YU CHIN | 2011-03-03 |
| Adhesive tape cutter Grant 7,845,381 - Liu December 7, 2 | 2010-12-07 |
| Adhesive Tape Cutter App 20090301660 - Liu; Yu Chin | 2009-12-10 |
| Adhesive Tape Cutter App 20090302084 - Liu; Yu Chin | 2009-12-10 |
| Method of licensing computer program or data to be used legally App 20030135745 - Liu, Yu-Chin | 2003-07-17 |
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