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Patent applications and USPTO patent grants for Liu; Taochi.The latest application filed is for "electrodeposited nano-twins copper layer and method of fabricating the same".
Patent | Date |
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Electrodeposited nano-twins copper layer and method of fabricating the same Grant 10,094,033 - Chen , et al. October 9, 2 | 2018-10-09 |
Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same App 20160355940 - CHEN; Chih ;   et al. | 2016-12-08 |
Electrodeposited nano-twins copper layer and method of fabricating the same Grant 9,476,140 - Chen , et al. October 25, 2 | 2016-10-25 |
Electrical Connecting Element and Method for Manufacturing the Same App 20140217593 - CHEN; Chih ;   et al. | 2014-08-07 |
Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same App 20130122326 - CHEN; Chih ;   et al. | 2013-05-16 |
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