Liu; Spring
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Spring.The latest application filed is for "electronic circuit structure using an analog-to-digital conversion concept for saving circuit pins".
- Liu; Spring - Taipei TW
| Patent | Date |
|---|---|
| Heat dissipating structure of interface card Grant 7,272,000 - Liu September 18, 2 | 2007-09-18 |
| Electronic circuit structure using an analog-to-digital conversion concept for saving circuit pins App 20070046520 - Liu; Spring ; et al. | 2007-03-01 |
| Heat dissipating structure of interface card App 20060221569 - Liu; Spring | 2006-10-05 |
| Method of preventing flashing between solder pads on circuit board App 20050269384 - Liu, Spring ; et al. | 2005-12-08 |
| Method for preventing pins of semiconductor package from short circuit during soldering App 20050270755 - Tsai, Ticky ; et al. | 2005-12-08 |
| Modularized electronic device coupling architecture and method App 20050157456 - Wu, Yaz-Tzu ; et al. | 2005-07-21 |
| Heat dissipating structure of webpad App 20020181201 - Liu, Spring ; et al. | 2002-12-05 |
| SEC | 0001455264 | Liu Spring |
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