| Patent | Date |
|---|
Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same
Grant 11,345,813 - Liu , et al. May 31, 2 | 2022-05-31 |
Flexible prepreg and uses thereof
Grant 11,312,829 - Liu , et al. April 26, 2 | 2022-04-26 |
Fluororesin Composition, And Resin Sheet, Laminate And Printed Circuit Board Prepared Using The Same
App 20210380792 - LIU; SHUR-FEN ; et al. | 2021-12-09 |
Resin Composition, And Pre-preg, Metal-clad Laminate, And Printed Circuit Board Prepared Using The Same
App 20210355259 - LIU; Shur-Fen ; et al. | 2021-11-18 |
Resin composition and uses of the same
Grant 11,124,613 - Liu , et al. September 21, 2 | 2021-09-21 |
Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same
Grant 11,124,614 - Liu , et al. September 21, 2 | 2021-09-21 |
Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
Grant 11,015,052 - Liu , et al. May 25, 2 | 2021-05-25 |
Metal-clad Laminate, Printed Circuit Board, And Method For Manufacturing The Same
App 20210060900 - HUANG; Shi-Ing ; et al. | 2021-03-04 |
Metal-clad Laminate And Manufacturing Method Of The Same
App 20200404782 - CHEN; Wen-Ren ; et al. | 2020-12-24 |
Resin Composition And Uses Of The Same
App 20200377676 - LIU; Shur-Fen ; et al. | 2020-12-03 |
Solvent-free resin composition and uses of the same
Grant 10,836,919 - Liu , et al. November 17, 2 | 2020-11-17 |
Resin composition and uses of the same
Grant 10,793,716 - Chen , et al. October 6, 2 | 2020-10-06 |
Resin composition and uses of the same
Grant 10,774,216 - Liu , et al. Sept | 2020-09-15 |
Flexible Prepreg And Uses Thereof
App 20200216626 - LIU; Shur-Fen ; et al. | 2020-07-09 |
Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
Grant 10,689,512 - Liu , et al. | 2020-06-23 |
Halogen-free Low Dielectric Resin Composition, And Prepreg, Metal-clad Laminate, And Printed Circuit Board Prepared Using The Sa
App 20200181402 - LIU; SHUR-FEN ; et al. | 2020-06-11 |
Adhesive composition and uses of the same
Grant 10,662,352 - Liu , et al. | 2020-05-26 |
Solvent-free Resin Composition And Uses Of The Same
App 20200115572 - LIU; Shur-Fen ; et al. | 2020-04-16 |
Halogen-free Low Dielectric Resin Composition, And Pre-preg, Metal-clad Laminate, And Printed Circuit Board Using The Same
App 20200071477 - LIU; Shur-Fen ; et al. | 2020-03-05 |
Dielectric composite and uses thereof
Grant 10,575,401 - Liu , et al. Feb | 2020-02-25 |
Resin composition and uses of the same
Grant 10,568,211 - Liu , et al. Feb | 2020-02-18 |
Dielectric Composite And Uses Thereof
App 20200053877 - LIU; Shur-Fen ; et al. | 2020-02-13 |
Resin composition and uses of the same
Grant 10,513,607 - Liu , et al. Dec | 2019-12-24 |
Resin Composition, Pre-preg, Metal-clad Laminate, And Printed Circuit Board Using The Same
App 20190367727 - LIU; Shur-Fen ; et al. | 2019-12-05 |
Adhesive Composition And Uses Of The Same
App 20190194505 - LIU; Shur-fen ; et al. | 2019-06-27 |
Resin composition and uses of the same
Grant 10,322,565 - Liu | 2019-06-18 |
Resin Composition And Uses Of The Same
App 20190144666 - Liu; Shur-Fen ; et al. | 2019-05-16 |
Solvent-free resin composition and uses of the same
Grant 10,246,588 - Liu , et al. | 2019-04-02 |
Solvent-free Resin Composition And Uses Of The Same
App 20190085166 - Liu; Shur-Fen ; et al. | 2019-03-21 |
Resin composition and uses of the same
Grant 10,196,502 - Liu , et al. Fe | 2019-02-05 |
Method Of Manufacturing Metal-clad Laminate And Uses Of The Same
App 20180339493 - Chen; Wen-Ren ; et al. | 2018-11-29 |
Resin Composition and uses of the same
Grant 10,059,841 - Liu , et al. August 28, 2 | 2018-08-28 |
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
App 20180208765 - Liu; Shur-Fen ; et al. | 2018-07-26 |
Resin Composition and Uses of The Same
App 20180126699 - LIU; Shur-Fen | 2018-05-10 |
Resin composition and uses of the same
Grant 9,902,136 - Liu February 27, 2 | 2018-02-27 |
Resin Composition And Uses Of The Same
App 20180030267 - Liu; Shur-Fen ; et al. | 2018-02-01 |
Resin Composition And Uses Of The Same
App 20170260365 - Liu; Shur-Fen ; et al. | 2017-09-14 |
Resin Composition And Uses Of The Same
App 20170260367 - Liu; Shur-Fen ; et al. | 2017-09-14 |
Resin composition and uses of the same
Grant 9,708,484 - Liu , et al. July 18, 2 | 2017-07-18 |
Resin composition and uses of the same
Grant 9,657,154 - Liu , et al. May 23, 2 | 2017-05-23 |
Resin Composition And Uses Of The Same
App 20160297988 - LIU; Shur-Fen ; et al. | 2016-10-13 |
Resin Composition And Uses Of The Same
App 20160280913 - LIU; Shur-Fen ; et al. | 2016-09-29 |
Polyimide copolymers and method for fabricating patterned metal oxide layers
Grant 9,169,357 - Jeng , et al. October 27, 2 | 2015-10-27 |
Resin Composition And Uses Of The Same
App 20150183987 - LIU; Shur-Fen ; et al. | 2015-07-02 |
Resin Composition And Uses Of The Same
App 20150183952 - Liu; Shur-Fen ; et al. | 2015-07-02 |
Polyamic acid resin composition and method for forming polyimide resin
Grant 9,051,429 - Chang , et al. June 9, 2 | 2015-06-09 |
Semiconductor substrate assembly
Grant 9,029,984 - Chen , et al. May 12, 2 | 2015-05-12 |
Resin Composition And Uses Of The Same
App 20140255711 - Chen; Meng-Huei ; et al. | 2014-09-11 |
Semiconductor Substrate Assembly
App 20140048908 - Chen; Peng-Shu ; et al. | 2014-02-20 |
Polyimide film laminate and metal laminate employing the same
Grant 8,652,622 - Lu , et al. February 18, 2 | 2014-02-18 |
Transparent speaker and display module integrating the same
Grant 8,615,099 - Chang , et al. December 24, 2 | 2013-12-24 |
Resin Composition And Uses Of The Same
App 20130252003 - Liu; Shur-Fen | 2013-09-26 |
Capacitor structure
Grant 8,488,299 - Wu , et al. July 16, 2 | 2013-07-16 |
Thermally curable solder resist composition
Grant 8,420,745 - Jeng , et al. April 16, 2 | 2013-04-16 |
Capacitor substrate structure
Grant 8,390,984 - Liu , et al. March 5, 2 | 2013-03-05 |
Polyimide Copolymers And Method For Fabricating Patterned Metal Oxide Layers
App 20130029049 - JENG; Jhy-Long ; et al. | 2013-01-31 |
Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
Grant 8,304,666 - Ko , et al. November 6, 2 | 2012-11-06 |
Decoupling device
Grant 8,289,679 - Cheng , et al. October 16, 2 | 2012-10-16 |
Stepwise capacitor structure and substrate employing the same
Grant 8,227,894 - Lee , et al. July 24, 2 | 2012-07-24 |
Polyimide Film Laminate And Metal Laminate Employing The Same
App 20120156459 - Lu; Charng-Shing ; et al. | 2012-06-21 |
Adhesive Composition
App 20120121913 - CHANG; Li-Ming ; et al. | 2012-05-17 |
Flexible, low dielectric loss composition and method for preparing the same
Grant 8,138,263 - Liu , et al. March 20, 2 | 2012-03-20 |
Double-sided metal clad laminate and fabrication method thereof
Grant 8,101,038 - Lu , et al. January 24, 2 | 2012-01-24 |
Thermally Curable Solder Resist Composition
App 20110306703 - JENG; Jhy-Long ; et al. | 2011-12-15 |
Capacitor devices
Grant 8,035,951 - Wu , et al. October 11, 2 | 2011-10-11 |
Decoupling Device
App 20110157775 - Cheng; Cheng-Liang ; et al. | 2011-06-30 |
Polyamic Acid Resin Composition And Method For Forming Polyimide Resin
App 20110054124 - Chang; Li-Ming ; et al. | 2011-03-03 |
Transparent Speaker And Display Module Integrating The Same
App 20110033074 - Chang; You Chia ; et al. | 2011-02-10 |
Capacitor Structure
App 20110019335 - WU; Shih-Hsien ; et al. | 2011-01-27 |
Capacitor devices
App 20100321862 - Wu; Shih-Hsien ; et al. | 2010-12-23 |
Capacitor Substrate Structure
App 20100309607 - Liu; Shur-Fen ; et al. | 2010-12-09 |
Capacitor devices
Grant 7,804,678 - Wu , et al. September 28, 2 | 2010-09-28 |
Nonaqueous electrolyte having maleimide additives and secondary cells employing the same
Grant 7,750,092 - Wang , et al. July 6, 2 | 2010-07-06 |
Gas Sensing Material And Gas Sensor Employing The Same
App 20100163429 - Chiu; Kuo-Chuang ; et al. | 2010-07-01 |
Thermally Curable Solder Resist Composition
App 20100167205 - JENG; Jhy-Long ; et al. | 2010-07-01 |
Structure Of Multiple Coaxial Leads Within Single Via In Substrate And Manufacturing Method Thereof
App 20100163296 - Ko; Cheng-Ta ; et al. | 2010-07-01 |
Double-sided Metal Clad Laminate And Fabrication Method Thereof
App 20100035066 - Lu; Charng-Shing ; et al. | 2010-02-11 |
Organic/inorganic Hybrid Composition With Electrostatic Discharge Protection Property
App 20090236132 - Hong; Ming-Tsung ; et al. | 2009-09-24 |
Curable High Dielectric Constant Ink Composition and High Dielectric Film
App 20090227719 - Hung; Chin-Hsien ; et al. | 2009-09-10 |
Stepwise Capacitor Structure, Fabrication Method Thereof And Substrate Employing The Same
App 20090180236 - Lee; Min-Lin ; et al. | 2009-07-16 |
Hybrid capacitor
Grant 7,561,410 - Lee , et al. July 14, 2 | 2009-07-14 |
Flexible, Low Dielectric Loss Composition And Method For Preparing The Same
App 20090170993 - Liu; Shur-Fen ; et al. | 2009-07-02 |
Hybrid Capacitor
App 20090161298 - Lee; Min-Lin ; et al. | 2009-06-25 |
Multi-tier Capacitor Structure, Fabrication Method Thereof And Semiconductor Substrate Employing The Same
App 20090128993 - Wu; Shih-Hsien ; et al. | 2009-05-21 |
Capacitor Devices
App 20080266750 - WU; Shih-Hsien ; et al. | 2008-10-30 |
Nonaqueous Electrolyte Having Maleimide Additives And Secondary Cells Employing The Same
App 20080157021 - Wang; Tsung-Hsiung ; et al. | 2008-07-03 |
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
Grant 7,271,206 - Liu , et al. September 18, 2 | 2007-09-18 |
Structure of an interleaving striped capacitor substrate
Grant 7,102,876 - Lee , et al. September 5, 2 | 2006-09-05 |
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof
Grant 7,008,981 - Liu , et al. March 7, 2 | 2006-03-07 |
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
App 20050154092 - Liu, Shur-Fen ; et al. | 2005-07-14 |
Structure of an interleaving striped capacitor substrate
App 20050146840 - Lee, Min-Lin ; et al. | 2005-07-07 |
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof
App 20050137293 - Liu, Shur-Fen ; et al. | 2005-06-23 |
Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin
Grant 6,780,943 - Liu , et al. August 24, 2 | 2004-08-24 |
Structure of an interleaving striped capacitor substrate
App 20030184953 - Lee, Min-Lin ; et al. | 2003-10-02 |
Resin composition for circuit boards
App 20030144430 - Liu, Shur-Fen ; et al. | 2003-07-31 |
Photosensitive composition
App 20020086239 - Chen, Man-Lin ; et al. | 2002-07-04 |
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