Liu; Shien Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Shien Chen.The latest application filed is for "high-hardness and corrosion-tolerant integrated circuit packing mold".
- Liu; Shien Chen - Taipei TW
- LIU; SHIEN CHEN - Taichung City TW
| Patent | Date |
|---|---|
| High-hardness and corrosion-tolerant integrated circuit packing mold Grant 7,523,914 - Chang , et al. April 28, 2 | 2009-04-28 |
| High-hardness And Corrosion-tolerant Integrated Circuit Packing Mold App 20080099659 - CHANG; YIN YU ; et al. | 2008-05-01 |
| High-hardness and corrosion-tolerant integrated circuit packing mold App 20070001268 - Chang; Yin Yu ; et al. | 2007-01-04 |
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