Liu; Sheng-Tsung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Sheng-Tsung.The latest application filed is for "leadframe".
- Liu; Sheng-Tsung - Kaohsiung TW
- Liu; Sheng-Tsung - Kaohsiung City TW
- Liu, Sheng-Tsung - Nantz Chiu TW
- Liu, Sheng-Tsung - Kaohslung TW
| Patent | Date |
|---|---|
| Leadframe Grant 7,939,921 - Liu May 10, 2 | 2011-05-10 |
| Leadframe App 20100059871 - Liu; Sheng-Tsung | 2010-03-11 |
| Semiconductor package, method for manufacturing the same and lead frame for use in the same Grant 7,425,755 - Liu September 16, 2 | 2008-09-16 |
| Ball grid array package and method thereof App 20080096314 - Liu; Sheng Tsung | 2008-04-24 |
| Method for manufacturing ball grid array package Grant 7,326,590 - Liu February 5, 2 | 2008-02-05 |
| Ball grid array package and method thereof Grant 7,315,085 - Liu January 1, 2 | 2008-01-01 |
| Semiconductor package Grant 7,279,784 - Liu October 9, 2 | 2007-10-09 |
| Semiconductor package with encapsulated passive component Grant 7,268,437 - Liu September 11, 2 | 2007-09-11 |
| Prevention of contamination on bonding pads of wafer during SMT Grant 7,245,011 - Liu July 17, 2 | 2007-07-17 |
| Mesh shaped dam mounted on a substrate Grant 7,180,181 - Liu , et al. February 20, 2 | 2007-02-20 |
| Semiconductor package Grant 7,091,607 - Liu August 15, 2 | 2006-08-15 |
| Circuitized substrate for fixing solder beads on pads Grant 7,045,902 - Liu May 16, 2 | 2006-05-16 |
| Substrate with reinforced contact pad structure Grant 7,005,750 - Liu February 28, 2 | 2006-02-28 |
| Semiconductor package with encapsulated passive component App 20050253231 - Liu, Sheng-Tsung | 2005-11-17 |
| Semiconductor package App 20050200007 - Liu, Sheng Tsung | 2005-09-15 |
| Semiconductor package App 20050127494 - Liu, Sheng Tsung | 2005-06-16 |
| Method for manufacturing ball grid array package App 20050095752 - Liu, Sheng-Tsung | 2005-05-05 |
| BGA package with component protection on bottom App 20050093153 - Liu, Sheng-Tsung | 2005-05-05 |
| Substrate for use in forming electronic package App 20050094383 - Liu, Sheng Tsung | 2005-05-05 |
| Semiconductor package, method for manufacturing the same and lead frame for use in the same App 20050093177 - Liu, Sheng Tsung | 2005-05-05 |
| Ball grid array package and method thereof App 20050087867 - Liu, Sheng Tsung | 2005-04-28 |
| Circuitized substrate for fixing solder beads on pads App 20050082686 - Liu, Sheng-Tsung | 2005-04-21 |
| Substrate with mesh App 20050082680 - Liu, Pai-Chou ; et al. | 2005-04-21 |
| Prevention of contamination on bonding pads of wafer during SMT App 20050082682 - Liu, Sheng-Tsung | 2005-04-21 |
| Substrate with reinforced contact pad structure App 20050023679 - Liu, Sheng-Tsung | 2005-02-03 |
| Semiconductor device Grant 6,833,611 - Liu , et al. December 21, 2 | 2004-12-21 |
| Substrate board structure Grant 6,833,512 - Liu December 21, 2 | 2004-12-21 |
| [method Of Assembling Passive Component] App 20040127011 - HUANG, MIN-LUNG ; et al. | 2004-07-01 |
| Packaging structure integrating passive devices Grant 6,713,836 - Liu , et al. March 30, 2 | 2004-03-30 |
| Semiconductor device App 20040032019 - Liu, Sheng-Tsung ; et al. | 2004-02-19 |
| Substrate board structure App 20030136582 - Liu, Sheng-Tsung | 2003-07-24 |
| Packaging structure integrating passive devices App 20020195693 - Liu, Sheng-Tsung ; et al. | 2002-12-26 |
| Electronic package with surface-mountable device built therein Grant 6,486,535 - Liu November 26, 2 | 2002-11-26 |
| Electronic Package With Surface-mountable Device Built Therein App 20020135049 - Liu, Sheng Tsung | 2002-09-26 |
| Semiconductor device Grant 6,429,536 - Liu , et al. August 6, 2 | 2002-08-06 |
| Semiconductor device App 20020096732 - Liu, Sheng-Tsung ; et al. | 2002-07-25 |
| Substrate for use in forming electronic package Grant 6,423,908 - Liu July 23, 2 | 2002-07-23 |
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