| Patent | Date |
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3D Integrated Circuit and Methods of Forming the Same
App 20220310449 - Kuang; Hsun-Chung ; et al. | 2022-09-29 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
3D Integrated Circuit and Methods of Forming the Same
App 20220208607 - Kuang; Hsun-Chung ; et al. | 2022-06-30 |
Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer
App 20220204340 - Lin; Hung-Hua ; et al. | 2022-06-30 |
Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
Grant 11,279,615 - Lin , et al. March 22, 2 | 2022-03-22 |
Integrate rinse module in hybrid bonding platform
Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
Patterning A Transparent Wafer To Form An Alignment Mark In The Transparent Wafer
App 20210375780 - Huang; Xin-Hua ; et al. | 2021-12-02 |
Method for alignment, process tool and method for wafer-level alignment
Grant 11,189,515 - Wang , et al. November 30, 2 | 2021-11-30 |
Simultaneous Bonding Approach For High Quality Wafer Stacking Applications
App 20210335646 - Huang; Xin-Hua ; et al. | 2021-10-28 |
Dual Facing BSI Image Sensors With Wafer Level Stacking
App 20210305292 - Liu; Ping-Yin ; et al. | 2021-09-30 |
Semiconductor structure and associated manufacturing method
Grant 11,127,725 - Liu , et al. September 21, 2 | 2021-09-21 |
Deposition System For High Accuracy Patterning
App 20210273167 - Liu; Ping-Yin ; et al. | 2021-09-02 |
Apparatus For Bond Wave Propagation Control
App 20210272928 - Huang; Xin-Hua ; et al. | 2021-09-02 |
Simultaneous bonding approach for high quality wafer stacking applications
Grant 11,094,575 - Huang , et al. August 17, 2 | 2021-08-17 |
Dual facing BSI image sensors with wafer level stacking
Grant 11,037,978 - Liu , et al. June 15, 2 | 2021-06-15 |
Apparatus for bond wave propagation control
Grant 11,031,369 - Huang , et al. June 8, 2 | 2021-06-08 |
Method of forming semiconductor package and semiconductor package
Grant 11,014,805 - Cheng , et al. May 25, 2 | 2021-05-25 |
3D Integrated Circuit and Methods of Forming the Same
App 20210151353 - Kuang; Hsun-Chung ; et al. | 2021-05-20 |
Approach for ultra thin-film transfer and handling
Grant 10,962,878 - Liu , et al. March 30, 2 | 2021-03-30 |
3D Integrated Circuit and Methods of Forming the Same
App 20210013098 - Kuang; Hsun-Chung ; et al. | 2021-01-14 |
Simultaneous Bonding Approach For High Quality Wafer Stacking Applications
App 20200381283 - Huang; Xin-Hua ; et al. | 2020-12-03 |
3D integrated circuit and methods of forming the same
Grant 10,790,189 - Kuang , et al. September 29, 2 | 2020-09-29 |
Method of manufacturing semiconductor structure
Grant 10,781,098 - Lin , et al. Sept | 2020-09-22 |
Method For Alignment, Process Tool And Method For Wafer-level Alignment
App 20200227298 - Wang; Ching-Hung ; et al. | 2020-07-16 |
Semiconductor Structure And Associated Manufacturing Method
App 20200185369 - LIU; PING-YIN ; et al. | 2020-06-11 |
Integrate rinse module in hybrid bonding platform
Grant 10,665,449 - Huang , et al. | 2020-05-26 |
Method for alignment, process tool and method for wafer-level alignment
Grant 10,636,688 - Wang , et al. | 2020-04-28 |
Stacked LED structure and associated manufacturing method
Grant 10,622,342 - Liu , et al. | 2020-04-14 |
Novel Approach For Ultra Thin-film Transfer And Handling
App 20200064730 - Liu; Ping-Yin ; et al. | 2020-02-27 |
Apparatus For Bond Wave Propagation Control
App 20200051950 - Huang; Xin-Hua ; et al. | 2020-02-13 |
Dual Facing BSI Image Sensors with Wafer Level Stacking
App 20200052014 - Liu; Ping-Yin ; et al. | 2020-02-13 |
Method Of Forming Semiconductor Package And Semiconductor Package
App 20200002161 - CHENG; Chun-wen ; et al. | 2020-01-02 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
Bond Alignment Method For High Accuracy And High Throughput
App 20190393067 - Wang; Ching-Hung ; et al. | 2019-12-26 |
Approach for ultra thin-film transfer and handling
Grant 10,509,312 - Liu , et al. Dec | 2019-12-17 |
Methods for hybrid wafer bonding integrated with CMOS processing
Grant 10,510,597 - Tseng , et al. Dec | 2019-12-17 |
Apparatus for bond wave propagation control
Grant 10,497,667 - Huang , et al. De | 2019-12-03 |
Dual facing BSI image sensors with wafer level stacking
Grant 10,453,889 - Liu , et al. Oc | 2019-10-22 |
Method Of Manufacturing Semiconductor Structure
App 20190256352 - LIN; HUNG-HUA ; et al. | 2019-08-22 |
Method of forming micro electromechanical system sensor
Grant 10,384,933 - Cheng , et al. A | 2019-08-20 |
Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer
App 20190241430 - Lin; Hung-Hua ; et al. | 2019-08-08 |
Bond rings in semiconductor devices and methods of forming same
Grant 10,351,418 - Chen , et al. July 16, 2 | 2019-07-16 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 10,354,972 - Liu , et al. July 16, 2 | 2019-07-16 |
Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
Grant 10,294,098 - Lin , et al. | 2019-05-21 |
Semiconductor Structure And Associated Manufacturing Method
App 20190139949 - LIU; PING-YIN ; et al. | 2019-05-09 |
Semiconductor structure and manufacturing method thereof
Grant 10,280,076 - Lin , et al. | 2019-05-07 |
Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
Grant 10,283,448 - Liu , et al. | 2019-05-07 |
Apparatus For Bond Wave Propagation Control
App 20190096848 - Huang; Xin-Hua ; et al. | 2019-03-28 |
Novel Approach For Ultra Thin-film Transfer And Handling
App 20190094682 - Liu; Ping-Yin ; et al. | 2019-03-28 |
a method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer
App 20190092627 - Lin; Hung-Hua ; et al. | 2019-03-28 |
Hybrid Bonding Systems and Methods for Semiconductor Wafers
App 20190051628 - Liu; Ping-Yin ; et al. | 2019-02-14 |
3D Integrated Circuit and Methods of Forming the Same
App 20190035681 - Kuang; Hsun-Chung ; et al. | 2019-01-31 |
Method and apparatus for a semiconductor structure
Grant 10,160,638 - Chu , et al. Dec | 2018-12-25 |
Wafer bonding process and structure
Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 10,103,122 - Liu , et al. October 16, 2 | 2018-10-16 |
Method and apparatus for image sensor packaging
Grant 10,096,645 - Chen , et al. October 9, 2 | 2018-10-09 |
3D integrated circuit and methods of forming the same
Grant 10,090,196 - Kuang , et al. October 2, 2 | 2018-10-02 |
Bond Rings in Semiconductor Devices and Methods of Forming Same
App 20180230003 - Chen; Chih-Ming ; et al. | 2018-08-16 |
Apparatus and method for wafer level bonding
Grant 10,049,901 - Liu , et al. August 14, 2 | 2018-08-14 |
Multiple Metal Layer Semiconductor Device and Low Temperature Stacking Method of Fabricating the Same
App 20180226337 - Liu; Ping-Yin ; et al. | 2018-08-09 |
Alignment systems and wafer bonding systems and methods
Grant 10,037,968 - Huang , et al. July 31, 2 | 2018-07-31 |
Graphene pellicle for extreme ultraviolet lithography
Grant 10,012,899 - Tu , et al. July 3, 2 | 2018-07-03 |
Hybrid bonding mechanisms for semiconductor wafers
Grant 9,960,129 - Liu , et al. May 1, 2 | 2018-05-01 |
Bond rings in semiconductor devices and methods of forming same
Grant 9,957,156 - Chen , et al. May 1, 2 | 2018-05-01 |
Apparatus and method for cleaning
Grant 9,953,847 - Liu , et al. April 24, 2 | 2018-04-24 |
Hybrid bonding system and cleaning method thereof
Grant 9,917,069 - Liu , et al. March 13, 2 | 2018-03-13 |
Graphene Pellicle for Extreme Ultraviolet Lithography
App 20180059534 - Tu; Chih-Chiang ; et al. | 2018-03-01 |
Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
Grant 9,887,155 - Liu , et al. February 6, 2 | 2018-02-06 |
Hybrid Bonding Systems and Methods for Semiconductor Wafers
App 20170358551 - Liu; Ping-Yin ; et al. | 2017-12-14 |
Apparatus and method for verification of bonding alignment
Grant 9,842,785 - Huang , et al. December 12, 2 | 2017-12-12 |
Structure and formation method of semiconductor device structure
Grant 9,834,435 - Liu , et al. December 5, 2 | 2017-12-05 |
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
App 20170338150 - Tseng; Pin-Nan ; et al. | 2017-11-23 |
Method Of Forming Micro Electromechanical System Sensor
App 20170313581 - CHENG; Chun-wen ; et al. | 2017-11-02 |
Dual Facing BSI Image Sensors with Wafer Level Stacking
App 20170317118 - Liu; Ping-Yin ; et al. | 2017-11-02 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170297902 - LIN; HUNG-HUA ; et al. | 2017-10-19 |
Air trench in packages incorporating hybrid bonding
Grant 9,786,628 - Chou , et al. October 10, 2 | 2017-10-10 |
Bond Rings In Semiconductor Devices And Methods Of Forming Same
App 20170275153 - Chen; Chih-Ming ; et al. | 2017-09-28 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,754,813 - Huang , et al. September 5, 2 | 2017-09-05 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 9,748,198 - Liu , et al. August 29, 2 | 2017-08-29 |
Alignment Systems And Wafer Bonding Systems And Methods
App 20170243853 - Huang; Xin-Hua ; et al. | 2017-08-24 |
Debonding schemes
Grant 9,741,681 - Huang , et al. August 22, 2 | 2017-08-22 |
Multiple swivel arm design in hybrid bonder
Grant 9,735,033 - Huang , et al. August 15, 2 | 2017-08-15 |
Micro electromechanical system sensor and method of forming the same
Grant 9,725,310 - Cheng , et al. August 8, 2 | 2017-08-08 |
Methods for hybrid wafer bonding integrated with CMOS processing
Grant 9,728,453 - Tseng , et al. August 8, 2 | 2017-08-08 |
Bonding System And Associated Apparatus And Method
App 20170207191 - HUANG; XIN-HUA ; et al. | 2017-07-20 |
Dual facing BSI image sensors with wafer level stacking
Grant 9,711,555 - Liu , et al. July 18, 2 | 2017-07-18 |
Semiconductor manufacturing method and associated semiconductor manufacturing system
Grant 9,704,820 - Huang , et al. July 11, 2 | 2017-07-11 |
Apparatus And Method For Wafer Level Bonding
App 20170140955 - Liu; Ping-Yin ; et al. | 2017-05-18 |
Alignment systems and wafer bonding systems and methods
Grant 9,646,860 - Huang , et al. May 9, 2 | 2017-05-09 |
Method and apparatus of holding a device
Grant 9,627,243 - Liu , et al. April 18, 2 | 2017-04-18 |
Self-removal anti-stiction coating for bonding process
Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
Debonding Schemes
App 20170077062 - Huang; Xin-Hua ; et al. | 2017-03-16 |
Air Trench in Packages Incorporating Hybrid Bonding
App 20170069593 - Chou; Bruce C.S. ; et al. | 2017-03-09 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20170053823 - Huang; Chih-Hui ; et al. | 2017-02-23 |
Apparatus and method for wafer level bonding
Grant 9,576,827 - Liu , et al. February 21, 2 | 2017-02-21 |
Apparatus And Method For Verification Of Bonding Alignment
App 20170047260 - Huang; Xin-Hua ; et al. | 2017-02-16 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
MEMS structures and methods for forming the same
Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
Grinding wheel for wafer edge trimming
Grant 9,527,188 - Huang , et al. December 27, 2 | 2016-12-27 |
Wafer Bonding Process and Structure
App 20160358882 - Liu; Ping-Yin ; et al. | 2016-12-08 |
Multiple Swivel Arm Design in Hybrid Bonder
App 20160351422 - Huang; Xin-Hua ; et al. | 2016-12-01 |
Debonding schemes
Grant 9,508,586 - Huang , et al. November 29, 2 | 2016-11-29 |
Air trench in packages incorporating hybrid bonding
Grant 9,502,396 - Chou , et al. November 22, 2 | 2016-11-22 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,490,158 - Huang , et al. November 8, 2 | 2016-11-08 |
Apparatus and method for verification of bonding alignment
Grant 9,478,471 - Huang , et al. October 25, 2 | 2016-10-25 |
Method and Apparatus for Image Sensor Packaging
App 20160307944 - Chen; Szu-Ying ; et al. | 2016-10-20 |
Semiconductor having a high aspect ratio via
Grant 9,472,504 - Hsieh , et al. October 18, 2 | 2016-10-18 |
Hybrid Bonding System And Cleaning Method Thereof
App 20160293567 - LIU; Ping-Yin ; et al. | 2016-10-06 |
Integrate rinse module in hybrid bonding platform
Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
Air trench in packages incorporating hybrid bonding
Grant 9,443,796 - Chou , et al. September 13, 2 | 2016-09-13 |
Wafer bonding process and structure
Grant 9,425,155 - Liu , et al. August 23, 2 | 2016-08-23 |
Self-removal Anti-stiction Coating For Bonding Process
App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
Method and apparatus for image sensor packaging
Grant 9,412,725 - Chen , et al. August 9, 2 | 2016-08-09 |
Apparatus and method for backside illuminated image sensors
Grant 9,406,711 - Chen , et al. August 2, 2 | 2016-08-02 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20160204020 - Huang; Chih-Hui ; et al. | 2016-07-14 |
Multiple swivel arm design in hybrid bonder
Grant 9,385,010 - Huang , et al. July 5, 2 | 2016-07-05 |
Low Contamination Chamber for Surface Activation
App 20160181073 - Liu; Ping-Yin ; et al. | 2016-06-23 |
Air Trench in Packages Incorporating Hybrid Bonding
App 20160163684 - Chou; Bruce C.S. ; et al. | 2016-06-09 |
3D Integrated Circuit and Methods of Forming the Same
App 20160155665 - Kuang; Hsun-Chung ; et al. | 2016-06-02 |
Hybrid bonding and apparatus for performing the same
Grant 9,331,032 - Liu , et al. May 3, 2 | 2016-05-03 |
Debonding Schemes
App 20160111316 - Huang; Xin-Hua ; et al. | 2016-04-21 |
Wafer level packaging bond
Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
Low contamination chamber for surface activation
Grant 9,293,303 - Liu , et al. March 22, 2 | 2016-03-22 |
3D integrated circuit and methods of forming the same
Grant 9,257,399 - Kuang , et al. February 9, 2 | 2016-02-09 |
Apparatus and Method for Wafer Level Bonding
App 20150357226 - Liu; Ping-Yin ; et al. | 2015-12-10 |
Hybrid Bonding Mechanisms For Semiconductor Wafers
App 20150357296 - LIU; Ping-Yin ; et al. | 2015-12-10 |
Multiple Swivel Arm Design In Hybrid Bonder
App 20150332939 - Huang; Xin-Hua ; et al. | 2015-11-19 |
Semiconductor Having A High Aspect Ratio Via
App 20150332968 - Hsieh; Yuan-Chih ; et al. | 2015-11-19 |
Hybrid Bonding Systems and Methods for Semiconductor Wafers
App 20150287694 - Liu; Ping-Yin ; et al. | 2015-10-08 |
MEMS Structures and Methods for Forming the Same
App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
Hybrid bonding mechanisms for semiconductor wafers
Grant 9,142,517 - Liu , et al. September 22, 2 | 2015-09-22 |
Apparatus for vertically integrated backside illuminated image sensors
Grant 9,136,302 - Wang , et al. September 15, 2 | 2015-09-15 |
Wafer Bonding Process and Structure
App 20150243611 - Liu; Ping-Yin ; et al. | 2015-08-27 |
Apparatus And Method For Verification Of Bonding Alignment
App 20150233698 - Huang; Xin-Hua ; et al. | 2015-08-20 |
Semiconductor having a high aspect ratio via
Grant 9,099,476 - Hsieh , et al. August 4, 2 | 2015-08-04 |
Micro Electromechanical System Sensor And Method Of Forming The Same
App 20150175407 - CHENG; Chun-wen ; et al. | 2015-06-25 |
MEMS structures and methods for forming the same
Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 9,048,283 - Liu , et al. June 2, 2 | 2015-06-02 |
MEMS device and method of formation thereof
Grant 9,034,677 - Huang , et al. May 19, 2 | 2015-05-19 |
3D Integrated Circuit and Methods of Forming the Same
App 20150108644 - Kuang; Hsun-Chung ; et al. | 2015-04-23 |
Dual Facing BSI Image Sensors with Wafer Level Stacking
App 20150091124 - Liu; Ping-Yin ; et al. | 2015-04-02 |
Method And Apparatus Of Holding A Device
App 20150072505 - Liu; Ping-Yin ; et al. | 2015-03-12 |
Apparatus And Method For Cleaning
App 20150068552 - LIU; PING-YIN ; et al. | 2015-03-12 |
Low Contamination Chamber for Surface Activation
App 20150064810 - Liu; Ping-Yin ; et al. | 2015-03-05 |
Alignment Systems and Wafer Bonding Systems and Methods
App 20150044786 - Huang; Xin-Hua ; et al. | 2015-02-12 |
Systems and methods of separating bonded wafers
Grant 8,945,344 - Huang , et al. February 3, 2 | 2015-02-03 |
Self-removal anti-stiction coating for bonding process
Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
Methods for Hybrid Wafer Bonding Integrated with CMOS Processing
App 20140273347 - Tseng; Pin-Nan ; et al. | 2014-09-18 |
Air Trench in Packages Incorporating Hybrid Bonding
App 20140264948 - Chou; Bruce C.S. ; et al. | 2014-09-18 |
Hybrid Bonding and Apparatus for Performing the Same
App 20140256087 - Liu; Ping-Yin ; et al. | 2014-09-11 |
MEMS Device and Method of Formation Thereof
App 20140248730 - Huang; Hsin-Ting ; et al. | 2014-09-04 |
Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
Grant 8,809,123 - Liu , et al. August 19, 2 | 2014-08-19 |
Methods for hybrid wafer bonding
Grant 8,802,538 - Liu , et al. August 12, 2 | 2014-08-12 |
Methods of bonding caps for MEMS devices
Grant 8,790,946 - Huang , et al. July 29, 2 | 2014-07-29 |
Method and Apparatus for a Semiconductor Structure
App 20140191341 - Chu; Li-Cheng ; et al. | 2014-07-10 |
Method to prevent metal pad damage in wafer level package
Grant 8,735,260 - Tsai , et al. May 27, 2 | 2014-05-27 |
Method and apparatus for selectively removing anti-stiction coating
Grant 8,728,845 - Lin , et al. May 20, 2 | 2014-05-20 |
Hybrid Bonding Mechanisms For Semiconductor Wafers
App 20140117546 - LIU; Ping-Yin ; et al. | 2014-05-01 |
Apparatus for Vertically Integrated Backside Illuminated Image Sensors
App 20140113398 - Wang; Tzu-Jui ; et al. | 2014-04-24 |
Multiple Metal Layer Semiconductor Device And Low Temperature Stacking Method Of Fabricating The Same
App 20140091438 - Liu; Ping-Yin ; et al. | 2014-04-03 |
Semiconductor Having a High Aspect Ratio Via
App 20140054779 - Hsieh; Yuan-Chih ; et al. | 2014-02-27 |
Grinding Wheel For Wafer Edge Trimming
App 20140051336 - HUANG; Xin-Hua ; et al. | 2014-02-20 |
Systems and Methods of Separating Bonded Wafers
App 20140020818 - Huang; Xin-Hua ; et al. | 2014-01-23 |
Apparatus for vertically integrated backside illuminated image sensors
Grant 8,629,524 - Wang , et al. January 14, 2 | 2014-01-14 |
Hybrid Bonding Systems and Methods for Semiconductor Wafers
App 20140011324 - Liu; Ping-Yin ; et al. | 2014-01-09 |
Apparatus and Method for Backside Illuminated Image Sensors
App 20130334638 - Chen; Szu-Ying ; et al. | 2013-12-19 |
Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers
App 20130320556 - Liu; Ping-Yin ; et al. | 2013-12-05 |
Method of fabricating a semiconductor device having recessed bonding site
Grant 8,580,594 - Huang , et al. November 12, 2 | 2013-11-12 |
Apparatus for Vertically Integrated Backside Illuminated Image Sensors
App 20130285180 - Wang; Tzu-Jui ; et al. | 2013-10-31 |
Method and Apparatus for Image Sensor Packaging
App 20130284885 - Chen; Szu-Ying ; et al. | 2013-10-31 |
Methods of Bonding Caps for MEMS Devices
App 20130203199 - Huang; Xin-Hua ; et al. | 2013-08-08 |
MEMS Structures and Methods for Forming the Same
App 20130099355 - Liu; Ping-Yin ; et al. | 2013-04-25 |
Method and structure for wafer to wafer bonding in semiconductor packaging
Grant 8,377,798 - Peng , et al. February 19, 2 | 2013-02-19 |
Mems Device And Method Of Formation Thereof
App 20130037891 - Huang; Hsin-Ting ; et al. | 2013-02-14 |
Method And Apparatus For Selectively Removing Anti-stiction Coating
App 20120244677 - Lin; Shih-Wei ; et al. | 2012-09-27 |
Method To Prevent Metal Pad Damage In Wafer Level Package
App 20120149152 - Tsai; Shang-Ying ; et al. | 2012-06-14 |
Self-removal Anti-stiction Coating For Bonding Process
App 20120148870 - Liu; Ping-Yin ; et al. | 2012-06-14 |
Method And Structure For Wafer To Wafer Bonding In Semiconductor Packaging
App 20120115305 - PENG; Jung-Huei ; et al. | 2012-05-10 |
Processing chamber with wave reflector
App 20060032447 - Liu; Ping-Yin ; et al. | 2006-02-16 |
Method for fabricating a diamond film having low surface roughness
Grant 6,972,049 - Liu , et al. December 6, 2 | 2005-12-06 |
Substrate temperature control apparatus
App 20050126490 - Hsieh, Chun-Hao ; et al. | 2005-06-16 |
Method for fabricating a diamond film having low surface roughness
App 20050028728 - Liu, Ping-Yin ; et al. | 2005-02-10 |
Microelement piezoelectric feedback type picking and releasing device
Grant 6,710,512 - Tsai , et al. March 23, 2 | 2004-03-23 |
Microelement piezoelectric feedback type picking and releasing device
App 20030234594 - Tsai, Hung-Yin ; et al. | 2003-12-25 |
Electric power recovering system
Grant 5,986,436 - Liu November 16, 1 | 1999-11-16 |
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