LIU; Pai-Chou
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIU; Pai-Chou.The latest application filed is for "semiconductor device package and method of manufacturing the same".
- LIU; Pai-Chou - Kaohsiung TW
- Liu; Pai-Chou - Kaohsiung City TW
- Liu; Pai-Chou - Kaoshiung TW
| Patent | Date |
|---|---|
| Semiconductor Device Package And Method Of Manufacturing The Same App 20210391278 - TAI; Li-Hua ; et al. | 2021-12-16 |
| Semiconductor device package and method of manufacturing the same Grant 11,107,774 - Tai , et al. August 31, 2 | 2021-08-31 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200335452 - TAI; Li-Hua ; et al. | 2020-10-22 |
| Substrate structure having N-SMD ball pads Grant 7,911,056 - Liu , et al. March 22, 2 | 2011-03-22 |
| Method for mounting a semiconductor package onto PCB Grant 7,728,441 - Liu , et al. June 1, 2 | 2010-06-01 |
| Surface mounting method Grant 7,662,709 - Liu , et al. February 16, 2 | 2010-02-16 |
| Method for mounting a semiconductor package onto PCB App 20080226877 - Liu; Pai-Chou ; et al. | 2008-09-18 |
| Package of leadframe with heatsinks Grant 7,365,422 - Liu , et al. April 29, 2 | 2008-04-29 |
| Method for mounting a semiconductor package onto PCB Grant 7,357,294 - Liu , et al. April 15, 2 | 2008-04-15 |
| Substrate structure having N-SMD ball pads App 20080042278 - Liu; Pai-Chou ; et al. | 2008-02-21 |
| Surface Mounting Method App 20070254469 - Liu; Pai-Chou ; et al. | 2007-11-01 |
| Package of leadframe with heatsinks App 20070069345 - Liu; Pai-Chou ; et al. | 2007-03-29 |
| Mesh shaped dam mounted on a substrate Grant 7,180,181 - Liu , et al. February 20, 2 | 2007-02-20 |
| Substrate with mesh App 20050082680 - Liu, Pai-Chou ; et al. | 2005-04-21 |
| Method for mounting a semiconductor package onto PCB App 20050061854 - Liu, Pai-Chou ; et al. | 2005-03-24 |
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