Liu; Ming-Sheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Ming-Sheng.The latest application filed is for "semiconductor device having a bump structure and method for manufacturing the same".
- Liu; Ming-Sheng - Hsinchu City TW
- Liu; Ming-Sheng - Hsinchu TW
| Patent | Date |
|---|---|
| Semiconductor Device Having A Bump Structure And Method For Manufacturing The Same App 20190214357 - Lee; Chun-Te ; et al. | 2019-07-11 |
| Semiconductor structure Grant 9,000,569 - Hsieh , et al. April 7, 2 | 2015-04-07 |
| Semiconductor Structure App 20150091141 - Hsieh; Chin-Tang ; et al. | 2015-04-02 |
| Semiconductor structure Grant 8,981,536 - Hsieh , et al. March 17, 2 | 2015-03-17 |
| Semiconductor Structure App 20150069584 - Hsieh; Chin-Tang ; et al. | 2015-03-12 |
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