Liu; Mengbin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Mengbin.The latest application filed is for "camera assembly, lens module, and electronic device".

Company Profile

19.15.22

Liu; Mengbin - Ningbo CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mask plate and fabrication method thereof Grant 11,444,244 - Liu , et al. September 13, 2	2022-09-13
Image capturing assembly, lens module and electronic device Grant 11,430,825 - Chen , et al. August 30, 2	2022-08-30
Package structure of wafer-level system-in-package Grant 11,309,279 - Liu , et al. April 19, 2	2022-04-19
Image capturing assembly and packaging method thereof, lens module, and electronic device Grant 11,296,141 - Chen , et al. April 5, 2	2022-04-05
Camera Assembly, Lens Module, And Electronic Device App 20220045112 - CHEN; Da ; et al.	2022-02-10
Camera assembly and packaging method thereof, lens module, electronic device Grant 11,171,166 - Chen , et al. November 9, 2	2021-11-09
Camera Assembly, Lens Module, And Electronic Device App 20210320095 - CHEN; Da ; et al.	2021-10-14
Semiconductor Device App 20210280527 - LIU; Mengbin	2021-09-09
Camera assembly and packaging method thereof, lens module, and electronic device Grant 11,069,670 - Chen , et al. July 20, 2	2021-07-20
Alignment mark and semiconductor device, and fabrication methods thereof Grant 11,049,816 - Liu June 29, 2	2021-06-29
Fingerprint Identification Module, Method For Forming Fingerprint Identification Module, And Electronic Device App 20210193903 - SHI; Hu ; et al.	2021-06-24
Image Capturing Assembly, Lens Module And Electronic Device App 20210066381 - CHEN; Da ; et al.	2021-03-04
Packaging method and package structure of wafer-level system-in-package Grant 10,930,617 - Liu February 23, 2	2021-02-23
Package Structure Of Wafer-level System-in-package App 20210043601 - LIU; Mengbin ; et al.	2021-02-11
Camera assembly and packaging methods thereof, lens module, and electronic device Grant 10,887,499 - Chen , et al. January 5, 2	2021-01-05
Packaging method and package structure of wafer-level system-in-package Grant 10,861,821 - Liu , et al. December 8, 2	2020-12-08
Image capturing assembly and packaging method thereof, lens module and electronic device Grant 10,861,895 - Chen , et al. December 8, 2	2020-12-08
Air Gap Type Semiconductor Device Package Structure And Fabrication Method Thereof App 20200366267 - DI; Yunxiang ; et al.	2020-11-19
Wafer-level system-in-package structure and electronic apparatus thereof Grant 10,811,385 - Liu October 20, 2	2020-10-20
Wafer-level packaging methods using a photolithographic bonding material Grant 10,755,979 - Shi , et al. A	2020-08-25
Methods and structures for wafer-level system in package Grant 10,756,056 - Liu A	2020-08-25
Camera Assembly And Packaging Methods Thereof, Lens Module, And Electronic Device App 20200162645 - CHEN; Da ; et al.	2020-05-21
Image Capturing Assembly And Packaging Method Thereof, Lens Module And Electronic Device App 20200161359 - CHEN; Da ; et al.	2020-05-21
Camera Assembly And Packaging Method Thereof, Lens Module, And Electronic Device App 20200161289 - CHEN; Da ; et al.	2020-05-21
Image Capturing Assembly And Packaging Method Thereof, Lens Module, And Electronic Device App 20200161346 - CHEN; Da ; et al.	2020-05-21
Alignment Mark And Semiconductor Device, And Fabrication Methods Thereof App 20200161251 - LIU; Mengbin	2020-05-21
Camera Assembly And Packaging Method, Lens Module And Electronic Device App 20200161356 - CHEN; Da ; et al.	2020-05-21
Camera Assembly And Packaging Method Thereof, Lens Module, Electronic Device App 20200161350 - CHEN; Da ; et al.	2020-05-21
Wafer-level Packaging Methods Using A Photolithographic Bonding Material App 20200135689 - SHI; Hu ; et al.	2020-04-30
Image Sensor Module And Method For Forming The Same App 20200098807 - LIU; Mengbin	2020-03-26
Image sensor module and method for forming the same Grant 10,490,589 - Liu Nov	2019-11-26
Packaging Method And Package Structure Of Wafer-level System-in-package App 20190341365 - LIU; Mengbin ; et al.	2019-11-07
Mask And Fabrication Method Thereof App 20190341265 - LIU; Mengbin ; et al.	2019-11-07
Mask Plate And Fabrication Method Thereof App 20190326514 - LIU; Mengbin ; et al.	2019-10-24
Methods And Structures For Wafer-level System In Package App 20190115314 - LIU; Mengbin	2019-04-18
Packaging Method And Package Structure Of Wafer-level System-in-package App 20190115316 - LIU; Mengbin	2019-04-18
Wafer-level System-in-package Structure And Electronic Apparatus Thereof App 20190103332 - LIU; Mengbin	2019-04-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.