Liu; Li-Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Li-Chung.The latest application filed is for "liquid dispersion with enhanced thermal conductivity containing inorganic particles".
- Liu; Li-Chung - Taoyuan TW
- Liu; Li Chung - Zhongli TW
- LIU; Li-Chung - Taichung City TW
- Liu; Li Chung - Zhongli City TW
- Liu; Li-Chung - Taoyuan City TW
- Liu; Li-Chung - Taichung TW
- Liu; Li-Chung - Jhubei TW
- Liu; Li-Chung - Jhubei City TW
| Patent | Date |
|---|---|
| Multiaxis machining device and compensation method thereof Grant 11,442,427 - Hwang , et al. September 13, 2 | 2022-09-13 |
| System and method for utilizing a tablet kickstand to power up an information handling system Grant 11,392,190 - Chang , et al. July 19, 2 | 2022-07-19 |
| Liquid Dispersion With Enhanced Thermal Conductivity Containing Inorganic Particles App 20220204829 - LIU; Li-Chung ; et al. | 2022-06-30 |
| System And Method For Utilizing A Tablet Kickstand To Power Up An Information Handling System App 20210271304 - Chang; Yaotsung ; et al. | 2021-09-02 |
| Multiaxis Machining Device and Compensation Method Thereof App 20210200180 - Hwang; Yi-Yuh ; et al. | 2021-07-01 |
| Dual operation centrifugal fan apparatus and methods of using same Grant 11,022,131 - Bhutani , et al. June 1, 2 | 2021-06-01 |
| Method Of Precisely Comparing And Positioning Speckle Patterns App 20200192113 - Hwang; Yi-Yuh ; et al. | 2020-06-18 |
| Method of precisely comparing and positioning speckle patterns Grant 10,670,877 - Hwang , et al. | 2020-06-02 |
| Error compensation device and error compensation method Grant 10,632,622 - Hwang , et al. | 2020-04-28 |
| Error Compensation Device And Method Thereof App 20190193271 - HWANG; YI-YUH ; et al. | 2019-06-27 |
| Measurement, calibration and compensation system and method for machine tool Grant 10,189,133 - Hwang , et al. Ja | 2019-01-29 |
| Measurement, Calibration And Compensation System And Method For Machine Tool App 20180178339 - HWANG; YI-YUH ; et al. | 2018-06-28 |
| Dual Operation Centrifugal Fan Apparatus And Methods Of Using Same App 20180112669 - Bhutani; Gurmeet S. ; et al. | 2018-04-26 |
| Dual operation centrifugal fan apparatus and methods of using same Grant 9,845,805 - Bhutani , et al. December 19, 2 | 2017-12-19 |
| Chemical mechanical polishing system Grant 8,739,806 - Liu , et al. June 3, 2 | 2014-06-03 |
| Chemical mechanical polishing system Grant 8,662,963 - Liu , et al. March 4, 2 | 2014-03-04 |
| Post-CMP wafer cleaning apparatus Grant 8,458,842 - Liu , et al. June 11, 2 | 2013-06-11 |
| Latching module mounting system Grant 8,437,133 - Bhutani , et al. May 7, 2 | 2013-05-07 |
| IHS securing system Grant 8,432,688 - Wang , et al. April 30, 2 | 2013-04-30 |
| Method For Cleaning A Semiconductor Wafer App 20120285484 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Post-cmp Wafer Cleaning Apparatus App 20120284936 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Chemical Mechanical Polishing System App 20120289133 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Method Of Cleaning A Wafer App 20120285483 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Chemical Mechanical Polishing System App 20120289128 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Cmp Slurry Mix And Delivery System App 20120289134 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Cmp Apparatus And Method App 20120289131 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Latching Module Mounting System App 20120120587 - Bhutani; Gurmeet S. ; et al. | 2012-05-17 |
| Dual operation centrifugal fan apparatus and methods of using same App 20120026677 - Bhutani; Gurmeet ; et al. | 2012-02-02 |
| Thermal sublimation imaging apparatus and thermal sublimation printer using the same Grant 8,100,596 - Hsu , et al. January 24, 2 | 2012-01-24 |
| Metal Laminate Via In-mold Film App 20120008271 - Bhutani; Gurmeet S. ; et al. | 2012-01-12 |
| IHS Securing System App 20120008277 - Wang; Chung-Wei ; et al. | 2012-01-12 |
| Thermal sublimation imaging apparatus and thermal sublimation printer using the same App 20090123208 - Hsu; Wei-Ting ; et al. | 2009-05-14 |
| Chemical Mechanical polishing apparatus App 20020173254 - Liu, Li-Chung ; et al. | 2002-11-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 