Liu; Kuowei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Kuowei.The latest application filed is for "low dielectric constant film produced from silicon compounds comprising silicon-carbon bond".

Company Profile

0.18.17

Liu; Kuowei - Santa Clara CA
Liu; Kuowei - Campbell CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond Grant 7,651,725 - Yau , et al. January 26, 2	2010-01-26
Low Dielectric Constant Film Produced From Silicon Compounds Comprising Silicon-carbon Bond App 20080061439 - Yau; Wai-Fan ; et al.	2008-03-13
Low Dielectric Constant Film Produced From Silicon Compounds Comprising Silicon-carbon Bond App 20080064225 - Yau; Wai-Fan ; et al.	2008-03-13
Low Dielectric Constant Film Produced From Silicon Compounds Comprising Silicon-carbon Bond App 20080044557 - YAU; WAI-FAN ; et al.	2008-02-21
Integrated low k dielectrics and etch stops Grant 7,227,244 - Bjorkman , et al. June 5, 2	2007-06-05
Method of depositing low k films Grant 7,160,821 - Huang , et al. January 9, 2	2007-01-09
Method of decreasing the k value in sioc layer deposited by chemical vapor deposition Grant 7,074,708 - Gaillard , et al. July 11, 2	2006-07-11
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds Grant 7,023,092 - Yau , et al. April 4, 2	2006-04-04
Method of depositing low k films App 20050260864 - Huang, Tzu-Fang ; et al.	2005-11-24
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds App 20050156317 - Yau, Wai-Fan ; et al.	2005-07-21
Integrated low K dielectrics and etch stops Grant 6,858,153 - Bjorkman , et al. February 22, 2	2005-02-22
Integrated low k dielectrics and etch stops App 20050023694 - Bjorkman, Claes H. ; et al.	2005-02-03
Method of depositing low K films Grant 6,806,207 - Huang , et al. October 19, 2	2004-10-19
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds App 20040201103 - Yau, Wai-Fan ; et al.	2004-10-14
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition Grant 6,784,119 - Gaillard , et al. August 31, 2	2004-08-31
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition App 20040166665 - Gaillard, Frederic ; et al.	2004-08-26
Method of depositing a low dielectric with organo silane Grant 6,770,556 - Yau , et al. August 3, 2	2004-08-03
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond App 20040147109 - Yau, Wai-Fan ; et al.	2004-07-29
Method of depositing a low K dielectric with organo silane Grant 6,730,593 - Yau , et al. May 4, 2	2004-05-04
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition App 20040029400 - Gaillard, Frederic ; et al.	2004-02-12
Integrated low k dielectrics and etch stops Grant 6,669,858 - Bjorkman , et al. December 30, 2	2003-12-30
Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition Grant 6,627,532 - Gaillard , et al. September 30, 2	2003-09-30
Method of depositing low K films App 20030162410 - Huang, Tzu-Fang ; et al.	2003-08-28
Method of depositing low k films using an oxidizing plasma Grant 6,593,247 - Huang , et al. July 15, 2	2003-07-15
Method of depositing a low dielectric with organo silane App 20030113992 - Yau, Wai-Fan ; et al.	2003-06-19
Method of depositing a low k dielectric with organo silane Grant 6,511,903 - Yau , et al. January 28, 2	2003-01-28
Method of depositing a low K dielectric with organo silane Grant 6,511,909 - Yau , et al. January 28, 2	2003-01-28
Method of depositing a low K dielectric with organo silane App 20020111042 - Yau, Wai-Fan ; et al.	2002-08-15
Intergrated low k dielectrics and etch stops App 20020084257 - Bjorkman, Claes H. ; et al.	2002-07-04
Integrated low k dielectrics and etch stops App 20020074309 - Bjorkman, Claes H. ; et al.	2002-06-20
Integrated low K dielectrics and etch stops Grant 6,340,435 - Bjorkman , et al. January 22, 2	2002-01-22
A Low Dielectric Constant Film Produced From Silicon Compounds Comprising Silicon-carbon Bonds App 20020000670 - YAU, WAI-FAN ; et al.	2002-01-03
Plasma Processes For Depositing Low Dielectric Constant Films App 20010004479 - CHEUNG, DAVID ; et al.	2001-06-21
Low power method of depositing a low k dielectric with organo silane Grant 6,072,227 - Yau , et al. June 6, 2	2000-06-06
Method of depositing a low k dielectric with organo silane Grant 6,054,379 - Yau , et al. April 25, 2	2000-04-25

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