LIU; Kuo-Yen

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIU; Kuo-Yen.The latest application filed is for "interconnect structure and forming method thereof".

Company Profile

6.6.7

LIU; Kuo-Yen - Hsinchu County TW
LIU; Kuo-Yen - Hsinchu TW
Liu; Kuo-Yen - Taipei TW
Liu, Kuo-Yen - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect Structure And Forming Method Thereof App 20220216165 - LIN; Jian-Hong ; et al.	2022-07-07
Method of fabricating semiconductor device including dummy via anchored to dummy metal layer Grant 11,302,654 - Lin , et al. April 12, 2	2022-04-12
Method of manufacturing via structures of semiconductor devices Grant 11,177,211 - Liu , et al. November 16, 2	2021-11-16
Method Of Fabricating Semiconductor Device App 20200411452 - LIN; Jian-Hong ; et al.	2020-12-31
Semiconductor device including dummy via anchored to dummy metal layer Grant 10,777,510 - Lin , et al. Sept	2020-09-15
Semiconductor Device And Manufacturing Method Thereof App 20200211957 - LIU; Kuo-Yen ; et al.	2020-07-02
Method of manufacturing semiconductor device with multi wire structure Grant 10,629,527 - Liu , et al.	2020-04-21
Semiconductor device and manufacturing method thereof Grant 10,269,697 - Liu , et al.	2019-04-23
Semiconductor Device And Manufacturing Method Thereof App 20190109087 - LIU; Kuo-Yen ; et al.	2019-04-11
Semiconductor Device And Method Of Fabrication Thereof App 20180151511 - Lin; Jian-Hong ; et al.	2018-05-31
Semiconductor Device And Manufacturing Method Thereof App 20170186686 - LIU; Kuo-Yen ; et al.	2017-06-29
Tungsten plug with conductor capping layer Grant 6,835,649 - Lee , et al. December 28, 2	2004-12-28
Tungsten plug with conductor capping layer App 20030224598 - Lee, Wei-Cheng ; et al.	2003-12-04

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