LIU; Kuang-hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIU; Kuang-hua.The latest application filed is for "pixel structure and manufacturing method of the same".
- LIU; Kuang-hua - New Taipei City TW
- Liu; Kuang-Hua - Kaohsiung TW
- Liu; Kuang-Hua - Tainan TW
- Liu; Kuang Hua - Sinshih Township TW
- Liu; Kuang-Hua - Kaohsiung City TW
| Patent | Date |
|---|---|
| Pixel Structure And Manufacturing Method Of The Same App 20130146931 - LIU; Kuang-hua ; et al. | 2013-06-13 |
| Flexible substrate for package of die Grant 7,443,013 - Liu , et al. October 28, 2 | 2008-10-28 |
| Chip carrier film having leads with improved strength and semiconductor package utilizing the film App 20080116561 - Liu; Kuang-Hua | 2008-05-22 |
| Semiconductor chip having fine pitch bumps and bumps thereon App 20070228555 - Huang; Min O ; et al. | 2007-10-04 |
| Flexible substrate for package App 20070080432 - Liu; Kuang-Hua ; et al. | 2007-04-12 |
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