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Semiconductor Wafer With Devices Having Different Top Layer Thicknesses
App 20220285403 - Singh; Gulbagh ; et al. | 2022-09-08 |
Seal Ring Structures And Methods Of Forming Same
App 20220278090 - Wu; Kuo-Ming ; et al. | 2022-09-01 |
Multi-function Substrate
App 20220189997 - Chen; Eugene I-Chun ; et al. | 2022-06-16 |
Semiconductor wafer with devices having different top layer thicknesses
Grant 11,348,944 - Singh , et al. May 31, 2 | 2022-05-31 |
Seal ring structures and methods of forming same
Grant 11,342,322 - Wu , et al. May 24, 2 | 2022-05-24 |
Transistor Structure
App 20210335669 - Hsiao; Shih-Yin ; et al. | 2021-10-28 |
Semiconductor Wafer With Devices Having Different Top Layer Thicknesses
App 20210327902 - Singh; Gulbagh ; et al. | 2021-10-21 |
Apparatus For Bond Wave Propagation Control
App 20210272928 - Huang; Xin-Hua ; et al. | 2021-09-02 |
Transistor structure
Grant 11,088,027 - Hsiao , et al. August 10, 2 | 2021-08-10 |
Semiconductor-on-insulator Wafer Having A Composite Insulator Layer
App 20210193684 - Liu; Kuan-Liang ; et al. | 2021-06-24 |
Apparatus for bond wave propagation control
Grant 11,031,369 - Huang , et al. June 8, 2 | 2021-06-08 |
High Voltage Semiconductor Device
App 20210119014 - Hsiao; Shih-Yin ; et al. | 2021-04-22 |
Method Of Forming Semiconductor-on-insulator (soi) Substrate
App 20210098281 - Wu; Cheng-Ta ; et al. | 2021-04-01 |
Semiconductor-on-insulator Wafer Having A Composite Insulator Layer
App 20210091118 - Liu; Kuan-Liang ; et al. | 2021-03-25 |
Semiconductor-on-insulator wafer having a composite insulator layer
Grant 10,950,631 - Liu , et al. March 16, 2 | 2021-03-16 |
High voltage semiconductor device and manufacturing method thereof
Grant 10,903,334 - Hsiao , et al. January 26, 2 | 2021-01-26 |
Method For Forming Hybrid-bonding Structure
App 20210005558 - WU; Kuo-Ming ; et al. | 2021-01-07 |
Transistor Structure
App 20200402857 - Hsiao; Shih-Yin ; et al. | 2020-12-24 |
Seal Ring Structures And Methods Of Forming Same
App 20200350302 - Wu; Kuo-Ming ; et al. | 2020-11-05 |
Transistor structure
Grant 10,796,964 - Hsiao , et al. October 6, 2 | 2020-10-06 |
Metal line design for hybrid-bonding application
Grant 10,790,240 - Wu , et al. September 29, 2 | 2020-09-29 |
Method of manufacturing semiconductor structure
Grant 10,781,098 - Lin , et al. Sept | 2020-09-22 |
Seal ring structures and methods of forming same
Grant 10,727,218 - Wu , et al. | 2020-07-28 |
Light Detectable Thermal-release Pressure-sensitive Adhesive And Application Thereof
App 20200231845 - YANG; YI-CHEN ; et al. | 2020-07-23 |
High Voltage Semiconductor Device And Manufacturing Method Thereof
App 20200212201 - Hsiao; Shih-Yin ; et al. | 2020-07-02 |
Method For Forming A Semiconductor-on-insulator (soi) Substrate
App 20200135541 - Wu; Cheng-Ta ; et al. | 2020-04-30 |
High voltage semiconductor device and manufacturing method thereof
Grant 10,629,697 - Hsiao , et al. | 2020-04-21 |
Apparatus For Bond Wave Propagation Control
App 20200051950 - Huang; Xin-Hua ; et al. | 2020-02-13 |
Method for forming a semiconductor-on-insulator (SOI) substrate
Grant 10,553,474 - Wu , et al. Fe | 2020-02-04 |
Apparatus for bond wave propagation control
Grant 10,497,667 - Huang , et al. De | 2019-12-03 |
Seal ring structures and methods of forming same
Grant 10,453,832 - Wu , et al. Oc | 2019-10-22 |
Transistor Structure
App 20190287860 - Hsiao; Shih-Yin ; et al. | 2019-09-19 |
Method Of Manufacturing Semiconductor Structure
App 20190256352 - LIN; HUNG-HUA ; et al. | 2019-08-22 |
Method for preventing dishing during the manufacture of semiconductor devices
Grant 10,373,876 - Hsiao , et al. | 2019-08-06 |
Transistor structure
Grant 10,373,872 - Hsiao , et al. | 2019-08-06 |
Semiconductor structure and manufacturing method thereof
Grant 10,280,076 - Lin , et al. | 2019-05-07 |
Transistor Structure
App 20190115260 - Hsiao; Shih-Yin ; et al. | 2019-04-18 |
Seal Ring Structures And Methods Of Forming Same
App 20190109125 - Wu; Kuo-Ming ; et al. | 2019-04-11 |
Apparatus For Bond Wave Propagation Control
App 20190096848 - Huang; Xin-Hua ; et al. | 2019-03-28 |
Method of fabricating a transistor with reduced hot carrier injection effects
Grant 10,147,800 - Liu , et al. De | 2018-12-04 |
Metal Line Design For Hybrid-bonding Application
App 20180269161 - WU; Kuo-Ming ; et al. | 2018-09-20 |
Method For Preventing Dishing During The Manufacture Of Semiconductor Devices
App 20180233416 - Hsiao; Shih-Yin ; et al. | 2018-08-16 |
Seal Ring Structures And Methods Of Forming Same
App 20180175012 - Wu; Kuo-Ming ; et al. | 2018-06-21 |
High-voltage metal-oxide-semiconductor transistor and fabrication method thereof
Grant 9,985,129 - Hsiao , et al. May 29, 2 | 2018-05-29 |
Method for preventing dishing during the manufacture of semiconductor devices
Grant 9,978,647 - Hsiao , et al. May 22, 2 | 2018-05-22 |
High Voltage Semiconductor Device And Manufacturing Method Thereof
App 20180114842 - Hsiao; Shih-Yin ; et al. | 2018-04-26 |
High-voltage Metal-oxide-semiconductor Transistor And Fabrication Method Thereof
App 20180097104 - Hsiao; Shih-Yin ; et al. | 2018-04-05 |
High-voltage metal-oxide-semiconductor transistor and fabrication method thereof
Grant 9,859,417 - Hsiao , et al. January 2, 2 | 2018-01-02 |
High-voltage Metal-oxide-semiconductor Transistor And Fabrication Method Thereof
App 20170345926 - Hsiao; Shih-Yin ; et al. | 2017-11-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170297902 - LIN; HUNG-HUA ; et al. | 2017-10-19 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,754,813 - Huang , et al. September 5, 2 | 2017-09-05 |
Method Of Fabricating A Transistor With Reduced Hot Carrier Injection Effects
App 20170243950 - Liu; Kuan-Liang ; et al. | 2017-08-24 |
Semiconductor device and method for forming the same
Grant 9,741,850 - Hsiao , et al. August 22, 2 | 2017-08-22 |
Bonding System And Associated Apparatus And Method
App 20170207191 - HUANG; XIN-HUA ; et al. | 2017-07-20 |
Method For Preventing Dishing During The Manufacture Of Semiconductor Devices
App 20170186652 - Hsiao; Shih-Yin ; et al. | 2017-06-29 |
Isolation structure and method for fabricating the same
Grant 9,647,060 - Hsiao , et al. May 9, 2 | 2017-05-09 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20170053823 - Huang; Chih-Hui ; et al. | 2017-02-23 |
Isolation Structure And Method For Fabricating The Same
App 20170047397 - Hsiao; Shih-Yin ; et al. | 2017-02-16 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,490,158 - Huang , et al. November 8, 2 | 2016-11-08 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20160204020 - Huang; Chih-Hui ; et al. | 2016-07-14 |
Acoustic camera
Grant 8,174,925 - Bai , et al. May 8, 2 | 2012-05-08 |
Acoustic camera
App 20100272286 - Bai; Mingsian R. ; et al. | 2010-10-28 |
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