Liu; Jin-Biao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Jin-Biao.The latest application filed is for "thermal module".
- Liu; Jin-Biao - Shenzhen N/A CN
- LIU; JIN-BIAO - Shenzhen City CN
- Liu; Jin-Biao - Guangdong CN
| Patent | Date |
|---|---|
| Light emitting diode lamp Grant D694,934 - Zheng , et al. December 3, 2 | 2013-12-03 |
| Heat dissipation device and method for manufacturing the same Grant 7,990,713 - Liu , et al. August 2, 2 | 2011-08-02 |
| Thermal Module App 20110017430 - LIAN; ZHI-SHENG ; et al. | 2011-01-27 |
| Toolless locking device Grant 7,869,217 - Chen , et al. January 11, 2 | 2011-01-11 |
| Heat Dissipation Device And Method For Manufacturing The Same App 20100246127 - LIU; XIN-LEI ; et al. | 2010-09-30 |
| Heat dissipation device Grant 7,782,623 - Liu August 24, 2 | 2010-08-24 |
| Heat sink Grant 7,690,418 - Chen , et al. April 6, 2 | 2010-04-06 |
| Locking Device For Heat Sink App 20100053904 - CHEN; CHUN-CHI ; et al. | 2010-03-04 |
| Heat Dissipation Device App 20100053906 - Liu; Jin-Biao | 2010-03-04 |
| Heat Dissipation Device With Heat Pipe App 20090279251 - LIU; JIN-BIAO ; et al. | 2009-11-12 |
| Heat dissipation device with heat pipe Grant 7,613,001 - Liu , et al. November 3, 2 | 2009-11-03 |
| Heat dissipation device having a fan holder for attachment of a fan Grant 7,606,028 - Liu October 20, 2 | 2009-10-20 |
| Heat Sink App 20090165999 - LIU; JIN-BIAO | 2009-07-02 |
| Heat Dissipation Device Having A Fan Holder For Attachment Of A Fan App 20090161314 - LIU; JIN-BIAO | 2009-06-25 |
| Heat dissipation device assembly Grant 7,447,035 - Liu , et al. November 4, 2 | 2008-11-04 |
| Electronic cooling system having a ventilating duct Grant 7,414,841 - Chen , et al. August 19, 2 | 2008-08-19 |
| Heat Dissipation Device Assembly App 20080130239 - LIU; JIN-BIAO ; et al. | 2008-06-05 |
| Fixing Apparatus For Heat Sink App 20070263363 - LIU; JIN-BIAO ; et al. | 2007-11-15 |
| Heat sink Grant 7,289,322 - Chen , et al. October 30, 2 | 2007-10-30 |
| Memory Module Assembly Including Heat Dissipating Members App 20070247819 - CHEN; CHUN-CHI ; et al. | 2007-10-25 |
| Heat dissipation device with heat pipes Grant 7,277,287 - Chen , et al. October 2, 2 | 2007-10-02 |
| Heat Sink App 20070215335 - Chen; Chun-Chi ; et al. | 2007-09-20 |
| Electronic Cooling System Having A Ventilating Duct App 20070165374 - Chen; Chun-Chi ; et al. | 2007-07-19 |
| Heat Sink App 20070144705 - Chen; Chun-Chi ; et al. | 2007-06-28 |
| Heat-dissipating Fin Assembly For Heat Sink App 20070114006 - Chen; Chun-Chi ; et al. | 2007-05-24 |
| Heat Sink App 20070091568 - Chen; Chun-Chi ; et al. | 2007-04-26 |
| Heat Dissipation Device With Heat Pipes App 20060273137 - Chen; Chun-Chi ; et al. | 2006-12-07 |
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