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Patent applications and USPTO patent grants for Liu; Jacson.The latest application filed is for "shallow trench isolation method for a semiconductor wafer".
Patent | Date |
---|---|
Shallow trench isolation method for a semiconductor wafer Grant 7,045,435 - Liu May 16, 2 | 2006-05-16 |
Shallow Trench Isolation Method for a Semiconductor Wafer App 20050191822 - Liu, Jacson | 2005-09-01 |
Method of simultaneously implementing differential gate oxide thickness using fluorine bearing impurities Grant 6,784,115 - Ni , et al. August 31, 2 | 2004-08-31 |
Process for forming self-aligned contact of semiconductor device Grant 6,218,275 - Huang , et al. April 17, 2 | 2001-04-17 |
Method for forming self-aligned contact hole Grant 6,146,997 - Liu , et al. November 14, 2 | 2000-11-14 |
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