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Patent applications and USPTO patent grants for Liu; Hsiu-Chi.The latest application filed is for "semiconductor device package and method of manufacturing the same".
Patent | Date |
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Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same Grant 11,342,282 - Shih , et al. May 24, 2 | 2022-05-24 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20210265280 - SHIH; Hsu-Chiang ;   et al. | 2021-08-26 |
Semiconductor package structure and method for manufacturing the same Grant 11,094,649 - Min , et al. August 17, 2 | 2021-08-17 |
Semiconductor Package Structure And Method For Manufacturing The Same App 20210225781 - MIN; Fan-Yu ;   et al. | 2021-07-22 |
Semiconductor package structure Grant 10,943,843 - Liu , et al. March 9, 2 | 2021-03-09 |
Semiconductor Package Structure And A Method Of Manufacturing The Same App 20200219845 - LIU; Hsiu-Chi ;   et al. | 2020-07-09 |
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