Liu; Hsing-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Hsing-Chih.The latest application filed is for "semiconductor package having improved thermal interface between semiconductor die and heat spreading structure".

Company Profile

7.8.18

Liu; Hsing-Chih - Hsin-Chu TW
LIU; Hsing-Chih - Hsinchu City TW
Liu; Hsing-Chih - Hsinchu TW
Liu; Hsing-Chih - Taichung City TW
Liu; Hsing-Chih - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20220285297 - Hsu; Chia-Hao ; et al.	2022-09-08
Semiconductor Package Structure App 20220223512 - KUO; Che-Hung ; et al.	2022-07-14
Semiconductor Package Structure App 20220223491 - KUO; Che-Hung ; et al.	2022-07-14
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Grant 11,302,657 - Hsu , et al. April 12, 2	2022-04-12
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20220102297 - Hsu; Chia-Hao ; et al.	2022-03-31
Semiconductor package Grant 11,244,913 - Chen , et al. February 8, 2	2022-02-08
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Grant 11,227,846 - Hsu , et al. January 18, 2	2022-01-18
Semiconductor Package Structure App 20220013441 - LIU; Hsing-Chih ; et al.	2022-01-13
Via Array Design For Multi-layer Redistribution Circuit Structure App 20210351124 - Kuo; Che-Hung ; et al.	2021-11-11
Semiconductor Device App 20210193540 - Chen; Nan-Cheng ; et al.	2021-06-24
Semiconductor Package Having Discrete Antenna Device App 20210036405 - Han; Fu-Yi ; et al.	2021-02-04
Semiconductor package with reduced noise Grant 10,910,323 - Lin , et al. February 2, 2	2021-02-02
Semiconductor Package App 20200402931 - CHEN; Ying-Chih ; et al.	2020-12-24
Semiconductor package having discrete antenna device Grant 10,847,869 - Han , et al. November 24, 2	2020-11-24
Semiconductor Package Having Discrete Antenna Device App 20200303806 - Wu; Wen-Chou ; et al.	2020-09-24
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20200243462 - Hsu; Chia-Hao ; et al.	2020-07-30
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die And Heat Spreading Structure App 20200243464 - Hsu; Chia-Hao ; et al.	2020-07-30
Semiconductor Package With Reduced Noise App 20200058633 - Lin; Sheng-Mou ; et al.	2020-02-20
Method For Fabricating Microelectronic Package With Surface Mounted Passive Element App 20180294255 - Liu; Hsing-Chih	2018-10-11
System-in-package and fabrication method thereof Grant 10,074,628 - Liu , et al. September 11, 2	2018-09-11
Bonding pad arrangement design for multi-die semiconductor package structure Grant 9,991,227 - Liu , et al. June 5, 2	2018-06-05
Semiconductor Device App 20180102298 - Chen; Nan-Cheng ; et al.	2018-04-12
Bonding Pad Arrangment Design For Multi-die Semiconductor Package Structure App 20170103967 - LIU; Hsing-Chih ; et al.	2017-04-13
System-in-package And Fabrication Method Thereof App 20160293575 - Liu; Hsing-Chih ; et al.	2016-10-06
Bonding Pad Arrangment Design For Multi-die Semiconductor Package Structure App 20150333039 - LIU; Hsing-Chih ; et al.	2015-11-19
Bonding pad arrangment design for multi-die semiconductor package structure Grant 9,129,962 - Liu , et al. September 8, 2	2015-09-08

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