Liu; Hsien-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Hsien-Wen.The latest application filed is for "multi-chip packages".
Company Profile
37.183.192
- Liu; Hsien-Wen - Hsinchu TW
- Liu; Hsien-Wen - Hsinchu City TW
- Liu; Hsien-Wen - Taoyuan County TW
- Liu; Hsien-Wen - Luzhu Township Taoyuan County TW
- Liu; Hsien-Wen - Taoyuan TW
- LIU; Hsien-Wen - Taoyuan City TW
- Liu; Hsien-Wen - Hsin-Chu TW
- Liu; Hsien-Wen - Taipei TW
- Liu; Hsien-Wen - Taoyuan Hsien TW
- Liu; Hsien-Wen - New Taipei TW
- LIU; HSIEN-WEN - NEW TAIPEI CITY TW
- Liu; Hsien-Wen - Kaohsiung TW
- Liu; Hsien-Wen - Kaohsiung City TW
- Liu; Hsien-Wen - Keelung N/A TW
- Liu; Hsien Wen - Luzhu Township, Taoyuan County N/A TW
- LIU; Hsien-Wen - Keelung City TW
- LIU; HSIEN-WEN - Taoyuan County 338 TW
- Liu; Hsien-Wen - Taichung TW
- Liu; Hsien-Wen - Taichung City TW
- Liu; Hsien-Wen - Taipei City TW
- Liu; Hsien-Wen - Tainan TW
- Liu; Hsien-Wen - Taiwan TW
- Liu, Hsien-Wen - Ching-Shui Li TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor package with dual sides of metal routing Grant 11,456,257 - Jeng , et al. September 27, 2 | 2022-09-27 |
| Structure and formation method of package structure with fan-out structure Grant 11,430,739 - Tsai , et al. August 30, 2 | 2022-08-30 |
| Multi-chip Packages App 20220246579 - Chen; Shuo-Mao ; et al. | 2022-08-04 |
| Multi-chip wafer level packages Grant 11,342,306 - Chen , et al. May 24, 2 | 2022-05-24 |
| Structure and formation method for chip package Grant 11,329,031 - Hung , et al. May 10, 2 | 2022-05-10 |
| Integrated Circuit Test Method And Structure Thereof App 20220028748 - Liu; Hsien-Wen ; et al. | 2022-01-27 |
| Methods of forming multi-chip wafer level packages Grant 11,189,596 - Chen , et al. November 30, 2 | 2021-11-30 |
| Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof App 20210358824 - Jeng; Shin-Puu ; et al. | 2021-11-18 |
| Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination App 20210351173 - Lin; Jing-Cheng ; et al. | 2021-11-11 |
| Package Structure App 20210335728 - LEE; Hsiao-Wen ; et al. | 2021-10-28 |
| Wafer level mold chase Grant 11,114,313 - Liu , et al. September 7, 2 | 2021-09-07 |
| Integrated circuit structure and method for reducing polymer layer delamination Grant 11,081,475 - Lin , et al. August 3, 2 | 2021-08-03 |
| Integrated fan-out package, package-on-package structure, and manufacturing method thereof Grant 11,075,132 - Jeng , et al. July 27, 2 | 2021-07-27 |
| Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate Grant 11,056,445 - Lee , et al. July 6, 2 | 2021-07-06 |
| Integrated fan-out packages Grant 10,879,162 - Jeng , et al. December 29, 2 | 2020-12-29 |
| Multi-chip Wafer Level Packages App 20200395335 - Chen; Shuo-Mao ; et al. | 2020-12-17 |
| Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing Grant 10,867,924 - Jeng , et al. December 15, 2 | 2020-12-15 |
| Wafer level package (WLP) and method for forming the same Grant 10,861,801 - Jeng , et al. December 8, 2 | 2020-12-08 |
| Structure and Formation Method for Chip Package App 20200381407 - Hung; Jui-Pin ; et al. | 2020-12-03 |
| Wafer Level Mold Chase App 20200365421 - LIU; Hsien-Wen ; et al. | 2020-11-19 |
| Methods Of Forming Multi-chip Wafer Level Packages App 20200343220 - Chen; Shuo-Mao ; et al. | 2020-10-29 |
| Multi-chip wafer level packages and methods of forming the same Grant 10,763,239 - Chen , et al. Sep | 2020-09-01 |
| Structure and formation method for chip package Grant 10,748,882 - Hung , et al. A | 2020-08-18 |
| Package Structure App 20200135661 - LEE; Hsiao-Wen ; et al. | 2020-04-30 |
| Structure And Formation Method Of Package Structure With Fan-out Structure App 20200135653 - TSAI; Po-Hao ; et al. | 2020-04-30 |
| Wafer Level Package (WLP) and Method for Forming the Same App 20200098705 - Jeng; Shin-Puu ; et al. | 2020-03-26 |
| Integrated Fan-out Packages And Methods Of Forming The Same App 20200013707 - Jeng; Shin-Puu ; et al. | 2020-01-09 |
| Package structure and method for forming the same Grant 10,529,671 - Lee , et al. J | 2020-01-07 |
| Semiconductor Package With Dual Sides Of Metal Routing App 20200006234 - Jeng; Shin-Puu ; et al. | 2020-01-02 |
| Wafer level package (WLP) and method for forming the same Grant 10,510,690 - Jeng , et al. Dec | 2019-12-17 |
| Hybrid memory system and method of operating the same Grant 10,437,499 - Lee , et al. O | 2019-10-08 |
| DRAM and method of operating the same in an hierarchical memory system Grant 10,380,024 - Lee , et al. A | 2019-08-13 |
| Using metal-containing layer to reduce carrier shock in package formation Grant 10,354,988 - Jeng , et al. July 16, 2 | 2019-07-16 |
| DRAM and method for determining binary logic using a test voltage level Grant 10,354,713 - Lee , et al. July 16, 2 | 2019-07-16 |
| Integrated fan-out packages Grant 10,347,574 - Jeng , et al. July 9, 2 | 2019-07-09 |
| System and method for preserving data in volatile memory Grant 10,338,831 - Lee , et al. | 2019-07-02 |
| Hybrid Memory System And Method Of Operating The Same App 20190196733 - LEE; CHUNG-HSUN ; et al. | 2019-06-27 |
| Dynamic Random Access Memory And Method Of Operating The Same App 20190196726 - LEE; CHUNG-HSUN ; et al. | 2019-06-27 |
| Dynamic Random Access Memory And Method Of Operating The Same App 20190196902 - LEE; CHUNG-HSUN ; et al. | 2019-06-27 |
| DRAM and method for determining binary logic using a test voltage level Grant 10,332,580 - Lee , et al. | 2019-06-25 |
| DRAM and method for operating the same Grant 10,332,579 - Lee , et al. | 2019-06-25 |
| Dram And Method Of Operating The Same App 20190171572 - LEE; CHUNG-HSUN ; et al. | 2019-06-06 |
| Dram And Method For Operating The Same App 20190164589 - Lee; Chung-Hsun ; et al. | 2019-05-30 |
| Memory device and operating method thereof Grant 10,297,304 - Lee , et al. | 2019-05-21 |
| Memory Device And Operating Method Thereof App 20190147936 - LEE; Chung-Hsun ; et al. | 2019-05-16 |
| Stacked semiconductor device and method of manufacturing the same Grant 10,290,590 - Jeng , et al. | 2019-05-14 |
| Fan-out package structure and method for forming the same Grant 10,290,605 - Jeng , et al. | 2019-05-14 |
| Multi-chip Wafer Level Packages And Methods Of Forming The Same App 20190131273 - Chen; Shuo-Mao ; et al. | 2019-05-02 |
| DRAM and method of operating the same Grant 10,276,228 - Lee , et al. | 2019-04-30 |
| Memory Device And Operating Method Thereof App 20190122747 - LEE; Chung-Hsun ; et al. | 2019-04-25 |
| Memory device and operating method thereof Grant 10,269,445 - Lee , et al. | 2019-04-23 |
| Dram And Method For Determining Binary Logic Using A Test Voltage Level App 20190115067 - LEE; Chung-Hsun ; et al. | 2019-04-18 |
| Dram And Method For Determining Binary Logic Using A Test Voltage Level App 20190115068 - LEE; Chung-Hsun ; et al. | 2019-04-18 |
| DRAM and refresh method thereof Grant 10,262,719 - Lee , et al. | 2019-04-16 |
| Integrated Fan-out Packages And Methods Of Forming The Same App 20190096791 - Jeng; Shin-Puu ; et al. | 2019-03-28 |
| DRAM memory device adjustable refresh rate method to alleviate effects of row hammer events Grant 10,236,035 - Lee , et al. | 2019-03-19 |
| Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof App 20190067144 - Jeng; Shin-Puu ; et al. | 2019-02-28 |
| System And Method For Preserving Data In Volatile Memory App 20190065079 - LEE; Chung-Hsun ; et al. | 2019-02-28 |
| Dram And Method For Operating The Same App 20190066760 - LEE; Chung-Hsun ; et al. | 2019-02-28 |
| Dram And Method For Operating The Same App 20190066765 - LEE; Chung-Hsun ; et al. | 2019-02-28 |
| System And Method For Preserving Data In Volatile Memory App 20190056874 - LEE; Chung-Hsun ; et al. | 2019-02-21 |
| Using Metal-Containing Layer to Reduce Carrier Shock in Package Formation App 20190027469 - Jeng; Shin-Puu ; et al. | 2019-01-24 |
| Semiconductor Package With Dual Sides Of Metal Routing App 20190013273 - Jeng; Shin-Puu ; et al. | 2019-01-10 |
| Fan-out Package Structure And Method For Forming The Same App 20190006314 - Jeng; Shin-Puu ; et al. | 2019-01-03 |
| Structure and Formation Method for Chip Package App 20190006332 - Hung; Jui-Pin ; et al. | 2019-01-03 |
| Wafer Level Package (WLP) and Method for Forming the Same App 20180374801 - Jeng; Shin-Puu ; et al. | 2018-12-27 |
| DRAM and method for managing power thereof Grant 10,141,043 - Lee , et al. Nov | 2018-11-27 |
| DRAM and method for operating the same Grant 10,127,967 - Lee , et al. November 13, 2 | 2018-11-13 |
| Using metal-containing layer to reduce carrier shock in package formation Grant 10,083,949 - Jeng , et al. September 25, 2 | 2018-09-25 |
| Structure and formation method for chip package Grant 10,074,637 - Hung , et al. September 11, 2 | 2018-09-11 |
| Wafer level package (WLP) and method for forming the same Grant 10,074,617 - Jeng , et al. September 11, 2 | 2018-09-11 |
| DRAM and method for managing power thereof Grant 10,049,714 - Lee , et al. August 14, 2 | 2018-08-14 |
| Dram and method for accessing a dram Grant 10,019,350 - Lee , et al. July 10, 2 | 2018-07-10 |
| Package Structure And Method For Forming The Same App 20180166396 - LEE; Hsiao-Wen ; et al. | 2018-06-14 |
| Stacked Semiconductor Device And Method Of Manufacturing The Same App 20180151512 - JENG; SHIN-PUU ; et al. | 2018-05-31 |
| Molding chamber apparatus and curing method Grant 9,950,450 - Lin , et al. April 24, 2 | 2018-04-24 |
| Using Metal-containing Layer To Reduce Carrier Shock In Package Formation App 20180033782 - Jeng; Shin-Puu ; et al. | 2018-02-01 |
| Integrated fan-out package on package structure and methods of forming same Grant 9,881,908 - Lin , et al. January 30, 2 | 2018-01-30 |
| Integrated Fan-Out Package on Package Structure and Methods of Forming Same App 20170207204 - Lin; Wen-Yi ; et al. | 2017-07-20 |
| Structure and Formation Method for Chip Package App 20170186736 - Hung; Jui-Pin ; et al. | 2017-06-29 |
| Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination App 20170170161 - Lin; Jing-Cheng ; et al. | 2017-06-15 |
| Methods for molding integrated circuits Grant 9,662,812 - Chen , et al. May 30, 2 | 2017-05-30 |
| Wafer Level Package (WLP) and Method for Forming the Same App 20170092597 - Jeng; Shin-Puu ; et al. | 2017-03-30 |
| Structure and formation method for chip package Grant 9,595,510 - Hung , et al. March 14, 2 | 2017-03-14 |
| Integrated circuit structure and method for reducing polymer layer delamination Grant 9,583,424 - Lin , et al. February 28, 2 | 2017-02-28 |
| Patch antenna and wireless communication device using the same Grant 9,531,056 - Liu , et al. December 27, 2 | 2016-12-27 |
| Wafer level package (WLP) and method for forming the same Grant 9,520,372 - Jeng , et al. December 13, 2 | 2016-12-13 |
| Multi-antenna structure Grant 9,300,034 - Chen , et al. March 29, 2 | 2016-03-29 |
| Method for forming crack stop structure Grant 9,287,221 - Huang , et al. March 15, 2 | 2016-03-15 |
| Near field antenna for object detecting device Grant 9,214,987 - Yang , et al. December 15, 2 | 2015-12-15 |
| Near Field Antenna For Object Detecting Device App 20150333804 - YANG; CHENG-MIN ; et al. | 2015-11-19 |
| Bookcase system Grant 9,144,304 - Liu , et al. September 29, 2 | 2015-09-29 |
| Patch Antenna And Wireless Communication Device Using The Same App 20150244060 - Liu; Hsien-Wen ; et al. | 2015-08-27 |
| Antenna system for mobile communication and antenna module thereof Grant 9,105,985 - Liu , et al. August 11, 2 | 2015-08-11 |
| Method for forming trench MOS structure Grant 9,093,471 - Kuo , et al. July 28, 2 | 2015-07-28 |
| Method For Forming Crack Stop Structure App 20150194390 - Huang; Tse-Yao ; et al. | 2015-07-09 |
| Vertical MOSFET electrostatic discharge device Grant 9,054,131 - Jang , et al. June 9, 2 | 2015-06-09 |
| Motor with rotor positioning component Grant 9,024,506 - Chen , et al. May 5, 2 | 2015-05-05 |
| Motor with rotor positioning component Grant 9,024,497 - Chen , et al. May 5, 2 | 2015-05-05 |
| Process of forming slit in substrate Grant 8,975,137 - Wang , et al. March 10, 2 | 2015-03-10 |
| Method For Forming Trench Mos Structure App 20150064893 - Kuo; Chin-Te ; et al. | 2015-03-05 |
| Crack stop structure and method for forming the same Grant 8,963,282 - Huang , et al. February 24, 2 | 2015-02-24 |
| Molding Chamber Apparatus and Curing Method App 20150050783 - Lin; Jing-Cheng ; et al. | 2015-02-19 |
| Antenna System For Mobile Communication And Antenna Module Thereof App 20150035708 - LIU; HSIEN-WEN ; et al. | 2015-02-05 |
| Multi-antenna Structure App 20150009092 - CHEN; Chun-Hua ; et al. | 2015-01-08 |
| Wafer scrubber Grant 8,916,003 - Jang , et al. December 23, 2 | 2014-12-23 |
| Trench MOS structure and method for forming the same Grant 8,912,595 - Kuo , et al. December 16, 2 | 2014-12-16 |
| Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination App 20140346665 - Lin; Jing-Cheng ; et al. | 2014-11-27 |
| Memory device having buried bit line and vertical transistor and fabrication method thereof Grant 8,865,550 - Wu , et al. October 21, 2 | 2014-10-21 |
| Crack stop structure and method for forming the same Grant 8,828,842 - Huang , et al. September 9, 2 | 2014-09-09 |
| MOS test structure, method for forming MOS test structure and method for performing wafer acceptance test Grant 8,816,715 - Kuo , et al. August 26, 2 | 2014-08-26 |
| Recognition system having periodic guided-wave structure Grant 8,807,429 - Liu August 19, 2 | 2014-08-19 |
| Motor With Rotor Positioning Component App 20140210319 - Chen; Chien-Jung ; et al. | 2014-07-31 |
| Memory Device Having Buried Bit Line And Vertical Transistor And Fabrication Method Thereof App 20140213027 - Wu; Tieh-Chiang ; et al. | 2014-07-31 |
| Motor With Rotor Positioning Component App 20140210295 - Chen; Chien-Jung ; et al. | 2014-07-31 |
| Fabricating method of transistor Grant 8,772,119 - Su , et al. July 8, 2 | 2014-07-08 |
| Memory device having buried bit line and vertical transistor and fabrication method thereof Grant 8,759,907 - Wu , et al. June 24, 2 | 2014-06-24 |
| Method of forming gate conductor structures Grant 8,758,984 - Wu , et al. June 24, 2 | 2014-06-24 |
| Crack Stop Structure And Method For Forming The Same App 20140154864 - Huang; Tse-Yao ; et al. | 2014-06-05 |
| Chemical mechanical polishing system Grant 8,739,806 - Liu , et al. June 3, 2 | 2014-06-03 |
| Recessed gate transistor with cylindrical fins Grant 8,723,261 - Wu , et al. May 13, 2 | 2014-05-13 |
| High-order harmonic device of cavity filter Grant 8,710,941 - Lee , et al. April 29, 2 | 2014-04-29 |
| Cavity filter having surge suppress means Grant 8,704,614 - Liu , et al. April 22, 2 | 2014-04-22 |
| Slit recess channel gate Grant 8,698,235 - Wu , et al. April 15, 2 | 2014-04-15 |
| Trench MOS structure and method for making the same Grant 8,692,318 - Kuo , et al. April 8, 2 | 2014-04-08 |
| Crack stop structure and method for forming the same Grant 8,692,245 - Huang , et al. April 8, 2 | 2014-04-08 |
| Antenna structure Grant 8,692,723 - Liu April 8, 2 | 2014-04-08 |
| Chemical mechanical polishing system Grant 8,662,963 - Liu , et al. March 4, 2 | 2014-03-04 |
| Method for forming openings in semiconductor device Grant 8,642,479 - Lin , et al. February 4, 2 | 2014-02-04 |
| Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2 | 2014-01-14 |
| Motor stator Grant 8,624,461 - Chen , et al. January 7, 2 | 2014-01-07 |
| Method of gate work function adjustment and metal gate transistor Grant 8,614,467 - Wu , et al. December 24, 2 | 2013-12-24 |
| Recognition System Having Periodic Guided-wave Structure App 20130334310 - LIU; HSIEN-WEN | 2013-12-19 |
| Circuit structure with conductive and depletion regions to form tunable capacitors and resistors Grant 8,604,542 - Jang , et al. December 10, 2 | 2013-12-10 |
| Method for forming fin-shaped semiconductor structure Grant 8,592,320 - Lin , et al. November 26, 2 | 2013-11-26 |
| Slit Recess Channel Gate App 20130307067 - Wu; Tieh-Chiang ; et al. | 2013-11-21 |
| Bookcase System App 20130292347 - LIU; HSIEN-WEN ; et al. | 2013-11-07 |
| Method of bevel trimming three dimensional semiconductor device Grant 8,551,881 - Shih , et al. October 8, 2 | 2013-10-08 |
| Semiconductor process Grant 8,546,234 - Wang , et al. October 1, 2 | 2013-10-01 |
| Distance monitoring device Grant 8,545,289 - Liao , et al. October 1, 2 | 2013-10-01 |
| Method of forming conductive pattern Grant 8,536,056 - Su , et al. September 17, 2 | 2013-09-17 |
| Method of forming a slit recess channel gate Grant 8,530,306 - Wu , et al. September 10, 2 | 2013-09-10 |
| Post-optical proximity correction photoresist pattern collapse rule Grant 8,533,638 - Fu , et al. September 10, 2 | 2013-09-10 |
| Transistor with buried fins Grant 8,525,262 - Wu , et al. September 3, 2 | 2013-09-03 |
| Methods for Molding Integrated Circuits App 20130207306 - Chen; Chih-Hao ; et al. | 2013-08-15 |
| Monitoring pattern, and pattern stitch monitoring method and wafer therewith Grant 8,497,568 - Fu , et al. July 30, 2 | 2013-07-30 |
| Method for forming self-aligned contact Grant 8,487,397 - Ho , et al. July 16, 2 | 2013-07-16 |
| Method for manufacturing memory device Grant 8,486,834 - Hsu , et al. July 16, 2 | 2013-07-16 |
| Circuit structure with vertical double gate Grant 8,476,704 - Jang , et al. July 2, 2 | 2013-07-02 |
| Bonding pad structure for semiconductor devices Grant 8,476,764 - Huang , et al. July 2, 2 | 2013-07-02 |
| Method of forming an etch mask Grant 8,470,515 - Huang , et al. June 25, 2 | 2013-06-25 |
| Post-CMP wafer cleaning apparatus Grant 8,458,842 - Liu , et al. June 11, 2 | 2013-06-11 |
| Antenna Structure App 20130141301 - LIU; HSIEN-WEN | 2013-06-06 |
| Vertical transistor for random-access memory and manufacturing method thereof Grant 8,455,319 - Lee , et al. June 4, 2 | 2013-06-04 |
| Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ; et al. | 2013-05-16 |
| Memory layout structure and memory structure Grant 8,431,933 - Lee , et al. April 30, 2 | 2013-04-30 |
| Vertical Mosfet Electrostatic Discharge Device App 20130099309 - Jang; Jeng-Hsing ; et al. | 2013-04-25 |
| Method For Fabricating Single-sided Buried Strap In A Semiconductor Device App 20130102123 - Tsai; Tzu-Ching ; et al. | 2013-04-25 |
| Method for fabricating a gate dielectric layer and for fabricating a gate structure Grant 8,420,477 - Su , et al. April 16, 2 | 2013-04-16 |
| Plasma etching method and plasma etching apparatus for preparing high-aspect-ratio structures Grant 8,420,545 - Wu , et al. April 16, 2 | 2013-04-16 |
| Method for increasing adhesion between polysilazane and silicon nitride Grant 8,420,541 - Shih , et al. April 16, 2 | 2013-04-16 |
| Molding Chamber Apparatus and Curing Method App 20130087951 - Lin; Jing-Cheng ; et al. | 2013-04-11 |
| Power device with trenched gate structure and method of fabricating the same Grant 8,415,729 - Wu , et al. April 9, 2 | 2013-04-09 |
| Motor stator Grant 8,415,852 - Chen , et al. April 9, 2 | 2013-04-09 |
| Capacitor and manufacturing method thereof Grant 8,410,535 - Su , et al. April 2, 2 | 2013-04-02 |
| Method For Forming Dope Regions With Rapid Thermal Process App 20130078774 - Jang; Jeng-Hsing ; et al. | 2013-03-28 |
| Method For Fabricating Integrated Devices With Reducted Plasma Damage App 20130078804 - JANG; Jeng-Hsing ; et al. | 2013-03-28 |
| Wafer Scrubber App 20130074878 - Jang; Jeng-Hsing ; et al. | 2013-03-28 |
| Method For Forming Semiconductor Structure With Reduced Line Edge Roughness App 20130078815 - Wu; Chang-Ming ; et al. | 2013-03-28 |
| Wafer Scrubber Apparatus App 20130068264 - Jang; Jeng-Hsing ; et al. | 2013-03-21 |
| Bonding Pad Structure For Semiconductor Devices App 20130069235 - Huang; Tse-Yao ; et al. | 2013-03-21 |
| Fabricating Method Of Transistor App 20130071978 - Su; Kuo-Hui ; et al. | 2013-03-21 |
| Semiconductor Process App 20130071992 - Su; Kuo-Hui ; et al. | 2013-03-21 |
| Method Of Forming An Etch Mask App 20130071790 - Huang; Tse-Yao ; et al. | 2013-03-21 |
| Method for manufacturing memory device Grant 8,399,321 - Hsu , et al. March 19, 2 | 2013-03-19 |
| Crack Stop Structure And Method For Forming The Same App 20130062727 - Huang; Tse-Yao ; et al. | 2013-03-14 |
| Method for obtaining a layout design for an existing integrated circuit Grant 8,394,721 - Hsieh , et al. March 12, 2 | 2013-03-12 |
| Method for via formation in a semiconductor device Grant 8,389,402 - Lin , et al. March 5, 2 | 2013-03-05 |
| Method Of Forming Conductive Pattern App 20130052820 - Su; Kuo-Hui ; et al. | 2013-02-28 |
| Circuit Structure with Resistors or Capacitors App 20130049846 - Jang; Jeng Hsing ; et al. | 2013-02-28 |
| Circuit Structure with Vertical Double Gate App 20130043529 - Jang; Jeng Hsing ; et al. | 2013-02-21 |
| Crack Stop Structure And Method For Forming The Same App 20130043470 - Huang; Tse-Yao ; et al. | 2013-02-21 |
| Method For Forming Fin-shaped Semiconductor Structure App 20130045600 - Lin; Chih-Ching ; et al. | 2013-02-21 |
| Method of reducing microloading effect Grant 8,377,632 - Lee , et al. February 19, 2 | 2013-02-19 |
| Method Of Fan Speed Control App 20130038264 - CHEN; Chien-Jung ; et al. | 2013-02-14 |
| Self-aligned method for forming contact of device with reduced step height Grant 8,367,509 - Jang , et al. February 5, 2 | 2013-02-05 |
| Method For Forming Openings In Semiconductor Device App 20130017687 - Lin; Chih-Ching ; et al. | 2013-01-17 |
| Process Of Forming Slit In Substrate App 20130017684 - Wang; Wen-Chieh ; et al. | 2013-01-17 |
| Method of inspecting memory cell Grant 8,335,119 - Tsai , et al. December 18, 2 | 2012-12-18 |
| Semiconductor Process App 20120309155 - Wang; Wen-Chieh ; et al. | 2012-12-06 |
| Method Of Reducing Striation On A Sidewall Of A Recess App 20120305525 - Lee; Hsiu-Chun ; et al. | 2012-12-06 |
| Semiconductor Process App 20120309192 - Wang; Wen-Chieh ; et al. | 2012-12-06 |
| Method For Manufacturing Memory Device App 20120302060 - Hsu; Ping ; et al. | 2012-11-29 |
| Plasma Etching Method And Plasma Etching Apparatus For Preparing High-aspect-ratio Structures App 20120302031 - Wu; Chang Ming ; et al. | 2012-11-29 |
| Method For Via Formation In A Semiconductor Device App 20120302062 - Lin; Chih Ching ; et al. | 2012-11-29 |
| Pulse-plasma Etching Method And Pulse-plasma Etching Apparatus App 20120302065 - Lin; Chih Ching ; et al. | 2012-11-29 |
| Method And System For Performing Pulse-etching In A Semiconductor Device App 20120302070 - Lin; Chih Ching ; et al. | 2012-11-29 |
| Method Of Fabricating A Deep Trench Device App 20120302030 - Lee; Hsiu-Chun ; et al. | 2012-11-29 |
| Test Layout Structure App 20120298992 - Kuo; Chin-Te ; et al. | 2012-11-29 |
| Slit Recess Channel Gate and Method of Forming the Same App 20120299185 - Wu; Tieh-Chiang ; et al. | 2012-11-29 |
| Cavity Filter Having Surge Suppress Means App 20120299668 - LIU; Hsien-Wen ; et al. | 2012-11-29 |
| Method Of Reducing Microloading Effect App 20120301833 - Lee; Hsiu-Chun ; et al. | 2012-11-29 |
| Method For Implanting Wafer App 20120302049 - Hsu; Ping ; et al. | 2012-11-29 |
| Test Key Structure For Monitoring Gate Conductor To Deep Trench Misalignment And Testing Method Thereof App 20120293196 - Hsu; Ping ; et al. | 2012-11-22 |
| Method For Manufacturing Memory Device App 20120295408 - Hsu; Ping ; et al. | 2012-11-22 |
| Post-cmp Wafer Cleaning Apparatus App 20120284936 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Method For Cleaning A Semiconductor Wafer App 20120285484 - Liu; Li-Chung ; et al. | 2012-11-15 |
| Method Of Etching Trenches In A Semiconductor Substrate Utilizing Pulsed And Fluorocarbon-free Plasma App 20120289050 - Wu; Chang-Ming ; et al. | 2012-11-15 |
| Optical Lens And Optical Microscope System Using The Same App 20120287500 - Hsieh; Ming-Teng ; et al. | 2012-11-15 |
| Method For Decapsulating Integrated Circuit Package App 20120288966 - Hsieh; Ming-Teng ; et al. | 2012-11-15 |
| Bump Structure And Fabrication Method Thereof App 20120288684 - Hsieh; Ming-Teng ; et al. | 2012-11-15 |
| Trench Mos Structure And Method For Forming The Same App 20120286353 - Kuo; Chin-Te ; et al. | 2012-11-15 |
| Mos Test Structure, Method For Forming Mos Test Structure And Method For Performing Wafer Acceptance Test App 20120286819 - Kuo; Chin-Te ; et al. | 2012-11-15 |
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| Semiconductor process Grant 8,309,459 - Wang , et al. November 13, 2 | 2012-11-13 |
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| Method for forming conductive contact Grant 8,288,279 - Ho , et al. October 16, 2 | 2012-10-16 |
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| Method Of Gate Work Function Adjustment And Metal Gate Transistor App 20120256279 - Wu; Tieh-Chiang ; et al. | 2012-10-11 |
| Semiconductor structure Grant 8,283,709 - Lee , et al. October 9, 2 | 2012-10-09 |
| Antifuse element for integrated circuit device Grant 8,278,732 - Ho , et al. October 2, 2 | 2012-10-02 |
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| Method for forming a recess array device structure in a semiconductor substrate Grant 8,178,440 - Wu , et al. May 15, 2 | 2012-05-15 |
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| Memory layout structure and memory structure App 20120012907 - Lee; Tzung-Han ; et al. | 2012-01-19 |
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| Cooling fan Grant 7,492,070 - Chen , et al. February 17, 2 | 2009-02-17 |
| Cooling fan Grant 7,443,065 - Chen , et al. October 28, 2 | 2008-10-28 |
| Nonvolatile memory solution using single-poly pFlash technology Grant 7,339,229 - Wang , et al. March 4, 2 | 2008-03-04 |
| Method for analyzing the structure of deep trench capacitors and a preparation method thereof Grant 7,329,550 - Liu , et al. February 12, 2 | 2008-02-12 |
| Cooling fan App 20070114859 - Chen; Chien-Jung ; et al. | 2007-05-24 |
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| Nonvolatile memory solution using single-poly pFlash technology App 20060244043 - Wang; Alex ; et al. | 2006-11-02 |
| Nonvolatile memory solution using single-poly pFlash technology Grant 7,078,761 - Wang , et al. July 18, 2 | 2006-07-18 |
| Method for analyzing the structure of deep trench capacitors and a preparation method thereof App 20060094132 - Liu; Hsien-Wen ; et al. | 2006-05-04 |
| Method of forming a bottle-shaped trench in a semiconductor substrate Grant 6,867,089 - Chen , et al. March 15, 2 | 2005-03-15 |
| Method to prevent electrical shorts between tungsten interconnects Grant 6,867,142 - Chen , et al. March 15, 2 | 2005-03-15 |
| Method of fabricating shallow trench isolation Grant 6,774,007 - Liu , et al. August 10, 2 | 2004-08-10 |
| Method of forming a shallow trench isolation in a semiconductor substrate Grant 6,727,159 - Chen , et al. April 27, 2 | 2004-04-27 |
| Method of forming a bottle-shaped trench in a semiconductor substrate Grant 6,716,696 - Chen , et al. April 6, 2 | 2004-04-06 |
| Method of forming a bottle-shaped trench in a semiconductor substrate Grant 6,713,341 - Chen , et al. March 30, 2 | 2004-03-30 |
| Method of fabricating shallow trench isolation App 20030201473 - Liu, Hsien-Wen ; et al. | 2003-10-30 |
| Method of forming a bottle-shaped trench in a semiconductor substrate App 20030148580 - Chen, Yi-Nan ; et al. | 2003-08-07 |
| Method of forming a bottle-shaped trench in a semiconductor substrate App 20030143855 - Chen, Yi-Nan ; et al. | 2003-07-31 |
| Method of forming a bottle-shaped trench in a semiconductor substrate App 20030143802 - Chen, Yi-Nan ; et al. | 2003-07-31 |
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