Liu; Hsien-Tsung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Hsien-Tsung.The latest application filed is for "method of metal sputtering for integrated circuit metal routing".

Company Profile

0.6.5

Liu; Hsien-Tsung - Hsin-Chu N/A TW
Liu, Hsien-Tsung - Hsin-Chu City TW
Liu; Hsien-Tsung - Keelung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of metal sputtering for integrated circuit metal routing Grant 8,723,322 - Liu , et al. May 13, 2	2014-05-13
Method of metal sputtering for integrated circuit metal routing App 20060148247 - Liu; Hsien-Tsung ; et al.	2006-07-06
Method for improving semiconductor wafer test accuracy App 20050186690 - Chen, Hui-Mei ; et al.	2005-08-25
Method of metal sputtering for integrated circuit metal routing App 20050040033 - Liu, Hsien-Tsung ; et al.	2005-02-24
Method of metal sputtering for integrated circuit metal routing Grant 6,802,945 - Liu , et al. October 12, 2	2004-10-12
Method of metal sputtering for integrated circuit metal routing App 20040129558 - Liu, Hsien-Tsung ; et al.	2004-07-08
Method of forming a bump on a copper pad Grant 6,583,039 - Chen , et al. June 24, 2	2003-06-24
Method Of Forming A Bump On A Copper Pad App 20030073300 - Chen, Yen-Ming ; et al.	2003-04-17
Method for making y-shaped multi-fin stacked capacitors for dynamic random access memory cells Grant 6,083,790 - Lin , et al. July 4, 2	2000-07-04
Tapered opening sidewall with multi-step etching process Grant 5,180,689 - Liu , et al. January 19, 1	1993-01-19

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