| Patent | Date |
|---|
Temperature sensing device and temperature sensing method
Grant 11,448,556 - Wang , et al. September 20, 2 | 2022-09-20 |
Multi-metal fill with self-aligned patterning and dielectric with voids
Grant 11,422,475 - Yang , et al. August 23, 2 | 2022-08-23 |
Interconnect structure and method for forming the same
Grant 11,302,570 - Liu April 12, 2 | 2022-04-12 |
Interconnect Structure And Manufacturing Method For The Same
App 20210391211 - LIU; HSIANG-WEI ; et al. | 2021-12-16 |
Temperature Sensing Device And Temperature Sensing Method
App 20210381904 - Wang; Ting-Hao ; et al. | 2021-12-09 |
Metal Line Structure and Method
App 20210375760 - Kao; Hsiang-Lun ; et al. | 2021-12-02 |
Interconnect structure and manufacturing method for the same
Grant 11,107,725 - Liu , et al. August 31, 2 | 2021-08-31 |
Metal line structure and method
Grant 11,101,216 - Kao , et al. August 24, 2 | 2021-08-24 |
Low-Resistance Interconnect
App 20210175119 - Huang; Hsin-Yen ; et al. | 2021-06-10 |
Metal routing with flexible space formed using self-aligned spacer patterning
Grant 10,957,580 - Liu , et al. March 23, 2 | 2021-03-23 |
Methods for fabricating a low-resistance interconnect
Grant 10,930,551 - Huang , et al. February 23, 2 | 2021-02-23 |
Interconnect Structure And Manufacturing Method For The Same
App 20210005510 - LIU; HSIANG-WEI ; et al. | 2021-01-07 |
Methods for Fabricating a Low-Resistance Interconnect
App 20200411374 - Huang; Hsin-Yen ; et al. | 2020-12-31 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20200365449 - Liu; Hsiang-Wei ; et al. | 2020-11-19 |
Hybrid copper structure for advance interconnect usage
Grant 10,818,597 - Liu , et al. October 27, 2 | 2020-10-27 |
Interconnect structure and manufacturing method for the same
Grant 10,784,151 - Liu , et al. Sept | 2020-09-22 |
Metal routing with flexible space formed using self-aligned spacer patterning
Grant 10,734,275 - Liu , et al. | 2020-08-04 |
Interconnect Structure And Method For Forming The Same
App 20200243377 - LIU; Hsiang-Wei | 2020-07-30 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20200144104 - Liu; Hsiang-Wei ; et al. | 2020-05-07 |
Multi-metal Fill With Self-aligned Patterning And Dielectric With Voids
App 20200124985 - Yang; Tai-I ; et al. | 2020-04-23 |
Interconnect Structure And Manufacturing Method For The Same
App 20200083093 - LIU; HSIANG-WEI ; et al. | 2020-03-12 |
Metal Line Structure and Method
App 20200051914 - Kao; Hsiang-Lun ; et al. | 2020-02-13 |
Multi-metal fill with self-aligned patterning and dielectric with voids
Grant 10,534,273 - Yang , et al. Ja | 2020-01-14 |
Interconnection structure of semiconductor device
Grant 10,535,560 - Chu , et al. Ja | 2020-01-14 |
Metal routing with flexible space formed using self-aligned spacer patterning
Grant 10,529,617 - Liu , et al. J | 2020-01-07 |
Split rail structures located in adjacent metal layers
Grant 10,522,469 - Wu , et al. Dec | 2019-12-31 |
Metal line structure and method
Grant 10,490,500 - Kao , et al. Nov | 2019-11-26 |
Hybrid Copper Structure For Advance Interconnect Usage
App 20190244897 - Liu; Hsiang-Wei ; et al. | 2019-08-08 |
Split Rail Structures Located In Adjacent Metal Layers
App 20190244902 - Wu; Chia-Tien ; et al. | 2019-08-08 |
Hybrid copper structure for advance interconnect usage
Grant 10,290,580 - Liu , et al. | 2019-05-14 |
Method for forming semiconductor device with damascene structure
Grant 10,276,396 - Liu , et al. | 2019-04-30 |
Split rail structures located in adjacent metal layers
Grant 10,269,715 - Wu , et al. | 2019-04-23 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20190103305 - Liu; Hsiang-Wei ; et al. | 2019-04-04 |
Method For Forming Semiconductor Device With Damascene Structure
App 20190043730 - LIU; Hsiang-Wei ; et al. | 2019-02-07 |
Structure And Formation Method Of Interconnection Structure Of Semiconductor Device
App 20190027406 - CHU; Wei-Chen ; et al. | 2019-01-24 |
2-D interconnections for integrated circuits
Grant 10,163,690 - Wu , et al. Dec | 2018-12-25 |
Split Rail Structures Located In Adjacent Metal Layers
App 20180308798 - Wu; Chia-Tien ; et al. | 2018-10-25 |
Split rail structures located in adjacent metal layers
Grant 10,020,261 - Wu , et al. July 10, 2 | 2018-07-10 |
Multi-metal Fill With Self-aligned Patterning And Dielectric With Voids
App 20180164698 - YANG; Tai-I ; et al. | 2018-06-14 |
2-d Interconnections For Integrated Circuits
App 20180151416 - WU; Chia-Tien ; et al. | 2018-05-31 |
Split Rail Structures Located In Adjacent Metal Layers
App 20180108611 - Wu; Chia-Tien ; et al. | 2018-04-19 |
Hybrid Copper Structure For Advance Interconnect Usage
App 20180090439 - Liu; Hsiang-Wei ; et al. | 2018-03-29 |
Hybrid copper structure for advance interconnect usage
Grant 9,837,354 - Liu , et al. December 5, 2 | 2017-12-05 |
Metal Line Structure and Method
App 20170162504 - Kao; Hsiang-Lun ; et al. | 2017-06-08 |
Insulator void aspect ratio tuning by selective deposition
Grant 9,607,881 - Liu , et al. March 28, 2 | 2017-03-28 |
Conductive element structure and method
Grant 9,595,471 - Yang , et al. March 14, 2 | 2017-03-14 |
Metal line structure and method
Grant 9,583,434 - Kao , et al. February 28, 2 | 2017-02-28 |
Conductive Element Structure and Method
App 20160358817 - Yang; Tai-I ; et al. | 2016-12-08 |
Conductive element structure and method
Grant 9,425,089 - Yang , et al. August 23, 2 | 2016-08-23 |
Metal Line Structure and Method
App 20160020168 - Kao; Hsiang-Lun ; et al. | 2016-01-21 |
Hybrid Copper Structure for Advance Interconnect Usage
App 20160005691 - Liu; Hsiang-Wei ; et al. | 2016-01-07 |
Conductive Element Structure And Method
App 20150380303 - Yang; Tai-I ; et al. | 2015-12-31 |
Insulator Void Aspect Ratio Tuning By Selective Deposition
App 20150371940 - Liu; Hsiang-Wei ; et al. | 2015-12-24 |
Dual mode analog to digital converter
Grant 9,219,494 - Liu , et al. December 22, 2 | 2015-12-22 |
Analog To Digital Converter
App 20150109159 - LIU; Hsiang-Wei ; et al. | 2015-04-23 |
Method of dynamic element matching and an apparatus thereof
Grant 8,779,959 - Chuang , et al. July 15, 2 | 2014-07-15 |
Container data center
Grant 8,770,679 - Liu July 8, 2 | 2014-07-08 |
Method Of Dynamic Element Matching And An Apparatus Thereof
App 20140176355 - Chuang; Wen-Hsien ; et al. | 2014-06-26 |
Container Data Center With Supporting Apparatus
App 20140054439 - LIU; HSIANG-WEI | 2014-02-27 |
Container Data Center With Supporting Apparatus
App 20140048675 - LIU; HSIANG-WEI | 2014-02-20 |
Container Data Center
App 20120326583 - LIU; HSIANG-WEI | 2012-12-27 |
Mounting Apparatus For Data Storage Device
App 20120224334 - LIU; HSIANG-WEI | 2012-09-06 |
Hard disc drive carrier
Grant 7,307,838 - Chen , et al. December 11, 2 | 2007-12-11 |
Hard disc drive carrier
App 20070041154 - Chen; Chao-Jung ; et al. | 2007-02-22 |
Server system and vibration-free extractable hard disc drive assembly thereof
Grant 6,819,556 - Chen , et al. November 16, 2 | 2004-11-16 |
Server system and vibration-free extractable hard disc drive assembly thereof
App 20040105231 - Chen, Chao-Jung ; et al. | 2004-06-03 |
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