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Patent applications and USPTO patent grants for Liu; Hsiang.The latest application filed is for "dielectric film for semiconductor fabrication".
Patent | Date |
---|---|
Dielectric Film for Semiconductor Fabrication App 20220223528 - Wu; Cheng-Yi ;   et al. | 2022-07-14 |
Dielectric film for semiconductor fabrication Grant 11,296,027 - Wu , et al. April 5, 2 | 2022-04-05 |
Dielectric film for semiconductor fabrication Grant 11,152,306 - Wu , et al. October 19, 2 | 2021-10-19 |
Semiconductor Epitaxy Bordering Isolation Structure App 20210210350 - Chen; Wen-Chin ;   et al. | 2021-07-08 |
Semiconductor epitaxy bordering isolation structure Grant 10,957,540 - Chen , et al. March 23, 2 | 2021-03-23 |
Dielectric film for semiconductor fabrication Grant 10,658,296 - Wu , et al. | 2020-05-19 |
Semiconductor Epitaxy Bordering Isolation Structure App 20200126793 - Chen; Wen-Chin ;   et al. | 2020-04-23 |
Dielectric Film for Semiconductor Fabrication App 20200083168 - Wu; Cheng-Yi ;   et al. | 2020-03-12 |
Semiconductor epitaxy bordering isolation structure Grant 10,522,353 - Chen , et al. Dec | 2019-12-31 |
Semiconductor Epitaxy Bordering Isolation Structure App 20180350601 - Chen; Wen-Chin ;   et al. | 2018-12-06 |
Semiconductor epitaxy bordering isolation structure Grant 10,147,609 - Chen , et al. De | 2018-12-04 |
Dielectric Film For Semiconductor Fabrication App 20180337128 - Wu; Cheng-Yi ;   et al. | 2018-11-22 |
Semiconductor Epitaxy Bordering Isolation Structure App 20180175196 - Chen; Wen-Chin ;   et al. | 2018-06-21 |
Dielectric Film For Semiconductor Fabrication App 20180096936 - Wu; Cheng-Yi ;   et al. | 2018-04-05 |
Method for reducing mask precipitation defects App 20060201848 - Lin; Ting-Yu ;   et al. | 2006-09-14 |
Use of WEE (wafer edge exposure) to prevent polyimide contamination Grant 5,824,457 - Liu , et al. October 20, 1 | 1998-10-20 |
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