loadpatents
name:-0.0069999694824219
name:-0.0059871673583984
name:-0.0026750564575195
Liu; Hsiang Patent Filings

Liu; Hsiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Hsiang.The latest application filed is for "dielectric film for semiconductor fabrication".

Company Profile
4.7.9
  • Liu; Hsiang - Hsinchu TW
  • Liu; Hsiang - Hsinchu City TW
  • Liu; Hsiang - Hsin-chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dielectric Film for Semiconductor Fabrication
App 20220223528 - Wu; Cheng-Yi ;   et al.
2022-07-14
Dielectric film for semiconductor fabrication
Grant 11,296,027 - Wu , et al. April 5, 2
2022-04-05
Dielectric film for semiconductor fabrication
Grant 11,152,306 - Wu , et al. October 19, 2
2021-10-19
Semiconductor Epitaxy Bordering Isolation Structure
App 20210210350 - Chen; Wen-Chin ;   et al.
2021-07-08
Semiconductor epitaxy bordering isolation structure
Grant 10,957,540 - Chen , et al. March 23, 2
2021-03-23
Dielectric film for semiconductor fabrication
Grant 10,658,296 - Wu , et al.
2020-05-19
Semiconductor Epitaxy Bordering Isolation Structure
App 20200126793 - Chen; Wen-Chin ;   et al.
2020-04-23
Dielectric Film for Semiconductor Fabrication
App 20200083168 - Wu; Cheng-Yi ;   et al.
2020-03-12
Semiconductor epitaxy bordering isolation structure
Grant 10,522,353 - Chen , et al. Dec
2019-12-31
Semiconductor Epitaxy Bordering Isolation Structure
App 20180350601 - Chen; Wen-Chin ;   et al.
2018-12-06
Semiconductor epitaxy bordering isolation structure
Grant 10,147,609 - Chen , et al. De
2018-12-04
Dielectric Film For Semiconductor Fabrication
App 20180337128 - Wu; Cheng-Yi ;   et al.
2018-11-22
Semiconductor Epitaxy Bordering Isolation Structure
App 20180175196 - Chen; Wen-Chin ;   et al.
2018-06-21
Dielectric Film For Semiconductor Fabrication
App 20180096936 - Wu; Cheng-Yi ;   et al.
2018-04-05
Method for reducing mask precipitation defects
App 20060201848 - Lin; Ting-Yu ;   et al.
2006-09-14
Use of WEE (wafer edge exposure) to prevent polyimide contamination
Grant 5,824,457 - Liu , et al. October 20, 1
1998-10-20

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