Liu; Fang Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Fang Chang.The latest application filed is for "lateral power device with reduced on-resistance".

Company Profile

2.18.19

Liu; Fang Chang - Hsinchu TW
Liu; Fang Chang - Hsinchu City TW
Liu; Fang-Chang - Toufen Township TW
Liu; Fang Chang - Taiwan TW
LIU; Fang-Chang - Miaoli County TW
Liu; Fang-Chang - Tamtzu Hsiang TW
Liu; Fang-Chang - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lateral power device with reduced on-resistance Grant 11,101,349 - Liao , et al. August 24, 2	2021-08-24
Lateral Power Device With Reduced On-resistance App 20200075726 - Liao; Wen-Chia ; et al.	2020-03-05
GaN transistors with polysilicon layers used for creating additional components Grant 10,312,260 - Cao , et al.	2019-06-04
GaN transistors with polysilicon layers used for creating additional components Grant 9,837,438 - Cao , et al. December 5, 2	2017-12-05
GaN TRANSISTORS WITH POLYSILICON LAYERS USED FOR CREATING ADDITIONAL COMPONENTS App 20170330898 - Cao; Jianjun ; et al.	2017-11-16
Integrated circuit with matching threshold voltages and method for making same Grant 9,583,480 - Cao , et al. February 28, 2	2017-02-28
GaN device with reduced output capacitance and process for making same Grant 9,331,191 - Colino , et al. May 3, 2	2016-05-03
Integrated Circuit With Matching Threshold Voltages And Method For Making Same App 20160111416 - Cao; Jianjun ; et al.	2016-04-21
Gan Transistors With Polysilicon Layers Used For Creating Additional Components App 20160086980 - Cao; Jianjun ; et al.	2016-03-24
GaN transistors with polysilicon layers for creating additional components Grant 9,214,461 - Cao , et al. December 15, 2	2015-12-15
Method to fabricate self-aligned isolation in gallium nitride devices and integrated circuits Grant 9,214,528 - Zhou , et al. December 15, 2	2015-12-15
Integrated circuit with matching threshold voltages and method for making same Grant 9,214,399 - Cao , et al. December 15, 2	2015-12-15
Isolation structure in gallium nitride devices and integrated circuits Grant 9,171,911 - Zhou , et al. October 27, 2	2015-10-27
Integrated Circuit With Matching Threshold Voltages And Method For Making Same App 20150034962 - Cao; Jianjun ; et al.	2015-02-05
GaN DEVICE WITH REDUCED OUTPUT CAPACITANCE AND PROCESS FOR MAKING SAME App 20150028390 - Colino; Stephen L. ; et al.	2015-01-29
GaN TRANSISTORS WITH POLYSILICON LAYERS FOR CREATING ADDITIONAL COMPONENTS App 20150028384 - Cao; Jianjun ; et al.	2015-01-29
Method To Fabricate Self-aligned Isolation In Gallium Nitride Devices And Integrated Circuits App 20150011057 - Zhou; Chunhua ; et al.	2015-01-08
Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same Grant 8,823,012 - Lidow , et al. September 2, 2	2014-09-02
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Grant 8,361,898 - Wang , et al. January 29, 2	2013-01-29
ENHANCEMENT MODE GaN HEMT DEVICE WITH GATE SPACER AND METHOD FOR FABRICATING THE SAME App 20120175631 - Lidow; Alexander ; et al.	2012-07-12
Light-emiting Device With Improved Color Rendering Index App 20110291132 - LIU; Fang-Chang ; et al.	2011-12-01
Method of fabricating isolation structures for CMOS image sensor chip scale packages Grant 7,833,810 - Lin , et al. November 16, 2	2010-11-16
Method for fabricating package structures for optoelectronic devices Grant 7,824,964 - Wang , et al. November 2, 2	2010-11-02
Bonding Pad Structure For Back Illuminated Optoelectronic Device And Fabricating Method Thereof App 20100127408 - WANG; Kai-Chih ; et al.	2010-05-27
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Grant 7,679,187 - Wang , et al. March 16, 2	2010-03-16
Isolation Structures For Cmos Image Sensor Chip Scale Packages App 20090263927 - LIN; Tzu-Han ; et al.	2009-10-22
Isolation structures for CMOS image sensor chip scale packages Grant 7,569,409 - Lin , et al. August 4, 2	2009-08-04
Package structure for optoelectronic device and fabrication method thereof Grant 7,566,944 - Wang , et al. July 28, 2	2009-07-28
Method For Fabricating Package Structures For Optoelectronic Devices App 20090186449 - WANG; Kai-Chih ; et al.	2009-07-23
Package structure for optoelectronic device App 20090026562 - Wang; Kai-Chih ; et al.	2009-01-29
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof App 20080169117 - Wang; Kai-Chih ; et al.	2008-07-17
Package structure for optoelectronic device and fabrication method thereof App 20080169477 - Wang; Kai-Chih ; et al.	2008-07-17
Isolation structures for CMOS image sensor chip scale packages App 20080164553 - Lin; Tzu-Han ; et al.	2008-07-10
Circumferential air conditioning fan App 20070092375 - Liu; Fang-Chang	2007-04-26
Stack-type image sensor module App 20060289733 - Zung; Peter ; et al.	2006-12-28

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