Liu; Dana
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Dana.The latest application filed is for "saw type package without exposed pad".
- Liu; Dana - Shanghai N/A CN
- Liu, Dana - Hsin-Tien City TW
| Patent | Date |
|---|---|
| Power package including multiple semiconductor devices Grant 8,399,997 - Zhang , et al. March 19, 2 | 2013-03-19 |
| Power Package Including Multiple Semiconductor Devices App 20120313232 - Zhang; Jiangyuan ; et al. | 2012-12-13 |
| Thin Power Package App 20120315727 - Zhang; Jiangyuan ; et al. | 2012-12-13 |
| Saw Type Package without Exposed Pad App 20120315728 - Lee; Elite ; et al. | 2012-12-13 |
| Rotatable mechanism of removable computer peripheral device App 20040100761 - Liu, Dana | 2004-05-27 |
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