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Semiconductor package
Grant 11,450,626 - Chen , et al. September 20, 2 | 2022-09-20 |
Inductive Device
App 20220231116 - CHOU; Wei-Yu ; et al. | 2022-07-21 |
Dual Micro-electro Mechanical System And Manufacturing Method Thereof
App 20220194783 - CHEN; Yang-Che ; et al. | 2022-06-23 |
Inductive device
Grant 11,322,576 - Chou , et al. May 3, 2 | 2022-05-03 |
Dual micro-electro mechanical system and manufacturing method thereof
Grant 11,274,037 - Chen , et al. March 15, 2 | 2022-03-15 |
Semiconductor Package
App 20220068845 - Chen; Yang-Che ; et al. | 2022-03-03 |
Inductive Device
App 20220037458 - CHOU; Wei-Yu ; et al. | 2022-02-03 |
Method For Detecting Defects In Semiconductor Device
App 20210366794 - CHEN; YANG-CHE ; et al. | 2021-11-25 |
Semiconductor device having probe pads and seal ring
Grant 11,088,037 - Chen , et al. August 10, 2 | 2021-08-10 |
Semiconductor Package And Method For Making The Same
App 20210202329 - CHEN; Yang-Che ; et al. | 2021-07-01 |
Dual Micro-electro Mechanical System And Manufacturing Method Thereof
App 20210130167 - CHEN; Yang-Che ; et al. | 2021-05-06 |
Method for manufacturing semiconductor and structure thereof
Grant 10,937,858 - Chen , et al. March 2, 2 | 2021-03-02 |
Semiconductor package and method for manufacturing the same
Grant 10,937,772 - Chen , et al. March 2, 2 | 2021-03-02 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20200402892 - CHEN; YANG-CHE ; et al. | 2020-12-24 |
Semiconductor Package And Method For Manufacturing The Same
App 20200381409 - CHEN; YANG-CHE ; et al. | 2020-12-03 |
Method For Manufacturing Semiconductor And Structure Thereof
App 20200251552 - Kind Code | 2020-08-06 |
Method of detecting delamination in an integrated circuit package structure
Grant 10,699,977 - Chen , et al. | 2020-06-30 |
Semiconductor Device With Enhanced Thermal Dissipation And Method For Making The Same
App 20200135613 - CHEN; Yang-Che ; et al. | 2020-04-30 |
Method for manufacturing semiconductor and structure thereof
Grant 10,629,673 - Chen , et al. | 2020-04-21 |
Method For Manufacturing Semiconductor And Structure Thereof
App 20200098851 - CHEN; YANG-CHE ; et al. | 2020-03-26 |
Semiconductor Device And Manufacturing Method Of The Same
App 20200075435 - CHEN; YANG-CHE ; et al. | 2020-03-05 |
Method Of Detecting Delamination In An Integrated Circuit Package Structure
App 20190333829 - CHEN; Yang-Che ; et al. | 2019-10-31 |
Integrated circuit package structure and testing method using the same
Grant 10,347,548 - Chen , et al. July 9, 2 | 2019-07-09 |
Integrated Circuit Package Structure And Testing Method Using The Same
App 20180156865 - Chen; Yang-Che ; et al. | 2018-06-07 |
ARC layer enhancement for reducing metal loss during via etch
Grant 6,005,277 - Liu , et al. December 21, 1 | 1999-12-21 |
Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structures
Grant 5,962,867 - Liu October 5, 1 | 1999-10-05 |
Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structures
Grant 5,736,863 - Liu April 7, 1 | 1998-04-07 |
Method of making tapered poly profile for TFT device manufacturing
Grant 5,393,682 - Liu February 28, 1 | 1995-02-28 |
Method of eliminating degradation of a multilayer metallurgy/insulator structure of a VLSI integrated circuit
Grant 5,254,497 - Liu October 19, 1 | 1993-10-19 |
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