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Patent applications and USPTO patent grants for Liu; Ching-Wei.The latest application filed is for "sensor package structure and production apparatus for manufacturing the same".
Patent | Date |
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Production apparatus for manufacturing sensor package structure Grant 9,287,306 - Hsu , et al. March 15, 2 | 2016-03-15 |
Sensor Package Structure And Production Apparatus For Manufacturing The Same App 20150053849 - HSU; CHI-HSING ;   et al. | 2015-02-26 |
Thin-type collapsible foot stand Grant 8,876,070 - Liu , et al. November 4, 2 | 2014-11-04 |
Sliding mechanism and electronic device using the same Grant 8,693,114 - Liu April 8, 2 | 2014-04-08 |
Sliding Mechanism And Electronic Device Using The Same App 20130279028 - LIU; CHING-WEI | 2013-10-24 |
Thin-type Collapsible Foot Stand App 20130256492 - LIU; CHING-WEI ;   et al. | 2013-10-03 |
Method of Synthesizing 6,7-Substituted 4-Anilino Quinazoline App 20100267949 - Shih; Kae-Shyang ;   et al. | 2010-10-21 |
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