Liu; Chien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liu; Chien.The latest application filed is for "ordering of color-forming layers in a direct thermal printing medium".
Company Profile
0.36.49
Trademarks
- Liu; Chien - Wayland MA
- Liu; Chien - Pingtung County TW
- Liu; Chien - Kaohsiung TW
- Liu; Chien - Kaohsiung County TW
- Liu; Chien - Kaohsiung City TW
- Liu; Chien - Kaoshiung TW
- Liu; Chien - Kao-Hsiung City TW
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Ordering Of Color-forming Layers In A Direct Thermal Printing Medium App 20210402818 - Busch; Brian D. ; et al. | 2021-12-30 |
| Three-dimensional non-volatile memory structure and manufacturing method thereof Grant 9,837,435 - Chang , et al. December 5, 2 | 2017-12-05 |
| Multicolor Thermal Imaging Method And Thermal Printer App 20140187418 - Busch; Brian D. ; et al. | 2014-07-03 |
| Print head pulsing techniques for multicolor printers Grant 8,610,750 - Liu , et al. December 17, 2 | 2013-12-17 |
| Print Head Pulsing Techniques For Multicolor Printers App 20130286135 - Liu; Chien ; et al. | 2013-10-31 |
| Optical disc with thermally-printable surface Grant 8,557,361 - Hardin , et al. October 15, 2 | 2013-10-15 |
| Print head pulsing techniques for multicolor printers Grant 8,502,846 - Liu , et al. August 6, 2 | 2013-08-06 |
| Multicolor thermal imaging method and thermal printer Grant 8,502,848 - Busch , et al. August 6, 2 | 2013-08-06 |
| Circuit carrier and semiconductor package using the same Grant 8,384,204 - Liu , et al. February 26, 2 | 2013-02-26 |
| Imaging system Grant 8,372,782 - Vetterling , et al. February 12, 2 | 2013-02-12 |
| Print Head Pulsing Techniques For Multicolor Printers App 20120176459 - Liu; Chien ; et al. | 2012-07-12 |
| Multicolor Thermal Imaging Method And Thermal Printer App 20120169824 - Busch; Brian D. ; et al. | 2012-07-05 |
| Print head pulsing techniques for multicolor printers Grant 8,164,609 - Liu , et al. April 24, 2 | 2012-04-24 |
| Print Head Pulsing Techniques For Multicolor Printers App 20120075401 - Busch; Brian D. ; et al. | 2012-03-29 |
| Print head pulsing techniques for multicolor printers Grant 8,098,269 - Busch , et al. January 17, 2 | 2012-01-17 |
| Multicolor thermal imaging method and thermal printer Grant 8,068,126 - Busch , et al. November 29, 2 | 2011-11-29 |
| Optical Disc With Thermally Printable-surface App 20110189424 - HARDIN; Yulin ; et al. | 2011-08-04 |
| Semiconductor package and method for manufacturing the same Grant 7,902,650 - Hu , et al. March 8, 2 | 2011-03-08 |
| Print Head Pulsing Techniques For Multicolor Printers App 20110050830 - Liu; Chien ; et al. | 2011-03-03 |
| Print Head Pulsing Techniques For Multicolor Printers App 20110050829 - Busch; Brian ; et al. | 2011-03-03 |
| Multicolor Thermal Imaging Method And Thermal Printer App 20110018950 - Busch; Brian D. ; et al. | 2011-01-27 |
| Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame Grant 7,834,469 - Chuang , et al. November 16, 2 | 2010-11-16 |
| Print head pulsing techniques for multicolor printers Grant 7,830,405 - Liu , et al. November 9, 2 | 2010-11-09 |
| Multicolor thermal imaging method and thermal imaging member for use therein Grant 7,820,370 - Busch , et al. October 26, 2 | 2010-10-26 |
| Package structure and manufacturing method thereof Grant 7,816,773 - Liu October 19, 2 | 2010-10-19 |
| Print head pulsing techniques for multicolor printers Grant 7,791,626 - Busch , et al. September 7, 2 | 2010-09-07 |
| Circuit Carrier And Semiconductor Package Using The Same App 20100213598 - Liu; Chien ; et al. | 2010-08-26 |
| Multicolor thermal imaging method and thermal printer Grant 7,768,540 - Busch , et al. August 3, 2 | 2010-08-03 |
| Manufacturing Method For Package Structure App 20100184255 - LIU; Chien ; et al. | 2010-07-22 |
| Imaging System App 20100099556 - Vetterling; William T. ; et al. | 2010-04-22 |
| Imaging System App 20100016154 - CHU; Peter K. ; et al. | 2010-01-21 |
| Thermal imaging system Grant 7,635,660 - Bhatt , et al. December 22, 2 | 2009-12-22 |
| Semiconductor Package And Method For Manufacturing The Same App 20090289338 - HU; Chia Chien ; et al. | 2009-11-26 |
| Semiconductor Package And Method For Manufacturing The Same App 20090289339 - HU; Chia Chien ; et al. | 2009-11-26 |
| Stacked Type Chip Package Structure App 20090278242 - Chuang; Yao-Kai ; et al. | 2009-11-12 |
| Stacked Type Chip Package Structure And Method For Fabricating The Same App 20090278243 - Chuang; Yao-Kai ; et al. | 2009-11-12 |
| Integrated Circuit Package And Manufacturing Method Thereof App 20090267210 - CHUANG; Yao-Kai ; et al. | 2009-10-29 |
| Multicolor Thermal Imaging Method And Thermal Imaging Member For Use Therein App 20090096833 - BUSCH; Brian D. ; et al. | 2009-04-16 |
| Imaging system Grant 7,504,360 - Chu , et al. March 17, 2 | 2009-03-17 |
| Package structure and manufacturing method thereof App 20080283984 - Liu; Chien | 2008-11-20 |
| Multicolor Thermal Imaging Method And Thermal Printer App 20080266373 - Busch; Brian D. ; et al. | 2008-10-30 |
| Print Head Pulsing Techniques For Multicolor Printers App 20080238967 - Busch; Brian ; et al. | 2008-10-02 |
| Method for making flip chip on leadframe package Grant 7,425,468 - Wang , et al. September 16, 2 | 2008-09-16 |
| Multicolor thermal imaging method and thermal printer Grant 7,408,563 - Busch , et al. August 5, 2 | 2008-08-05 |
| Flip Chip Package With Anti-floating Structure App 20080179739 - Liu; Chien ; et al. | 2008-07-31 |
| Flip chip package with anti-floating structure Grant 7,368,806 - Liu , et al. May 6, 2 | 2008-05-06 |
| Semiconductor package with a flip chip on a solder-resist leadframe Grant 7,253,508 - Liu , et al. August 7, 2 | 2007-08-07 |
| Method for making flip chip on leadframe package App 20070172981 - Wang; Meng-Jen ; et al. | 2007-07-26 |
| Package Structure And Method For Manufacturing The Same App 20070166881 - LIU; Chien | 2007-07-19 |
| Imaging system App 20070123421 - Chu; Peter K. ; et al. | 2007-05-31 |
| Flip-chip Integrated Circuit Packaging Method App 20070108626 - Liu; Chien ; et al. | 2007-05-17 |
| Thermal printing head with two-dimensional array of resistive heating elements, and method for printing using same App 20070103538 - Busch; Brian D. ; et al. | 2007-05-10 |
| Imaging system Grant 7,176,161 - Chu , et al. February 13, 2 | 2007-02-13 |
| Thermal imaging system Grant 7,166,558 - Bhatt , et al. January 23, 2 | 2007-01-23 |
| Quad flat flip chip package and leadframe thereof Grant 7,164,202 - Wang , et al. January 16, 2 | 2007-01-16 |
| Print head pulsing techniques for multicolor printers App 20060290769 - Liu; Chien ; et al. | 2006-12-28 |
| Multicolor thermal imaging method and thermal printer App 20060292502 - Busch; Brian D. ; et al. | 2006-12-28 |
| Packaging method and package using the same App 20060281223 - Liu; Chien ; et al. | 2006-12-14 |
| Thermal imaging system App 20060270552 - Bhatt; Jayprakash C. ; et al. | 2006-11-30 |
| Chip package structure and method for manufacturing the same App 20060244115 - Liu; Chien ; et al. | 2006-11-02 |
| Multicolor thermal imaging method and thermal imaging member for use therein App 20060232642 - Busch; Brian D. ; et al. | 2006-10-19 |
| Flip-chip type quad flat package and leadframe Grant 7,067,904 - Wang , et al. June 27, 2 | 2006-06-27 |
| Flip chip package with anti-floating structure App 20060125113 - Liu; Chien ; et al. | 2006-06-15 |
| Assembly process App 20060105502 - Liu; Chien ; et al. | 2006-05-18 |
| Processing method during a package process App 20060084199 - Liu; Chien ; et al. | 2006-04-20 |
| Wafer Level Process for Manufacturing Leadframes and Device from the Same App 20060084202 - Liu; Chien ; et al. | 2006-04-20 |
| Quad flat flip chip packaging process and leadframe therefor Grant 7,022,551 - Wang , et al. April 4, 2 | 2006-04-04 |
| Method for bonding flip chip on leadframe App 20060051894 - Liu; Chien ; et al. | 2006-03-09 |
| Package structure with a heat spreader and manufacturing method thereof Grant 6,967,403 - Chuang , et al. November 22, 2 | 2005-11-22 |
| Quad Flat Flip Chip Package And Leadframe Thereof App 20050156296 - Wang, Hsueh-Te ; et al. | 2005-07-21 |
| Semiconductor package with a flip chip on a solder-resist leadframe App 20050133896 - Liu, Chien ; et al. | 2005-06-23 |
| Thermal imaging system Grant 6,906,735 - Bhatt , et al. June 14, 2 | 2005-06-14 |
| Flip-chip type quad flat package and leadframe App 20050104167 - Wang, Hsueh-Te ; et al. | 2005-05-19 |
| Quad flat flip chip packaging process and leadframe therefor App 20050101053 - Wang, Hsueh-Te ; et al. | 2005-05-12 |
| Thermal imaging system App 20050052521 - Bhatt, Jayprakash C. ; et al. | 2005-03-10 |
| Pakage structure with a heat spreader and manufacturing method thereof App 20040256643 - Chuang, Chi-Ta ; et al. | 2004-12-23 |
| Thermal imaging system Grant 6,801,233 - Bhatt , et al. October 5, 2 | 2004-10-05 |
| Thermal imaging system App 20040180284 - Bhatt, Jayprakash C. ; et al. | 2004-09-16 |
| Imaging system App 20040176248 - Chu, Peter K. ; et al. | 2004-09-09 |
| Thermal imaging system App 20030125206 - Bhatt, Jayprakash C. ; et al. | 2003-07-03 |
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