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Patent applications and USPTO patent grants for Liu; Cheng-Chia.The latest application filed is for "power supply device of reduced complexity accepting power through wye and delta configurations".
Patent | Date |
---|---|
Power supply device of reduced complexity accepting power through wye and delta configurations Grant 11,218,092 - Liu , et al. January 4, 2 | 2022-01-04 |
Power Supply Device Of Reduced Complexity Accepting Power Through Wye And Delta Configurations App 20200366219 - Liu; Cheng-Chia ;   et al. | 2020-11-19 |
Semiconductor Device And Method For Fabricating The Same App 20200006517 - Li; Yi-Fan ;   et al. | 2020-01-02 |
Method of Forming a Semiconductor Device App 20180269107 - Sun; Yat-Kai ;   et al. | 2018-09-20 |
Method of forming a semiconductor device Grant 10,079,180 - Sun , et al. September 18, 2 | 2018-09-18 |
Structure of slide-block module of a plastic pallet shaping mold Grant 8,758,007 - Liu June 24, 2 | 2014-06-24 |
Structure Of Slide-block Module Of A Plastic Pallet Shaping Mold App 20130202731 - LIU; Cheng-Chia | 2013-08-08 |
Combination shelving Grant 5,695,205 - Liu December 9, 1 | 1997-12-09 |
Drawer type storage bin Grant 5,680,957 - Liu October 28, 1 | 1997-10-28 |
Stackable pallet Grant 5,341,748 - Liu August 30, 1 | 1994-08-30 |
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