Liu Cheng Cheng
USPTO Trademark & Patent Filings
Trademark applications and grants for Liu Cheng Cheng. Liu Cheng Cheng has 1 trademark applications. The latest application filed is for "AOBEAU JIA"
- Company Aliases
- Liu cheng cheng
- cheng cheng liu
- Liu; Cheng-cheng - Kaohsiung City TW
- Liu; Cheng-Cheng - Kaohsiung TW
- Liu; Cheng-Cheng - Kaoshiung TW
- Liu, Cheng-Cheng - Douliou City TW
- Liu, Cheng-Cheng - Tao-Yuan Hsien TW
- Liu; Cheng-cheng - Kaohsiung TW
- Liu; Cheng-Cheng - Douliou TW
Trademarks Patents
| Patent Application | Date |
|---|---|
| HEAT SLUG FOR PACKAGE STRUCTURE 20080048304 - 11/834863 Liu; Cheng-cheng ; et al. | 2008-02-28 |
| Heatsink and heatsink-positioning system 20070240848 - 11/514878 Liu; Jun-Cheng ; et al. | 2007-10-18 |
| BGA package having substrate with exhaust hole 20060103021 - 11/272740 Liu; Cheng-Cheng ; et al. | 2006-05-18 |
| Multi-chip package combining wire-bonding and flip-chip configuration 20040195700 - 10/781876 Liu, Cheng-Cheng | 2004-10-07 |
| Impedance matching circuit for rejecting an image signal via a microstrip structure 20030160662 - 10/065290 Chang, Sheng-Fuh ; et al. | 2003-08-28 |
| Heatsink and heatsink-positioning system 8,800,638 - 11/514,878 Liu , et al. August 12, 2 | 2014-08-12 |
| Heatsink and heatsink-positioning system 8,800,638 - 11/514,878 Liu , et al. August 12, 2 | 2014-08-12 |
| Heat slug for package structure 7,763,959 - 11/834,863 Liu , et al. July 27, 2 | 2010-07-27 |
| Multi-chip package combining wire-bonding and flip-chip configuration 7,081,678 - 10/781,876 Liu July 25, 2 | 2006-07-25 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"AOBEAU JIA" 5589762 87833116 |
AOBEAU JIA 2018-03-14 |
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