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name:-0.0097529888153076
name:-0.0079300403594971
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Liu; Chen-Hsun Patent Filings

Liu; Chen-Hsun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Chen-Hsun.The latest application filed is for "semiconductor structure".

Company Profile
8.7.8
  • Liu; Chen-Hsun - Tainan City TW
  • Liu; Chen-Hsun - Tainan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Structure
App 20220254737 - Wang; Rung-De ;   et al.
2022-08-11
Semiconductor structure
Grant 11,348,879 - Wang , et al. May 31, 2
2022-05-31
Semiconductor Structure
App 20210013159 - Wang; Rung-De ;   et al.
2021-01-14
Conductive External Connector Structure and Method of Forming
App 20200373267 - Shih; Meng-Fu ;   et al.
2020-11-26
Manufacturing method of semiconductor structure
Grant 10,818,612 - Wang , et al. October 27, 2
2020-10-27
Conductive external connector structure and method of forming
Grant 10,741,513 - Shih , et al. A
2020-08-11
Manufacturing Method Of Semiconductor Structure
App 20190371741 - Wang; Rung-De ;   et al.
2019-12-05
Conductive External Connector Structure and Method of Forming
App 20190131263 - Shih; Meng-Fu ;   et al.
2019-05-02
Semiconductor Structure And Manufacturing Method Thereof
App 20190131251 - Wang; Rung-De ;   et al.
2019-05-02
Semiconductor structure and manufacturing method thereof
Grant 10,276,514 - Wang , et al.
2019-04-30
Conductive external connector structure and method of forming
Grant 10,163,836 - Shih , et al. Dec
2018-12-25
Conductive External Connector Structure and Method of Forming
App 20180166409 - Shih; Meng-Fu ;   et al.
2018-06-14
Conductive external connector structure and method of forming
Grant 9,875,979 - Shih , et al. January 23, 2
2018-01-23
Semicondcutor structure and semiconductor manufacturing process thereof
Grant 9,837,366 - Liu , et al. December 5, 2
2017-12-05
Conductive External Connector Structure and Method of Forming
App 20170141059 - Shih; Meng-Fu ;   et al.
2017-05-18

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