loadpatents
Patent applications and USPTO patent grants for Lischka; David J..The latest application filed is for "polishing system with contactless platen edge control".
Patent | Date |
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Polishing System With Contactless Platen Edge Control App 20220266413 - Lischka; David J. ;   et al. | 2022-08-25 |
Platen Assembly And Method Of Assembling A Platen Assembly App 20200101576 - GURUSAMY; Jay ;   et al. | 2020-04-02 |
Method Of Identifying And Tracking Roll To Roll Polishing Pad Materials During Processing App 20190030677 - OH; Jeonghoon ;   et al. | 2019-01-31 |
Peak-based endpointing for chemical mechanical polishing Grant 9,799,578 - Benvegnu , et al. October 24, 2 | 2017-10-24 |
Peak-based Endpointing For Chemical Mechanical Polishing App 20170092551 - Benvegnu; Dominic J. ;   et al. | 2017-03-30 |
Peak-based endpointing for chemical mechanical polishing Grant 9,564,377 - Benvegnu , et al. February 7, 2 | 2017-02-07 |
Path for probe of spectrographic metrology system Grant 9,056,383 - David , et al. June 16, 2 | 2015-06-16 |
Methods and apparatus for sensing a substrate in a load cup Grant 9,013,176 - Lischka , et al. April 21, 2 | 2015-04-21 |
Path For Probe Of Spectrographic Metrology System App 20140242879 - David; Jeffrey Drue ;   et al. | 2014-08-28 |
Determination Of Wafer Angular Position For In-sequence Metrology App 20140242883 - Cherian; Benjamin ;   et al. | 2014-08-28 |
Peak-based Endpointing For Chemical Mechanical Polishing App 20140080232 - Benvegnu; Dominic J. ;   et al. | 2014-03-20 |
Peak-based endpointing for chemical mechanical polishing Grant 8,591,698 - Benvegnu , et al. November 26, 2 | 2013-11-26 |
Methods And Apparatus For Sensing A Substrate In A Load Cup App 20130193956 - Lischka; David J. ;   et al. | 2013-08-01 |
Reducing polishing pad deformation Grant 8,287,330 - Bennett , et al. October 16, 2 | 2012-10-16 |
Peak-based Endpointing For Chemical Mechanical Polishing App 20110287694 - Benvegnu; Dominic J. ;   et al. | 2011-11-24 |
Peak-based endpointing for chemical mechanical polishing Grant 7,998,358 - Benvegnu , et al. August 16, 2 | 2011-08-16 |
Reducing polishing pad deformation Grant 7,621,798 - Bennett , et al. November 24, 2 | 2009-11-24 |
Peak-based Endpointing For Chemical Mechanical Polishing App 20080099443 - Benvegnu; Dominic J. ;   et al. | 2008-05-01 |
Sealed polishing pad, system and methods Grant 7,210,980 - Swedek , et al. May 1, 2 | 2007-05-01 |
Sealed Polishing Pad, System And Methods App 20070049167 - Swedek; Bogdan ;   et al. | 2007-03-01 |
System with sealed polishing pad Grant 7,163,437 - Swedek , et al. January 16, 2 | 2007-01-16 |
Sealed polishing pad methods Grant 7,112,119 - Swedek , et al. September 26, 2 | 2006-09-26 |
Load cup for chemical mechanical polishing Grant 7,044,832 - Yilmaz , et al. May 16, 2 | 2006-05-16 |
Load cup for chemical mechanical polishing App 20050176349 - Yilmaz, Alpay ;   et al. | 2005-08-11 |
Conditioning mechanism for chemical mechanical polishing Grant 6,905,399 - Lischka June 14, 2 | 2005-06-14 |
Conditioning mechanism for chemical mechanical polishing App 20040203326 - Lischka, David J. | 2004-10-14 |
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