loadpatents
name:-0.013776063919067
name:-0.015012979507446
name:-0.0024499893188477
Lischka; David J. Patent Filings

Lischka; David J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lischka; David J..The latest application filed is for "polishing system with contactless platen edge control".

Company Profile
2.15.14
  • Lischka; David J. - Austin TX
  • Lischka; David J. - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polishing System With Contactless Platen Edge Control
App 20220266413 - Lischka; David J. ;   et al.
2022-08-25
Platen Assembly And Method Of Assembling A Platen Assembly
App 20200101576 - GURUSAMY; Jay ;   et al.
2020-04-02
Method Of Identifying And Tracking Roll To Roll Polishing Pad Materials During Processing
App 20190030677 - OH; Jeonghoon ;   et al.
2019-01-31
Peak-based endpointing for chemical mechanical polishing
Grant 9,799,578 - Benvegnu , et al. October 24, 2
2017-10-24
Peak-based Endpointing For Chemical Mechanical Polishing
App 20170092551 - Benvegnu; Dominic J. ;   et al.
2017-03-30
Peak-based endpointing for chemical mechanical polishing
Grant 9,564,377 - Benvegnu , et al. February 7, 2
2017-02-07
Path for probe of spectrographic metrology system
Grant 9,056,383 - David , et al. June 16, 2
2015-06-16
Methods and apparatus for sensing a substrate in a load cup
Grant 9,013,176 - Lischka , et al. April 21, 2
2015-04-21
Path For Probe Of Spectrographic Metrology System
App 20140242879 - David; Jeffrey Drue ;   et al.
2014-08-28
Determination Of Wafer Angular Position For In-sequence Metrology
App 20140242883 - Cherian; Benjamin ;   et al.
2014-08-28
Peak-based Endpointing For Chemical Mechanical Polishing
App 20140080232 - Benvegnu; Dominic J. ;   et al.
2014-03-20
Peak-based endpointing for chemical mechanical polishing
Grant 8,591,698 - Benvegnu , et al. November 26, 2
2013-11-26
Methods And Apparatus For Sensing A Substrate In A Load Cup
App 20130193956 - Lischka; David J. ;   et al.
2013-08-01
Reducing polishing pad deformation
Grant 8,287,330 - Bennett , et al. October 16, 2
2012-10-16
Peak-based Endpointing For Chemical Mechanical Polishing
App 20110287694 - Benvegnu; Dominic J. ;   et al.
2011-11-24
Peak-based endpointing for chemical mechanical polishing
Grant 7,998,358 - Benvegnu , et al. August 16, 2
2011-08-16
Reducing polishing pad deformation
Grant 7,621,798 - Bennett , et al. November 24, 2
2009-11-24
Peak-based Endpointing For Chemical Mechanical Polishing
App 20080099443 - Benvegnu; Dominic J. ;   et al.
2008-05-01
Sealed polishing pad, system and methods
Grant 7,210,980 - Swedek , et al. May 1, 2
2007-05-01
Sealed Polishing Pad, System And Methods
App 20070049167 - Swedek; Bogdan ;   et al.
2007-03-01
System with sealed polishing pad
Grant 7,163,437 - Swedek , et al. January 16, 2
2007-01-16
Sealed polishing pad methods
Grant 7,112,119 - Swedek , et al. September 26, 2
2006-09-26
Load cup for chemical mechanical polishing
Grant 7,044,832 - Yilmaz , et al. May 16, 2
2006-05-16
Load cup for chemical mechanical polishing
App 20050176349 - Yilmaz, Alpay ;   et al.
2005-08-11
Conditioning mechanism for chemical mechanical polishing
Grant 6,905,399 - Lischka June 14, 2
2005-06-14
Conditioning mechanism for chemical mechanical polishing
App 20040203326 - Lischka, David J.
2004-10-14

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