Lipschutz; Lewis D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lipschutz; Lewis D..The latest application filed is for "bonding method".
- Lipschutz; Lewis D. - Poughkeepsie NY
| Patent | Date |
|---|---|
| Bonding method Grant 4,805,831 - Lipschutz February 21, 1 | 1989-02-21 |
| Flexible thermal conduction element for cooling semiconductor devices Grant 4,498,530 - Lipschutz February 12, 1 | 1985-02-12 |
| Telescoping thermal conduction element for semiconductor devices Grant 4,483,389 - Balderes , et al. November 20, 1 | 1984-11-20 |
| Cooling element for solder bonded semiconductor devices Grant 4,442,450 - Lipschutz , et al. April 10, 1 | 1984-04-10 |
| Thermocompression Bonding Apparatus Grant 3,580,460 - Lipschutz May 25, 1 | 1971-05-25 |
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