loadpatents
name:-0.018935918807983
name:-0.009505033493042
name:-0.00040507316589355
Liou; Shing-Tza Patent Filings

Liou; Shing-Tza

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liou; Shing-Tza.The latest application filed is for "method of manufacturing fpcb substrate".

Company Profile
0.10.17
  • Liou; Shing-Tza - Taoyuan N/A TW
  • Liou; Shing-Tza - Tayuan TW
  • Liou, Shing-Tza - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of manufacturing FPCB substrate
Grant 8,453,324 - Liu , et al. June 4, 2
2013-06-04
Method for manufacturing a printed circuit board
Grant 8,205,330 - Zhang , et al. June 26, 2
2012-06-26
Flexible printed circuit boards including carbon nanotube bundles
Grant 8,164,000 - Yeh , et al. April 24, 2
2012-04-24
Method Of Manufacturing Fpcb Substrate
App 20120066903 - LIU; RUI-WU ;   et al.
2012-03-22
Printed circuit board and method for manufacturing same
Grant 8,071,887 - Liou , et al. December 6, 2
2011-12-06
Method of manufacturing multilayer printed circuit board having buried holes
Grant 8,052,881 - Zhu , et al. November 8, 2
2011-11-08
Electroplating method
Grant 7,998,332 - Liou , et al. August 16, 2
2011-08-16
Stiffener sheet and flexible printed circuit board using the same
Grant 7,985,482 - Lai , et al. July 26, 2
2011-07-26
Printed circuit board assembly having adhesive layer
Grant 7,728,232 - Huang , et al. June 1, 2
2010-06-01
Method Of Forming Circuits On Circuit Board
App 20090246357 - Liou; Shing-Tza ;   et al.
2009-10-01
Printed Circuit Board And Method For Manufacturing Same
App 20090242246 - LIOU; SHING-TZA ;   et al.
2009-10-01
Method For Forming Solder Lumps On Printed Circuit Board Substrate
App 20090217520 - HUANG; FENG-YAN ;   et al.
2009-09-03
Stiffener Sheet And Flexible Printed Circuit Board Using The Same
App 20090205855 - LAI; YUNG-WEI ;   et al.
2009-08-20
Method For Forming Circuit In Making Printed Circuit Board
App 20090178276 - LAI; YUNG-WEI ;   et al.
2009-07-16
Stiffener And Strengthened Flexible Printed Circuit Board Having The Same
App 20090176080 - Lai; Yung-Wei ;   et al.
2009-07-09
Stiffener And Strengthened Flexible Printed Circuit Board Having The Same
App 20090166063 - LAI; YUNG-WEI ;   et al.
2009-07-02
Method Of Manufacturing Multilayer Printed Circuit Board Having Buried Holes
App 20090159559 - ZHU; YUN-LI ;   et al.
2009-06-25
Printed Circuit Board And Method For Manufacturing The Same
App 20090159317 - ZHANG; QI ;   et al.
2009-06-25
Electroplating Method
App 20090159452 - LIOU; SHING-TZA ;   et al.
2009-06-25
Fpcb Substrate And Method Of Manufacturing The Same
App 20090120671 - Liu; Rui-Wu ;   et al.
2009-05-14
Flexible printed circuit board
Grant 7,511,962 - Hou , et al. March 31, 2
2009-03-31
Flexible Printed Circuit Board Substrate And Flexible Printed Circuit Board Fabricated Using The Same
App 20090038828 - HOU; NING ;   et al.
2009-02-12
Adhesive Layer And Printed Circuit Board Assembly Having The Same
App 20090035566 - HUANG; FENG-YAN ;   et al.
2009-02-05
Flexible Printed Circuit Board Base Film, Flexible Laminates And Flexible Printed Circuit Boards Including Same
App 20090032290 - YEH; TSO-HUNG ;   et al.
2009-02-05
Flexible Printed Circuit Board
App 20080285241 - HOU; NING ;   et al.
2008-11-20
Positive photosensitive composition and method of pattern formation using the same
App 20040126693 - Wang, Shih-Fan ;   et al.
2004-07-01

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