| Patent | Date |
|---|
Plasma Enhanced Deposited, Fully Oxidized PSG Film
App 20070187803 - Pentas; Katie H. ; et al. | 2007-08-16 |
Method for forming plasma enhanced deposited, fully oxidized PSG film
Grant 7,223,706 - Pentas , et al. May 29, 2 | 2007-05-29 |
Method of manufacturing a plated electronic termination
Grant 7,174,626 - Kwoka , et al. February 13, 2 | 2007-02-13 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone
Grant 7,052,973 - Linn , et al. May 30, 2 | 2006-05-30 |
Plasma enhanced deposited, fully oxidized PSG film
App 20060001127 - Pentas; Katie H. ; et al. | 2006-01-05 |
Bonded wafer with metal silicidation
Grant 6,909,146 - Linn , et al. June 21, 2 | 2005-06-21 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone
Grant 6,825,532 - Linn , et al. November 30, 2 | 2004-11-30 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone
App 20040180512 - Linn, Jack H. ; et al. | 2004-09-16 |
Sc-2 Based Pre-thermal Treatment Wafer Cleaning Process
App 20020189640 - LINN, JACK H. ; et al. | 2002-12-19 |
Process For Depositing And Planarizing Bpsg For Dense Trench Mosfet Application
App 20020119639 - Ridley, Rodney S. ; et al. | 2002-08-29 |
Method Of Manufacturing A Plated Electronic Termination
App 20020029473 - KWOKA, MARK A. ; et al. | 2002-03-14 |
Power trench transistor device source region formation using silicon spacer
App 20010022379 - Brush, Linda S. ; et al. | 2001-09-20 |
Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
App 20010016399 - Linn, Jack H. ; et al. | 2001-08-23 |
Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
Grant 6,255,195 - Linn , et al. July 3, 2 | 2001-07-03 |
Power trench transistor device source region formation using silicon spacer
Grant 6,246,090 - Brush , et al. June 12, 2 | 2001-06-12 |
SC-2 based pre-thermal treatment wafer cleaning process
Grant 5,932,022 - Linn , et al. August 3, 1 | 1999-08-03 |
Bonded wafer processing with oxidative bonding
Grant 5,849,627 - Linn , et al. December 15, 1 | 1998-12-15 |
Method for cleaning semiconductor wafers to improve dice to substrate solderability
Grant 5,833,758 - Linn , et al. November 10, 1 | 1998-11-10 |
Bonded wafer
Grant 5,744,852 - Linn , et al. April 28, 1 | 1998-04-28 |
Bonded wafer processing
Grant 5,728,624 - Linn , et al. March 17, 1 | 1998-03-17 |
Integrated circuit with diamond insulator
Grant 5,650,639 - Schrantz , et al. July 22, 1 | 1997-07-22 |
Bonded wafer and method of fabrication thereof
Grant 5,603,779 - Linn , et al. February 18, 1 | 1997-02-18 |
Bonded wafer processing with metal silicidation
Grant 5,569,620 - Linn , et al. October 29, 1 | 1996-10-29 |
Die separation method for silicon on diamond circuit structures
Grant 5,552,345 - Schrantz , et al. September 3, 1 | 1996-09-03 |
Direct etch for thin film resistor using a hard mask
Grant 5,547,896 - Linn , et al. August 20, 1 | 1996-08-20 |
Bonded wafer processing
Grant 5,517,047 - Linn , et al. May 14, 1 | 1996-05-14 |
Plasma cleaning method for improved ink brand permanency on IC packages with metallic parts
Grant 5,451,263 - Linn , et al. September 19, 1 | 1995-09-19 |
Methods for forming a transistor having an emitter with enhanced efficiency
Grant 5,395,774 - Bajor , et al. March 7, 1 | 1995-03-07 |
Bonded wafer processing with metal silicidation
Grant 5,387,555 - Linn , et al. February 7, 1 | 1995-02-07 |
Bonded wafer processing
Grant 5,362,667 - Linn , et al. November 8, 1 | 1994-11-08 |
Bonded wafer process incorporating diamond insulator
Grant 5,272,104 - Schrantz , et al. December 21, 1 | 1993-12-21 |
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