Link; Lauren Ashley
Patent Applications and Registrations
Patent applications and USPTO patent grants for Link; Lauren Ashley.The latest application filed is for "asymmetric cored integrated circuit package supports".
- Link; Lauren Ashley - Mesa AZ
- Link; Lauren Ashley - Tempe AZ
| Patent | Date |
|---|---|
| Magnetic structures in integrated circuit packages Grant 11,444,042 - Brown , et al. September 13, 2 | 2022-09-13 |
| Package substrate having polymer-derived ceramic core Grant 11,075,130 - Chen , et al. July 27, 2 | 2021-07-27 |
| Asymmetric Cored Integrated Circuit Package Supports App 20200168536 - Link; Lauren Ashley ; et al. | 2020-05-28 |
| Package Substrate Having Polymer-derived Ceramic Core App 20190393109 - CHEN; Lisa Ying Ying ; et al. | 2019-12-26 |
| Magnetic Structures In Integrated Circuit Packages App 20190371744 - Brown; Andrew James ; et al. | 2019-12-05 |
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