LINGSEN PRECISION INDUSTRIES, LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for LINGSEN PRECISION INDUSTRIES, LTD..The latest application filed is for "chip packaging method".
Company Profile
10.59.89
- LINGSEN PRECISION INDUSTRIES, LTD. - Taichung City TW
- LINGSEN PRECISION INDUSTRIES, LTD. - Taichung TW
- LINGSEN PRECISION INDUSTRIES, LTD - Taichung TW
- Lingsen Precision Industries, Ltd - Taichung City TW
- Lingsen Precision Industries Ltd. - T.E.P.Z. Taichung TW
- Lingsen Precision Industries, Ltd. - T.E.P.Z. TW
Patent Activity
| Patent | Date |
|---|---|
| Chip Packaging Method App 20220148887 - TU; Ming-Te | 2022-05-12 |
| Pressure sensor package Grant 11,041,774 - Tu , et al. June 22, 2 | 2021-06-22 |
| Waterproof MEMS chip package structure Grant 10,696,543 - Tien , et al. June 30, 2 | 2020-06-30 |
| Microelectromechanical Microphone Package Structure App 20200109044 - YU; Chao-Wei ; et al. | 2020-04-09 |
| Chip Package Structure Having Function Of Preventing Adhesive From Overflowing App 20200105636 - CHEN; Wei-Jen ; et al. | 2020-04-02 |
| Pressure Sensor Package App 20190265118 - TU; Ming-Te ; et al. | 2019-08-29 |
| Package structure of long-distance sensor and packaging method of the same Grant 10,396,234 - Lin , et al. A | 2019-08-27 |
| MEMS microphone package Grant 10,362,406 - Yeh , et al. | 2019-07-23 |
| MEMS microphone package Grant 10,362,377 - Liao , et al. | 2019-07-23 |
| Substrate And Package Module Including The Same App 20190198406 - CHEN; Yu-Shiang ; et al. | 2019-06-27 |
| Substrate and package module including the same Grant 10,312,169 - Chen , et al. | 2019-06-04 |
| MEMS microphone package Grant 10,299,046 - Liao , et al. | 2019-05-21 |
| Packaging method of long-distance sensor Grant 10,103,286 - Lin , et al. October 16, 2 | 2018-10-16 |
| Package structure of long-distance sensor and packaging method of the same Grant 10,090,427 - Lin , et al. October 2, 2 | 2018-10-02 |
| Package Structure Of Long-distance Sensor And Packaging Method Of The Same App 20180190856 - LIN; Ching-I ; et al. | 2018-07-05 |
| Package Structure Of Long-distance Sensor And Packaging Method Of The Same App 20180190858 - Lin; Ching-I ; et al. | 2018-07-05 |
| Packaging Method Of Long-distance Sensor App 20180190857 - LIN; Ching-I ; et al. | 2018-07-05 |
| Package Structure Of Optical Module App 20180190630 - TU; Ming-Te ; et al. | 2018-07-05 |
| Microphone package structure Grant 10,003,874 - Yeh , et al. June 19, 2 | 2018-06-19 |
| Optical sensing module and method of manufacturing the same Grant 9,952,089 - Tu , et al. April 24, 2 | 2018-04-24 |
| Mems Microphone Package App 20180063615 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063645 - YEH; Yao-Ting ; et al. | 2018-03-01 |
| Microphone Package Structure App 20180063614 - YEH; Yao-Ting ; et al. | 2018-03-01 |
| Microelectromechanical Microphone Package Structure App 20180063616 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063646 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Optical module integrated package Grant 9,905,548 - Tu , et al. February 27, 2 | 2018-02-27 |
| Package structure of an optical module Grant 9,705,025 - Tu , et al. July 11, 2 | 2017-07-11 |
| Package structure of optical module having printed shielding layer and its method for packaging Grant 9,647,178 - Tu , et al. May 9, 2 | 2017-05-09 |
| Pressure sensor package Grant 9,618,415 - Tu , et al. April 11, 2 | 2017-04-11 |
| Chip stack structure using conductive film bridge adhesive technology Grant 9,553,073 - Liao , et al. January 24, 2 | 2017-01-24 |
| Optical Module Integrated Package App 20160365339 - TU; Ming-Te ; et al. | 2016-12-15 |
| Optical module package and its packaging method Grant 9,478,693 - Tu , et al. October 25, 2 | 2016-10-25 |
| Optical module integrated package Grant 9,449,955 - Tu , et al. September 20, 2 | 2016-09-20 |
| LED lamp strip and manufacturing process thereof Grant 9,416,930 - Tu , et al. August 16, 2 | 2016-08-16 |
| Flip-chip Mems Microphone App 20160157024 - LIAO; Hsien-Ken ; et al. | 2016-06-02 |
| Optical Module Package And Its Packaging Method App 20160126403 - TU; Ming-Te ; et al. | 2016-05-05 |
| Pressure Sensor Package App 20160116359 - TU; Ming-Te ; et al. | 2016-04-28 |
| MEMS microphone packaging method Grant 9,309,108 - Liao , et al. April 12, 2 | 2016-04-12 |
| Micro optical package structure with filtration layer and method for making the same Grant 9,312,402 - Tu , et al. April 12, 2 | 2016-04-12 |
| Quad-flat Non-lead Package Structure And Method Of Packaging The Same App 20160093556 - TU; Ming-Te ; et al. | 2016-03-31 |
| Optical Sensing Module And Method Of Manufacturing The Same App 20160091364 - TU; Ming-Te ; et al. | 2016-03-31 |
| Stacked Mems Microphone Packaging Method App 20160052780 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Mems Microphone Packaging Method App 20160052779 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Stacked MEMS microphone packaging method Grant 9,260,298 - Liao , et al. February 16, 2 | 2016-02-16 |
| Method for packaging an optical module Grant 9,190,398 - Tu , et al. November 17, 2 | 2015-11-17 |
| Optical Module Integrated Package App 20150279827 - TU; Ming-Te ; et al. | 2015-10-01 |
| Quad-flat No-leads Package Structure And Method Of Manufacturing The Same App 20150279796 - TU; Ming-Te ; et al. | 2015-10-01 |
| Optical Module With Optical Concentration Structure And Packaging Method Thereof App 20150279826 - TU; Ming-Te ; et al. | 2015-10-01 |
| Copper Clad Laminate Having Barrier Structure And Method Of Manufacturing The Same App 20150255423 - LIN; Tzu-Chih ; et al. | 2015-09-10 |
| Copper Clad Laminate Having Barrier Structure And Method Of Manufacturing The Same App 20150206852 - LIN; Tzu-Chih ; et al. | 2015-07-23 |
| Gas Sensor Having Micro-package Structure And Method For Making The Same App 20150185148 - LIN; Tzu-Chih ; et al. | 2015-07-02 |
| Chip Stack Structure Using Conductive Film Bridge Adhesive Technology App 20150187735 - LIAO; Chien-Ko ; et al. | 2015-07-02 |
| Micro Optical Package Structure With Filtration Layer And Method For Making The Same App 20150187963 - TU; Ming-Te ; et al. | 2015-07-02 |
| Gas sensor having micro-package structure and method for making the same Grant 9,063,084 - Lin , et al. June 23, 2 | 2015-06-23 |
| Led Package And Manufacturing Process Of Same App 20150144982 - CHEN; Wei-Jen | 2015-05-28 |
| Package Structure Of Optical Module App 20150111324 - TU; Ming-Te ; et al. | 2015-04-23 |
| Package Structure Of Optical Module App 20150091024 - TU; Ming-Te ; et al. | 2015-04-02 |
| LED package and manufacturing process of same Grant 8,980,659 - Chen March 17, 2 | 2015-03-17 |
| Led Package And Manufacturing Process Of Same App 20150069435 - CHEN; Wei-Jen | 2015-03-12 |
| Chip Package, Chip Package Module Based On The Chip Package, And Method Of Manufacturing The Chip Package App 20150069626 - CHEN; Wei-Jen | 2015-03-12 |
| Package Structure Of Optical Module App 20150028371 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of An Optical Module App 20150028359 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of Optical Module App 20150028360 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of Optical Module App 20150028378 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of An Optical Module App 20150028357 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of An Optical Module App 20150028358 - TU; Ming-Te ; et al. | 2015-01-29 |
| Quad Flat Non-lead Package App 20140299978 - LIAO; Mu-Tsan | 2014-10-09 |
| Led Lamp Strip And Manufacturing Process Thereof App 20140126209 - TU; Ming-Te ; et al. | 2014-05-08 |
| LED lamp strip and manufacturing process thereof Grant 8,664,045 - Tu , et al. March 4, 2 | 2014-03-04 |
| Optical module package unit Grant 8,362,496 - Tu , et al. January 29, 2 | 2013-01-29 |
| Microelectromechanical microphone carrier module Grant 8,254,619 - Yeh , et al. August 28, 2 | 2012-08-28 |
| Pre-molded support mount of lead frame-type for LED light module Grant 8,247,821 - Liao August 21, 2 | 2012-08-21 |
| Cap for MEMS package Grant 8,238,107 - Yeh , et al. August 7, 2 | 2012-08-07 |
| Microelectromechanical Microphone Carrier Module App 20110293119 - YEH; Jen-Chuan ; et al. | 2011-12-01 |
| Pre-molded Support Mount Of Lead Frame-type For Led Light Module App 20110241039 - LIAO; Mu-Tsan | 2011-10-06 |
| Lead frame for quad flat no-lead package Grant 8,027,153 - Chung September 27, 2 | 2011-09-27 |
| Mems Module Package App 20110180924 - TIAN; Jyong-Yue ; et al. | 2011-07-28 |
| Cap For Mems Package App 20110174532 - YEH; Jen-Chuan ; et al. | 2011-07-21 |
| Package structure of a microphone Grant 7,884,467 - Huang , et al. February 8, 2 | 2011-02-08 |
| Lead frame for quad flat no-lead package App 20100165596 - Chung; Feng-Chun | 2010-07-01 |
| Lead Frame App 20100127368 - CHUNG; Feng-Chun | 2010-05-27 |
| Microelectromechanical System Microphone Package App 20100096711 - TIAN; Jyong-Yue | 2010-04-22 |
| Flip-chip Process By Photo-curing Adhesive App 20090286355 - YEH; Chung-Mao | 2009-11-19 |
| Method Of Stacking Dies For Die Stack Package App 20090239339 - YEH; Chung-Mao ; et al. | 2009-09-24 |
| Ic Package Having Reduced Thickness App 20090236712 - YEH; Chung-Mao ; et al. | 2009-09-24 |
| Ic Packaging Process App 20090239341 - YEH; Chung-Mao | 2009-09-24 |
| Ic Packaging Process By Photo-curing Adhesive App 20090186450 - Yeh; Chung-Mao | 2009-07-23 |
| Ic Packaging Process App 20090181499 - YEH; Chung-Mao | 2009-07-16 |
| Package For Mems Microphone App 20090180655 - TIEN; Jiung-Yue ; et al. | 2009-07-16 |
| Method Of Arranging Stacked Chip By Photo-curing Adhesive App 20090178758 - Yeh; Chung-Mao | 2009-07-16 |
| Method Of Forming Passage Through Substrate For Mems Module App 20090020500 - TIEN; Chiung-Yueh ; et al. | 2009-01-22 |
| Photosensitive Chip Package App 20080251869 - YEN; Tzu-Yin | 2008-10-16 |
| Cap Package For Micro Electro-mechanical System Capable Of Minimizing Electro-magnetic Interference App 20080164602 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| Chip Package Capable Of Minimizing Electro-magnetic Interference App 20080164583 - Tien; Jiung-Yue ; et al. | 2008-07-10 |
| Cap Package For Micro Electro-mechanical System App 20080164594 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| MEMS module package App 20080122073 - Yen; Tzu-Yin | 2008-05-29 |
| Micro Electro-mechanical System Module Package Capable Of Minimizing Interference Of Noises App 20080079141 - Tien; Jiung-Yue ; et al. | 2008-04-03 |
| Photosensitive Chip Molding Package App 20080061393 - YEN; Tzu-Yin | 2008-03-13 |
| Photo-sensitive Chip Module Package App 20080061392 - YEN; Tzu-Yin | 2008-03-13 |
| Micro electro-mechanical system module package App 20080061409 - Yen; Tzu-Yin ; et al. | 2008-03-13 |
| Substrate for IC package Grant 7,242,083 - Yang July 10, 2 | 2007-07-10 |
| Substrate for IC package Grant 7,154,169 - Yang December 26, 2 | 2006-12-26 |
| Lead frame having contacting pins of different thickness App 20060249819 - Yang; Hsin-Chen | 2006-11-09 |
| Substrate for IC package App 20060220200 - Yang; Hsin-Chen | 2006-10-05 |
| Substrate for IC package App 20060220219 - Yang; Hsin-Chen | 2006-10-05 |
| Packaging substrate having adhesive-overflowing prevention structure App 20060221586 - Yang; Hsin-Chen | 2006-10-05 |
| Method of making substrate for integrated circuit App 20060223240 - Yang; Hsin-Chen | 2006-10-05 |
| LED package and the process making the same Grant 6,921,926 - Hsu July 26, 2 | 2005-07-26 |
| Integrated circuit chip packaging process App 20050104251 - Liu, Ming Hsiung | 2005-05-19 |
| LED package and the process making the same Grant 6,770,498 - Hsu August 3, 2 | 2004-08-03 |
| LED package and the process making the same App 20040000727 - Hsu, Cheng-Hsiang | 2004-01-01 |
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